Amathuba asebenzayo: kuqikelelwa ukuba malunga ne-25% -30% yee-PCBs okwangoku zisebenzisa inkqubo ye-OSP, kwaye i-SSP sele inyukele (kunokwenzeka ukuba inkqubo ye-OSP sele igqithile kwi-SPRY TIN kunye nenqanaba lokuqala le-SPRAY kunye nenqanaba lokuqala. Inkqubo ye-OSP inokusetyenziswa kwiPCBS ephantsi okanye iPCB yeTekhnoloji ephezulu, efana nePCBS yeTV engatshatanga kunye neeBhodi zePakethi eziphezulu ze-chip eziphezulu. Ye-BGA, ikwaninziI-oSPizicelo. Ukuba i-PCB ayinamsebenzi onxunguphalo lwendlela okanye imiqobo yokugcina, inkqubo ye-OSP iya kuba yeyona nkqubo ifanelekileyo yonyango.

Elona nyango likhulu: zonke izibonelelo zeBhodi yeBhodi yeBhodi yeBhodi yeBhodi yeBhodi yeBhodi, kwaye iBhodi ephelileyo (iinyanga ezintathu) nazo zinokuphinda ivuswe, kodwa zihlala kube kanye.

Izinto ezingalunganga: ichaphazeleka kwi-acid kunye nokufuma. Xa isetyenziselwa ukuthengisa okuvunwa kwesibini, kufuneka igqitywe ngaphakathi kwexesha elithile. Ngokwesiqhelo, isiphumo sokuthengiswa kwendawo yesibini siya kuba lihlwempu. Ukuba ixesha lokugcina lingaphezulu kweenyanga ezintathu, kufuneka ivuselwe. Sebenzisa kwiiyure ezingama-24 emva kokuvula iphakheji. I-OSP yi-suble thermer, ke inqaku lovavanyo kufuneka iprintwe ngomthengisi icofe ukususa i-OSP ye-OSP yokutshintsha iPIN kwi-PINO PORTOR KUNYE iPIN kuvavanyo lombane.

Indlela: Kwindawo ecocekileyo yobhedu, umaleko wefilimu owelokishiweyo ukhule ngendlela yekhemikhali. Le filimu inesibizelelo, i-shrick ye-thermal, ukunyangwa komswakama, kwaye isetyenziselwa ukukhusela umphezulu wobhedu (i-oxidation okanye i-gelic.) Kwindawo eqhelekileyo; Kwangelo xesha, kufuneka incedwe ngokulula kwiqondo lokuhlala eliphakamileyo le-welding. I-flux isuswa ngokukhawuleza ukuba ithengiswe;