PCB wesifunda ibhodi inqubo yokukhiqiza, ngokuvamile ukuhlangana ezinye amaphutha inqubo, ezifana PCB wesifunda ibhodi ucingo lwethusi off embi (futhi ngokuvamile kuthiwa ukujikijela ithusi), kuthinta izinga lomkhiqizo. Izizathu ezijwayelekile zokuphonsa ibhodi lesifunda le-PCB zimi kanje:
Izici zenqubo yebhodi lesifunda le-PCB
1, ucwecwe lwe-copper lokunamathisela kudlulele, ucwecwe lwethusi lwe-electrolytic olusetshenziswa emakethe ngokuvamile lufakwe uthayela ohlangothini olulodwa (olwaziwa kakhulu ngokuthi ucwecwe olumpunga) kanye nethusi elicwecwe ohlangothini olulodwa (okwaziwa kakhulu ngokuthi ucwecwe olubomvu), ithusi elivamile ngokuvamile lingaphezu kuka-70um. ucwecwe lwethusi, ucwecwe olubomvu kanye ne-18um ngaphansi kocwecwe lomlotha oluyisisekelo akubanga yinqwaba yethusi.
2. Ukungqubuzana kwendawo kwenzeka kwinqubo ye-PCB, futhi intambo yethusi ihlukaniswa ne-substrate ngamandla omshini angaphandle. Lesi sici sibonakala njengokungami kahle noma umumo, intambo yethusi ewayo izoba nokuhlanekezela okusobala, noma kuhlangothi olufanayo lophawu lokuklwebheka/lomthelela. Khipha ingxenye embi yocingo lwethusi ukuze ubone ingaphezulu le-foil yethusi, ungabona umbala ojwayelekile wendawo ye-foil yethusi, ngeke kube nokuguguleka kohlangothi olubi, amandla okuxebuka e-copper ajwayelekile.
I-3, idizayini yesekethe ye-PCB ayinangqondo, ngomklamo we-foil yethusi owugqinsi womugqa omncane kakhulu, izophinde ibangele ukujula komugqa nethusi.
Isizathu senqubo ye-laminate
Ngaphansi kwezimo ezivamile, inqobo nje uma izinga lokushisa eliphezulu elicindezelayo elicindezelayo le-laminate lingaphezu kwemizuzu engama-30, ucwecwe lwethusi neshidi le-semi-cured lihlanganiswa ngokuphelele, ngakho ukucindezela ngokuvamile ngeke kuthinte amandla okubopha kwe-foil yethusi kanye ne-substrate ku-laminate. Kodwa-ke, ohlelweni lokupakisha nokupakishwa kwe-laminate, uma ukungcoliswa kwe-PP noma ukulimala kwe-foil yethusi, kuzophinde kuholele ekuqineni okunganele kokubopha phakathi kwe-copper foil ne-substrate ngemva kwe-laminate, okuholela ekumiseni (kuphela kwepuleti elikhulu) noma ucingo lwethusi lwe-sporadic. ukulahlekelwa, kodwa amandla okukhumula efoyili yethusi eduze komugqa wokuhlubula ngeke abe angajwayelekile.
Laminate isizathu sempahla eluhlaza
I-1, ucwecwe olujwayelekile lwe-electrolytic yethusi luyimikhiqizo ethathiwe noma ehlanganiswe ngethusi, uma inani eliphakeme lokukhiqizwa kocwecwe lwewuli lingajwayelekile, noma ucwecwe oluphehliwe/ithusi, ucwecwe olubi lwe-dendritic, okuholela kucwecwe lwethusi ngokwalo amandla okuxebuka akwanele, ucwecwe olubi alwanele. ibhodi elicindezelwe elenziwe nge-PCB plug-in efekthri ye-elekthronikhi, intambo yethusi izowa ngomthelela wangaphandle. Lolu hlobo olubi lokuhlubula i-copper wire copper foil surface (okungukuthi, indawo yokuxhumana ne-substrate) ngemva kokuguguleka okusobala ohlangothini, kodwa yonke indawo ye-foil yethusi yokuxebuka izoba mpofu.
2. Ukungaguquguquki kahle kwe-foil yethusi kanye ne-resin: amanye ama-laminates anezici ezikhethekile asetshenziswa manje, njengeshidi le-HTg, ngenxa yezinhlelo ezahlukene ze-resin, i-ejenti yokwelapha esetshenziswayo ngokuvamile i-PN resin, isakhiwo se-resin molecular chain silula, izinga eliphansi lokuxhumanisa lapho. ukuphulukisa, ukusebenzisa i-foil yethusi ekhethekile ephezulu kanye nomdlalo. Lapho ukukhiqizwa kwe-laminate kusetshenziswa ucwecwe lwethusi kanye nohlelo lwe-resin aluhambisani, okuholela ekutheni amandla okuxebuka eshidi lensimbi akwanele, i-plug-in izophinde ibonakale ukuchithwa kocingo lwethusi okubi.
Ngaphezu kwalokho, kungase kube ukuthi ukushisela okungalungile kuklayenti kuholela ekulahlekelweni kwe-welding pad (ikakhulukazi ama-panels angashadile nama-double, amabhodi amaningi anendawo enkulu, ukuchithwa kokushisa okusheshayo, ukushisa kwe-welding kuphezulu, akulula kangako. ukuphuma):
●Ukushisela indawo ngokuphindaphindiwe kuzoshisela iphedi;
● Izinga lokushisa eliphezulu le-soldering iron kulula ukushisela i-pad;
●Ingcindezi eningi ekhishwa ikhanda lensimbi e-soldering ku-pad kanye nesikhathi eside kakhulu sokushisela izoshisela iphedi.