Ingxoxo ngenqubo yokugcwalisa imbobo ye-PCB ye-electroplating

Usayizi wemikhiqizo ye-elekthronikhi uya uba mncane futhi ube mncane, futhi ukunqwabelanisa ngokuqondile nge-vias eyimpumputhe kuyindlela yokuklama yokuxhumanisa okuphezulu. Ukwenza umsebenzi omuhle wokupakisha izimbobo, okokuqala, ukugcwala phansi komgodi kufanele kwenziwe kahle. Kunezindlela eziningana zokukhiqiza, futhi inqubo yokugcwalisa imbobo ye-electroplating ingenye yabameleli.
1. Izinzuzo ze-electroplating nokugcwalisa imbobo:
(1) Ihambisana nokuklanywa kwezimbobo ezimboziwe nezimbobo epuletini;
(2) Thuthukisa ukusebenza kukagesi futhi usize ukuklama kwefrikhwensi ephezulu;
(3) isiza ekuqedeni ukushisa;
(4) Imbobo yepulaki kanye nokuxhumana kukagesi kuqedwa ngesinyathelo esisodwa;
(5) Imbobo eyimpumputhe igcwele ithusi elenziwe nge-electroplated, elinokwethenjelwa okuphezulu kanye ne-conductivity engcono kune-adhesive conductive.
 
2. Imingcele yethonya lomzimba
Amapharamitha angokwenyama adinga ukufundwa ahlanganisa: uhlobo lwe-anode, ibanga phakathi kwe-cathode ne-anode, ukuminyana kwamanje, ukuyaluza, izinga lokushisa, i-rectifier kanye ne-waveform, njll.
(1) Uhlobo lwe-anode. Uma kuziwa ohlotsheni lwe-anode, akuyona into engaphezu kwe-anode encibilikayo kanye ne-anode engancibiliki. Ama-anode ancibilikayo ngokuvamile amabhola ethusi ane-phosphorus, athambekele ekubeni nodaka lwe-anode, angcolise isixazululo se-plating, futhi athinte ukusebenza kwesisombululo sokucwenga. I-anode engancibilikiyo, ukuzinza okuhle, asikho isidingo sokugcinwa kwe-anode, akukho sizukulwane sodaka se-anode, esilungele i-pulse noma i-DC electroplating; kodwa ukusetshenziswa kwezithasiselo kukhulu uma kuqhathaniswa.
(2) Isikhala se-Cathode ne-anode. Ukuklanywa kwesikhala phakathi kwe-cathode kanye ne-anode kwinqubo yokugcwalisa imbobo ye-electroplating kubaluleke kakhulu, futhi ukuklama kwezinhlobo ezahlukene zemishini nakho kuhlukile. Kungakhathaliseki ukuthi iklanywe kanjani, akufanele iphule umthetho wokuqala kaFarah.
(3) Gxuma. Kunezinhlobo eziningi zokunyakazisa, okuhlanganisa ukushwibeka kwemishini, ukudlidliza kukagesi, ukudlidliza kwe-pneumatic, ukunyakazisa komoya, ukugeleza kwejethi nokunye.
Ukuze kugcwaliswe imbobo ye-electroplating, ngokuvamile kukhethwa ukwengeza umklamo wejethi ngokusekelwe ekucushweni kwesilinda sethusi sendabuko. Inombolo, isikhala kanye ne-angle yejethi ku-jet tube yizo zonke izici okufanele zicatshangelwe ekwakhiweni kwe-cylinder yethusi, futhi inani elikhulu lokuhlolwa kufanele kwenziwe.
(4) Ukuminyana kwamanje nezinga lokushisa. Ukuminyana okuphansi kwamanje kanye nezinga lokushisa eliphansi kunganciphisa izinga lokubeka ithusi endaweni, kuyilapho kuhlinzeka nge-Cu2 eyanele kanye nokukhanyisa ezimbotsheni. Ngaphansi kwalesi simo, ikhono lokugcwalisa imbobo liyathuthukiswa, kodwa ukusebenza kahle kwe-plating nakho kuyancipha.
(5) Umlungisi. I-rectifier iyisixhumanisi esibalulekile kunqubo ye-electroplating. Njengamanje, ucwaningo lokugcwaliswa kwembobo nge-electroplating lukhawulelwe kakhulu ku-electroplating egcwele ibhodi. Uma ukugcwaliswa kwembobo yephethini kucatshangelwa, indawo ye-cathode izoba mncane kakhulu. Ngalesi sikhathi, izidingo eziphakeme kakhulu zibekwe ekunembeni kokuphumayo kwesilungisisi.Ukunemba kokuphumayo kwesilungisi kufanele kukhethwe ngokuya ngomugqa womkhiqizo kanye nosayizi wembobo ye-via. Uma imigqa ibe mincane futhi izimbobo zibe zincane, kulapho izimfuneko zokunemba zokulungisa kufanele zibe phezulu. Ngokuvamile, kuyatuseka ukukhetha isilungisisi esinembayo yokuphumayo ngaphakathi kuka-5%.
(6) I-Waveform. Njengamanje, ngokombono we-waveform, kunezinhlobo ezimbili ze-electroplating nezimbobo zokugcwalisa: i-pulse electroplating kanye ne-electroplating yamanje eqondile. I-rectifier yendabuko isetshenziselwa i-plating yamanje eqondile kanye nokugcwalisa imbobo, okulula ukusebenza, kodwa uma ipuleti likhulu, akukho lutho olungenziwa. Isilungisi se-PPR sisetshenziselwa i-pulse electroplating nokugcwalisa imbobo, futhi kunezinyathelo eziningi zokusebenza, kodwa sinekhono eliqinile lokucubungula amabhodi aminyene.
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