Amathuba afanelekileyo: Kuqikelelwa ukuba malunga ne-25% -30% yee-PCBs ngoku ezisebenzisa inkqubo ye-OSP, kwaye umlinganiselo uyenyuka (kusenokwenzeka ukuba inkqubo ye-OSP ngoku igqithe itoti yokutshiza kwaye ibeka phambili kuqala). Inkqubo ye-OSP ingasetyenziswa kwii-PCB ezikumgangatho ophantsi okanye ii-PCB zobuchwepheshe obuphezulu, ezifana nee-PCB zeTV ezisecaleni kunye neebhodi zokupakisha zetshiphu ezixineneyo. Kwi-BGA, kukho ezininziOSPizicelo. Ukuba i-PCB ayinazo iimfuno zokusebenza zoqhagamshelwano lomphezulu okanye izithintelo zexesha lokugcinwa, inkqubo ye-OSP iya kuba yeyona nkqubo ifanelekileyo yonyango lomphezulu.

Inzuzo enkulu: Inayo yonke inzuzo ye-welding yebhodi yobhedu engenanto, kwaye ibhodi ephelelwe yisikhathi (iinyanga ezintathu) inokuphinda iphinde iphinde iphinde iphinde iphinde iphinde iphinde iphinde iphinde iphinde iphinde iphinde iphinde iphinde iphinde iphinde iphinde iphinde iphinde ifakwe, kodwa ngokuqhelekileyo kanye kuphela.

Ukungalungi: ukuchaphazeleka kwi-asidi kunye nokufuma. Xa isetyenziselwa i-reflow soldering yesibini, kufuneka igqitywe ngexesha elithile. Ngokuqhelekileyo, umphumo we-soldering ye-reflow yesibini iya kuba yimbi. Ukuba ixesha lokugcinwa lidlula kwiinyanga ezintathu, kufuneka lihlaziywe. Sebenzisa kwiiyure ezingama-24 emva kokuvula iphakheji. I-OSP ngumaleko okhuselayo, ngoko ke indawo yokuvavanya kufuneka iprintwe kunye ne-solder paste ukususa umaleko we-OSP wokuqala ukuqhagamshelana ne-pin point yokuvavanya umbane.

Indlela: Kumhlaba wobhedu ococekileyo ongenanto, umaleko wefilimu ephilayo ukhuliswa ngendlela yeekhemikhali. Le filimu ine-anti-oxidation, i-thermal shock, ukumelana nomswakama, kwaye isetyenziselwa ukukhusela ubuso bobhedu kwi-rust (i-oxidation okanye i-vulcanization, njl.) kwindawo eqhelekileyo; ngelo xesha, kufuneka incediswe ngokulula kwiqondo lokushisa eliphezulu elilandelayo le-welding. I-Flux isuswa ngokukhawuleza kwi-soldering;