Izindaba
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Ukuchayeka
Ukuchayeka kusho ukuthi ngaphansi kwemisebe yokukhanya kwe-ultraviolet, i-photoinitiator imunca amandla okukhanya bese ibola ibe ama-radicals mahhala, bese ama-free radicals aqalise i-photopolymerization monomer ukwenza i-polymerization kanye nokuhlanganisa ukusabela. Ukuchayeka kuvame ukuthwala...Funda kabanzi -
Buyini ubudlelwano phakathi kwezintambo ze-PCB, ngembobo namandla okuthwala amanje?
Ukuxhumana kukagesi phakathi kwezingxenye ku-PCBA kufinyelelwa ngocingo lwe-foil yethusi kanye nezimbobo kusendlalelo ngasinye. Ukuxhumana kukagesi phakathi kwezingxenye ku-PCBA kufinyelelwa ngocingo lwe-foil yethusi kanye nezimbobo kusendlalelo ngasinye. Ngenxa yemikhiqizo ehlukene...Funda kabanzi -
Ukwethulwa komsebenzi wesendlalelo ngasinye sebhodi lesifunda le-PCB elinezingqimba eziningi
Amabhodi wesekethe we-multilayer aqukethe izinhlobo eziningi zezendlalelo ezisebenzayo, njengalezi: isendlalelo esivikelayo, isendlalelo sesikrini sikasilika, isendlalelo sesignali, isendlalelo sangaphakathi, njll. Kungakanani okwaziyo ngalezi zendlalelo? Imisebenzi yesendlalelo ngasinye ihlukile, ake sibheke ukuthi iyiphi imisebenzi yezinga ngalinye ...Funda kabanzi -
Isingeniso kanye nezinzuzo kanye nokubi kwebhodi le-ceramic PCB
1. Kungani kusetshenziswa amabhodi esifunda se-ceramic I-PCB evamile ngokuvamile yenziwa nge-foil yethusi kanye ne-substrate bonding, futhi i-substrate material ikakhulukazi i-glass fiber (FR-4), i-phenolic resin (FR-3) nezinye izinto, i-adhesive ngokuvamile i-phenolic, i-epoxy. , njll. Enqubweni yokucubungula i-PCB ngenxa yengcindezi yokushisa...Funda kabanzi -
I-infrared + i-hot air reflow soldering
Maphakathi nawo-1990s, kwakunomkhuba wokudlulisela ekushisiseni kwe-infrared + hot air ekufakweni kwe-reflow soldering e-Japan. Ishisisa ngama-30% emisebe ye-infrared kanye no-70% womoya oshisayo njengesithwali sokushisa. I-ovini ye-infrared hot reflow oven ihlanganisa ngempumelelo izinzuzo zokugeleza kabusha kwe-infrared kanye ne-convection ephoqelelwe yomoya oshisayo ...Funda kabanzi -
Iyini i-PCBA processing?
Ukucutshungulwa kwe-PCBA kuwumkhiqizo oqediwe webhodi elingenalutho le-PCB ngemva kwesichibi se-SMT, i-plug-in ye-DIP kanye nokuhlolwa kwe-PCBA, ukuhlolwa kwekhwalithi nenqubo yokuhlanganisa, okubizwa ngokuthi i-PCBA. Iqembu eliphathisayo iletha iphrojekthi yokucubungula efekthri yokucubungula ye-PCBA, bese ilinda umkhiqizo oqediwe...Funda kabanzi -
Etching
Inqubo yokuqopha ibhodi le-PCB, esebenzisa izinqubo zokuhlanganisa amakhemikhali zendabuko ukugqwala izindawo ezingavikelekile. Kufana nokumba umsele, indlela esebenzayo kodwa engasebenzi kahle. Enqubweni ye-etching, iphinde ihlukaniswe ibe inqubo yefilimu enhle kanye nenqubo yefilimu engalungile. Inqubo yefilimu enhle...Funda kabanzi -
Umbiko weMakethe Yomhlaba Wonke Ophrintiwe we-Circuit Board 2022
Abadlali abakhulu emakethe yebhodi lesifunda ephrintiwe yiTTM Technologies, Nippon Mektron Ltd., Samsung Electro-Mechanics, Unimicron Technology Corporation, Advanced Circuits, Tripod Technology Corporation, DAEDUCK ELECTRONICS Co.Ltd., Flex Ltd., Eltek Ltd, kanye neSumitomo Electric Industries. . Igloba...Funda kabanzi -
1. Iphakheji ye-DIP
Iphakheji le-DIP (Iphakheji Eliphakathi Kwe-Dual In-line), eyaziwa nangokuthi ubuchwepheshe bokupakisha okukabili emgqeni, isho ama-chips esekethe ahlanganisiwe apakishwa ngendlela ekabili emgqeni. Inombolo ngokuvamile ayidluli ku-100. I-chip ye-CPU ehlanganisiwe ye-DIP inemigqa emibili yamaphini adinga ukufakwa kusokhethi ye-chip nge...Funda kabanzi -
Umehluko Phakathi kwe-FR-4 Material kanye ne-Rogers Material
1. Okubalulekile kwe-FR-4 ishibhile kunempahla ye-Rogers 2. Okubalulekile kwe-Rogers kunemvamisa ephezulu uma kuqhathaniswa nokokusebenza kwe-FR-4. 3. I-Df noma i-disipation factor ye-FR-4 iphakeme kunaleyo yezinto ze-Rogers, futhi ukulahlekelwa kwesignali kukhulu. 4. Mayelana nokuzinza kwe-impedance, ibanga lenani lika-Dkt...Funda kabanzi -
Kungani udinga ikhava ngegolide le-PCB?
1. I-Surface ye-PCB: I-OSP, i-HASL, i-HASL engenamthofu, i-Immersion Tin, i-ENIG, i-Immersion Silver, i-hard gold plating, Ukucwenga igolide lebhodi lonke, umunwe wegolide, i-ENEPIG... OSP: izindleko eziphansi, ukudayiswa okuhle, izimo ezinzima zokugcina, isikhathi esifushane, ubuchwepheshe bezemvelo, ukushisela okuhle, bushelelezi… HASL: imvamisa kuba m...Funda kabanzi -
I-Organic Antioxidant (OSP)
Izikhathi ezisebenzayo: Kulinganiselwa ukuthi cishe ama-25% -30% ama-PCB asebenzisa inqubo ye-OSP njengamanje, futhi ingxenye ibilokhu ikhuphuka (kungenzeka ukuthi inqubo ye-OSP manje seyedlule ithini lokufutha futhi ibeka kuqala). Inqubo ye-OSP ingasetshenziswa kuma-PCB anobuchwepheshe obuphansi noma ama-PCB zobuchwepheshe obuphezulu, njenge-single-si...Funda kabanzi
