Nūhou

  • Hōʻike

    ʻO ke ʻano o ka hoʻolaha ʻana ma lalo o ka hoʻomālamalama ʻana o ke kukui ultraviolet, hoʻopau ka photoinitiator i ka ikehu māmā a decomposes i nā radical manuahi, a laila hoʻomaka nā radical manuahi i ka monomer photopolymerization e hoʻokō i ka polymerization a me ka crosslinking reaction. Lawe pinepine ʻia ka Exposure ...
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  • He aha ka pilina ma waena o ka uwila PCB, ma o ka lua a me ka hiki ke lawe i kēia manawa?

    Loaʻa ka pilina uila ma waena o nā ʻāpana ma ka PCBA ma o ka wili keleawe keleawe a me nā puka ma kēlā me kēia papa. Loaʻa ka pilina uila ma waena o nā ʻāpana ma ka PCBA ma o ka wili keleawe keleawe a me nā puka ma kēlā me kēia papa. Ma muli o nā huahana like ʻole ...
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  • Hoʻolauna hana o kēlā me kēia papa o ka papa kaapuni PCB multi-layer

    Nui nā ʻano o nā papa hana i loko o nā papa kaapuni multilayer, e like me: ka papa pale, ka ʻili siliki, ka papa hōʻailona, ​​ka ʻāpana o loko, etc. Pehea ka nui o kāu ʻike e pili ana i kēia mau papa? He ʻokoʻa nā hana o kēlā me kēia papa, e nānā kākou i nā hana o kēlā me kēia pae h...
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  • Hoʻomaka a me nā pono a me nā hemahema o ka papa PCB ceramic

    Hoʻomaka a me nā pono a me nā hemahema o ka papa PCB ceramic

    1. No ke aha e hoʻohana ai i nā papa kaapuni ceramic ʻO ka PCB maʻamau ka mea maʻamau i hana ʻia me ke keleawe foil a me ka substrate hoʻopaʻa ʻana, a ʻo ka mea substrate ka hapa nui o ke aniani fiber (FR-4), phenolic resin (FR-3) a me nā mea ʻē aʻe, adhesive maʻamau phenolic, epoxy , etc. I ke kaʻina hana o ka PCB ma muli o ka thermal stress ...
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  • Infrared + wela ea reflow soldering

    Infrared + wela ea reflow soldering

    I ka waena o 1990s, aia kahi ʻano e hoʻololi i ka infrared + wela ea wela i ka hoʻoheheʻe hou ʻana ma Iapana. Hoʻomaʻamaʻa ʻia ia e 30% mau kukui infrared a me 70% ea wela ma ke ʻano he mea lawe wela. Hoʻohui maikaʻi ka umu wela infrared reflow i nā pono o ka reflow infrared a me ka convection convection hot air r...
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  • He aha ka hana PCBA?

    ʻO ka hoʻoili ʻana o PCBA kahi huahana i hoʻopau ʻia o ka papa ʻaina PCB ma hope o ka SMT patch, DIP plug-in a me ka hoʻāʻo PCBA, ka nānā ʻana i ka maikaʻi a me ke kaʻina hui, i kapa ʻia ʻo PCBA. Hāʻawi ka ʻaoʻao hāʻawi i ka papahana hana i ka hale hana hana PCBA ʻoihana, a laila kali no ka prod i pau ...
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  • Kaʻi ʻana

    ʻO ke kaʻina hana etching papa PCB, kahi e hoʻohana ai i nā kaʻina hana kemika kuʻuna e hoʻopau i nā wahi i pale ʻole ʻia. ʻAno like me ka ʻeli ʻana i ka ʻauwaha, kahi ala kūpono akā ʻaʻole pono. Ma ke kaʻina hana etching, ua mahele pū ʻia i kahi kaʻina hana kiʻiʻoniʻoni maikaʻi a me kahi kaʻina hana kiʻiʻoniʻoni maikaʻi ʻole. ʻO ke kaʻina hana kiʻiʻoniʻoni maikaʻi ...
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  • Hōʻike ʻo ka Papa Kaapuni Paʻi Global Market 2022

    Hōʻike ʻo ka Papa Kaapuni Paʻi Global Market 2022

    ʻO nā mea pāʻani nui i ka mākeke papa paʻi paʻi ʻia ʻo TTM Technologies, Nippon Mektron Ltd, Samsung Electro-Mechanics, Unimicron Technology Corporation, Advanced Circuits, Tripod Technology Corporation, DAEDUCK ELECTRONICS Co.Ltd., Flex Ltd., Eltek Ltd, a me Sumitomo Electric Industries . ʻO ka honua ...
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  • 1. pūʻolo DIP

    1. pūʻolo DIP

    ʻO ka pūʻolo DIP (Dual In-line Package), i ʻike ʻia ʻo ka ʻenehana hoʻopili ʻelua in-line, e pili ana i nā pahu kaapuni i hoʻohui ʻia i pūʻulu ʻia i loko o nā ʻano ʻelua in-line. ʻAʻole ʻoi aku ka nui o ka helu ma mua o 100. ʻO kahi chip CPU i hoʻopaʻa ʻia e DIP he ʻelua lālani o nā pine e pono e hoʻokomo ʻia i loko o kahi kumu chip me kahi...
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  • ʻOkoʻa ma waena o FR-4 Material a me Rogers Material

    ʻOkoʻa ma waena o FR-4 Material a me Rogers Material

    1. ʻOi aku ka liʻiliʻi o nā mea FR-4 ma mua o nā mea Rogers 2. He kiʻekiʻe ke alapine ʻo Rogers i hoʻohālikelike ʻia me nā mea FR-4. 3. ʻOi aku ka kiʻekiʻe o ka Df a i ʻole dissipation factor o ka mea FR-4 ma mua o ka mea Rogers, a ʻoi aku ka nui o ka nalowale o ka hōʻailona. 4. Ma keʻano o ka impedance stability, ka helu Dk waiwai ...
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  • No ke aha e pono ai ke uhi me ke gula no ka PCB?

    No ke aha e pono ai ke uhi me ke gula no ka PCB?

    1. Ili o PCB: OSP, HASL, Lead-free HASL, Immersion Tin, ENIG, Immersion Silver, Paʻa gula paʻa, Plating gula no ka papa holoʻokoʻa, gula manamana lima, ENEPIG… OSP: haʻahaʻa kumu kūʻai, maikaʻi solderability, koʻikoʻi mālama kūlana, manawa pōkole, ʻenehana kaiapuni, wiliwili maikaʻi, maʻemaʻe… HASL: ʻo ia ka m...
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  • Mea ʻAiʻi ʻAiʻi Organic (OSP)

    Mea ʻAiʻi ʻAiʻi Organic (OSP)

    Nā manawa kūpono: Ua manaʻo ʻia aia ma kahi o 25%-30% o nā PCB i kēia manawa ke hoʻohana nei i ke kaʻina OSP, a ke piʻi aʻe nei ka hapa (ua ʻoi aku paha ke kaʻina OSP i kēia manawa ma mua o ka pahu spray a ke kūlana mua). Hiki ke hoʻohana ʻia ke kaʻina OSP ma nā PCB ʻenehana haʻahaʻa a i ʻole PCB ʻenehana kiʻekiʻe, e like me ka single-si ...
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