Isekhethi Ephrintiwe Eguquguqukayo

Isekhethi Ephrintiwe Eguquguqukayo，Ingagotshwa, ilimele futhi isongwe ngokukhululeka. Ibhodi lesifunda eliguquguqukayo licutshungulwa kusetshenziswa ifilimu ye-polyimide njengento eyisisekelo. Ibuye ibizwe ngebhodi elithambile noma i-FPC embonini. Ukugeleza kwenqubo yebhodi lesifunda eliguquguqukayo kuhlukaniswe ngenqubo yebhodi lesifunda eliguquguqukayo elinamaceleni amabili, inqubo yebhodi yesifunda enezingqimba eziningi. Ibhodi elithambile le-FPC lingakwazi ukumelana nezigidi zokugoba ngaphandle kokulimaza izintambo. Ingahlelwa ngokungenasisekelo ngokwezidingo zesakhiwo sesikhala, futhi inganyakaziswa futhi yelulwe ngokungafanele endaweni enezinhlangothi ezintathu, ukuze kuzuzwe ukuhlanganiswa komhlangano wengxenye nokuxhumeka kocingo; ibhodi lesifunda eliguquguqukayo lingaba Ubukhulu nesisindo semikhiqizo ye-elekthronikhi kuncishiswe kakhulu, futhi kufanelekile ukuthuthukiswa kwemikhiqizo ye-elekthronikhi ekuqondeni kokuminyana okuphezulu, i-miniaturization nokuthembeka okuphezulu.

Ukwakheka kwamabhodi aguquguqukayo: ngokwenani lezendlalelo ze-copper copper foil, ingahlukaniswa ngamabhodi anesendlalelo esisodwa, amabhodi anezingqimba ezimbili, amabhodi anezingqimba eziningi, amabhodi anezinhlangothi ezimbili, njll.

Izinto ezibonakalayo nezindlela zokukhetha:

(1) I-Substrate: Impahla yi-polyimide (POLYMIDE), ekwazi ukumelana nokushisa okuphezulu, impahla ye-polymer enamandla amakhulu. Ingakwazi ukumelana nezinga lokushisa elingu-400 degrees Celsius imizuzwana engu-10, futhi amandla aqinile ngu-15,000-30,000PSI. Ama-substrates awugqinsi angu-25μm ashibhile futhi asetshenziswa kakhulu. Uma ibhodi lesifunda lidingeka ukuba libe nzima, i-substrate ye-50 μm kufanele isetshenziswe. Ngokuphambene, uma ibhodi lesifunda lidinga ukuthamba, sebenzisa i-substrate engu-13μm

(2) I-Glue esobala yezinto eziyisisekelo: Ihlukaniswe yaba izinhlobo ezimbili: i-epoxy resin ne-polyethylene, kokubili okuyi-thermosetting glue. Amandla e-polyethylene aphansi kakhulu. Uma ufuna ibhodi lesifunda lithambile, khetha i-polyethylene. Ukuqina kwe-substrate kanye ne-glue ecacile kuyo, ibhodi liqina. Uma ibhodi lesifunda linendawo enkulu yokugoba, kufanele uzame ukusebenzisa i-substrate encane kanye ne-glue esobala ukuze unciphise ukucindezeleka ebusweni be-foil yethusi, ukuze ithuba lokuqhekeka okuncane ku-foil yethusi lincane. Yiqiniso, ezindaweni ezinjalo, amabhodi ongqimba olulodwa kufanele asetshenziswe ngangokunokwenzeka.

(3) Ucwecwe lwethusi: ihlukaniswe ngethusi eligoqiwe kanye nethusi ele-electrolytic. Ithusi eligoqiwe linamandla amakhulu futhi liyamelana nokugoba, kodwa libiza kakhulu. I-Electrolytic copper ishibhile kakhulu, kodwa amandla ayo mancane futhi kulula ukuphuka. Ngokuvamile isetshenziswa ezikhathini lapho kunokugoba okuncane. Ukukhethwa kokuqina kwe-foil yethusi kuncike kububanzi obuncane kanye nesikhala esincane sezintambo. Ucwecwe lwethusi luba mncane, luba luncane ububanzi obufinyelelekayo kanye nesikhala. Uma ukhetha ithusi eligoqiwe, qaphela isiqondiso sokugoqa se-foil yethusi. Isiqondiso sokugoqa se-foil yethusi kufanele sihambisane nesiqondiso esiyinhloko sokugoba sebhodi lesifunda.

(4) Ifilimu yokuzivikela kanye neglue yayo esobala: Ifilimu yokuvikela engu-25 μm izokwenza ibhodi lesifunda libe nzima, kodwa intengo ishibhile. Kumabhodi wesifunda anamagobe amakhulu, kungcono ukusebenzisa ifilimu yokuzivikela engu-13μm. I-glue esobala nayo ihlukaniswe yaba izinhlobo ezimbili: i-epoxy resin ne-polyethylene. Ibhodi lesifunda elisebenzisa i-epoxy resin linzima kakhulu. Ngemuva kokuthi ukucindezela okushisayo kuqediwe, enye i-glue ebonakalayo izokhishwa emaphethelweni efilimu yokuzivikela. Uma ubukhulu bephedi bukhulu kunobukhulu bokuvula befilimu evikelayo, iglue ekhishweyo izonciphisa ubukhulu bepadi futhi ibangele ukuthi umkhawulo wayo ungavamile. Ngalesi sikhathi, zama ukusebenzisa iglue esobala enogqinsi lwe-13 μm.

(5) I-pad plating: Kumabhodi esekethe anamagobe amakhulu ngokuqhathaniswa namanye amaphedi avuliwe, kufanele kusetshenziswe i-electroplating nickel + i-chemical plating yegolide, futhi ungqimba lwe-nickel kufanele lube mncane ngangokunokwenzeka: 0.5-2μm, ungqimba lwegolide lwamakhemikhali 0.05-0.1 μm .