Iindaba
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Ukungakhuseleki
Ukubonakaliswa kuthetha ukuba phantsi kwe-irradiation yokukhanya kwe-ultraviolet, i-photoinitiator ithatha amandla okukhanya kwaye ibole ibe yi-radicals yamahhala, kwaye i-radicals yamahhala iqalise i-photopolymerization monomer ukwenza i-polymerization kunye ne-crosslinking reaction. Ukuboniswa kudla ngokuthwala...Funda ngokugqithisileyo -
Yintoni ubudlelwane phakathi kocingo lwePCB, ngomngxuma kunye nomthamo okhoyo wokuthwala?
Uqhagamshelo lombane phakathi kwamacandelo kwi-PCBA luphunyezwa ngocingo lwefoyile yobhedu kunye nemingxuma kwimaleko nganye. Uqhagamshelo lombane phakathi kwamacandelo kwi-PCBA luphunyezwa ngocingo lwefoyile yobhedu kunye nemingxuma kwimaleko nganye. Ngenxa yeemveliso ezahlukeneyo...Funda ngokugqithisileyo -
Ukuqaliswa komsebenzi womaleko ngamnye webhodi yesekethe yePCB enemigangatho emininzi
Iibhodi zesekethe ezininzi zineentlobo ezininzi zeeleya zokusebenza, ezinje: umaleko okhuselayo, umaleko wesikrini sesilika, umaleko wesiginali, umaleko wangaphakathi, njl njl. Wazi kangakanani ngale maleko? Imisebenzi yomaleko ngamnye yahlukile, makhe sijonge ukuba yeyiphi imisebenzi yenqanaba ngalinye ...Funda ngokugqithisileyo -
Intshayelelo kunye nezinto eziluncedo kunye nokungeloncedo kwibhodi yeceramic PCB
1. Kutheni sebenzisa iibhodi zesekethe ye-ceramic I-PCB eqhelekileyo idla ngokwenziwa ngefoyile yobhedu kunye ne-substrate bonding, kwaye i-substrate material ininzi ye-glass fiber (FR-4), i-phenolic resin (FR-3) kunye nezinye izinto, i-adhesive idla ngokuba yi-phenolic, epoxy. , njl njl. Kwinkqubo yePCB processing ngenxa yoxinzelelo lwe-thermal...Funda ngokugqithisileyo -
I-infrared + i-solder eshushu yokubuyisela umoya
Embindini we-1990s, kwakukho umkhwa wokutshintshela kwi-infrared + ukufudumeza komoya oshushu kwi-reflow soldering eJapan. Ifudunyezwa yimitha ye-infrared engama-30% kunye ne-70% yomoya oshushu njengothwala ubushushu. I-oven ye-infrared hot reflow oven idibanisa ngokufanelekileyo izibonelelo zokuphinda i-infrared kunye nokunyanzeliswa kwe-convection yomoya oshushu ...Funda ngokugqithisileyo -
Yintoni inkqubo yePCBA?
Ukusetyenzwa kwe-PCBA yimveliso egqityiweyo yebhodi ye-PCB engenanto emva kwe-SMT patch, i-DIP plug-in kunye novavanyo lwe-PCBA, ukuhlolwa komgangatho kunye nenkqubo yokuhlanganisana, ebizwa ngokuba yi-PCBA. Iqela elithembisileyo lizisa iprojekthi yokusetyenzwa kumzi-mveliso wobuchwephesha wePCBA, emva koko ulinde imveliso egqityiweyo...Funda ngokugqithisileyo -
Etching
PCB ibhodi etching inkqubo, esebenzisa iinkqubo zemveli etching imichiza ukuze corrode iindawo ezingakhuselekanga. Uhlobo olufana nokugrumba umsele, indlela esebenzayo kodwa engasebenziyo. Kwinkqubo ye-etching, iphinda ihlulwe ibe yinkqubo yefilimu efanelekileyo kunye nenkqubo yefilimu engalunganga. Inkqubo entle yefilimu...Funda ngokugqithisileyo -
Ibhodi yeSekethe eprintiweyo iNgxelo yeMarike yeHlabathi ka-2022
Abadlali abaphambili kwimarike yebhodi yesekethe eprintiweyo zezi TTM Technologies, Nippon Mektron Ltd., Samsung Electro-Mechanics, Unimicron Technology Corporation, Advanced Circuits, Tripod Technology Corporation, DAEDUCK ELECTRONICS Co.Ltd., Flex Ltd., Eltek Ltd, kunye neSumitomo Electric Industries . Iglobal...Funda ngokugqithisileyo -
1. Iphakheji ye-DIP
Iphakheji ye-DIP (i-Dual In-line Package), eyaziwa ngokuba yitekhnoloji yokupakisha ye-double in-line, ibhekisela kwiichips zesekethe ezihlanganisiweyo ezipakishwe kwifom ye-double in-line. Inani ngokubanzi aligqithi kwi-100. I-DIP epakishwe i-CPU chip inemiqolo emibini yezikhonkwane ekufuneka ifakwe kwisokethi yechip ene...Funda ngokugqithisileyo -
Umahluko phakathi kwe-FR-4 Material kunye neRogers Material
1. Izinto ze-FR-4 zinexabiso eliphantsi kunezinto zeRogers 2. Izinto zeRogers zineefrikhwensi eziphezulu xa kuthelekiswa ne-FR-4. 3. I-Df okanye i-dissipation factor ye-FR-4 iphezulu kuneyona nto ye-Rogers, kwaye ilahleko yesignali inkulu. 4. Ngokumalunga nozinzo lwe-impedance, uluhlu lwexabiso lika Dk...Funda ngokugqithisileyo -
Kutheni ufuna ukugqunywa ngegolide kwiPCB?
1. Umphezulu wePCB: OSP, HASL, Lead-free HASL, Immersion Tin, ENIG, Imersion Silver, Hard gold plating, Plating gold for the whole board, gold finger, ENEPIG... OSP: ixabiso eliphantsi, solderability elungileyo, iimeko zokugcina ezinzima, ixesha elifutshane, itekhnoloji yokusingqongileyo, i-welding elungileyo, igudileyo… HASL: iqhelekile...Funda ngokugqithisileyo -
I-Organic Antioxidant (OSP)
Amathuba afanelekileyo: Kuqikelelwa ukuba malunga ne-25% -30% yee-PCBs ngoku ezisebenzisa inkqubo ye-OSP, kwaye umlinganiselo uyenyuka (kusenokwenzeka ukuba inkqubo ye-OSP ngoku igqithe itoti yokutshiza kwaye ibeka phambili kuqala). Inkqubo ye-OSP ingasetyenziswa kwiiPCB ezikumgangatho ophantsi okanye iiPCB zobuchwepheshe obuphezulu, ezifana ne-single-si...Funda ngokugqithisileyo
