Iphakheji ye-DIP(I-Dual In-line Package), eyaziwa ngokuba yitekhnoloji yokupakishwa kwe-in-line, ibhekiselele kwiichips zesekethe ezidibeneyo ezipakishwe kwifom ye-in-line. Inani ngokubanzi alidluli kwi-100. I-DIP epakishwe i-CPU chip inemiqolo emibini yezikhonkwane ekufuneka ifakwe kwisokethi ye-chip enesakhiwo se-DIP. Ngokuqinisekileyo, inokuthi ifakwe ngokuthe ngqo kwibhodi yesekethe kunye nenani elifanayo lemingxuma ye-solder kunye nokulungiswa kwejometri yokuthengisa. Iichips ze-DIP ezipakishweyo kufuneka zifakwe kwaye zikhutshwe kwi-chip socket ngononophelo olukhethekileyo ukuphepha umonakalo kwizikhonkwane. Iifom zesakhiwo sepakethe ye-DIP zezi: i-DIP ye-ceramic ye-multi-layer ye-ceramic DIP, i-DIP ye-ceramic DIP, isakhelo esikhokelayo se-DIP (kubandakanywa uhlobo lokutywinwa kweglasi ye-ceramic, uhlobo lwesakhiwo seplastiki, uhlobo lokupakisha lweglasi enyibilikayo ephantsi)

Iphakheji ye-DIP inezi mpawu zilandelayo:

1. Ilungele i-perforation welding kwi-PCB (ibhodi yesekethe eprintiweyo), kulula ukuyisebenzisa;

2. Umlinganiselo phakathi kwendawo ye-chip kunye nommandla wepakethe mkhulu, ngoko umthamo nawo mkhulu;

I-DIP yeyona plagi-in ipakethe ethandwa kakhulu, kwaye izicelo zayo ziquka i-IC eqhelekileyo, imemori kunye neesekethe ze-microcomputer. Eyokuqala i-4004, 8008, 8086, 8088 kunye nezinye ii-CPU zonke ezisetyenzisiweyo iipakethe ze-DIP, kwaye imiqolo emibini yezikhonkwane kuzo inokufakwa kwiindawo zokubeka kwi-motherboard okanye i-solder kwi-motherboard.