Iphakheji yedip. Inombolo ngokubanzi ayidluli kwi-100. I-DPU epakishwe i-CPU inee-CPU ineemigca emibini yemikhonkco efuna ukufakwe kwisokethi yeChip ngesiseko se-CHIP ngesiseko se-chip ngesixhobo se-CHIP. Ewe kunjalo, inokubekwa ngokuthe ngqo kwibhodi yesekethe enenani elifanayo lemingxunya yomthengisi kunye nenkqubo yejometri yokuthengisa. I-chips epakishwe i-dip ephathekiweyo kufuneka ifakwe kwaye ikhutshiwe kwisokethi ye-chip kunye nononophelo olukhethekileyo ukuthintela ukonakaliswa kwizikhonkwane. I-Dip yePakethi yeDip yeDip Compact i

Iphakheji yeDip inezi mpawu zilandelayo:

I-1. Ukuthathwa kwe-Deling kwi-PCB (iBhodi yeSekethe eprintiweyo), kulula ukusebenza;

2. Umyinge wendawo ephakathi kweChip kunye nendawo yephakheji inkulu, ke ivolumu inkulu;

Idiphu yeyona phakheji idumileyo ye-plug, kwaye izicelo zayo zibandakanya i-IC engaqhelekanga ye-Logic, imemori kunye nesekethe i-microcompar. Kwakudala 4004, 8008, 8086, 8088 kunye nezinye ii-CPU zonke zisebenzisa iiphakheji zediphu, kwaye imiqolo emibini yezikhonkwane kuzo inokufakwa kwibhodi yamalungu kwibhodi yamama okanye ithengiswa kwibhodi yamalungu.