Ke kumu o ka hāʻule ʻana o ka pā solder PCB
PCB kaapuni papa i loko o ka hana kaʻina hana, pinepine halawai i kekahi kaʻina defects, e like me ka PCB kaapuni papa keleawe uea mai ino (ua olelo pinepine e hoolei keleawe), pili i ka huahana maikaʻi. ʻO nā kumu maʻamau no ka hoʻolei ʻana i ke keleawe o ka PCB circuit board penei:
PCB kaapuni papa kaʻina kumu
1, ʻoi aku ka nui o ka etching copper foil, electrolytic copper foil i hoʻohana ʻia ma ka mākeke ma ka maʻamau hoʻokahi ʻaoʻao galvanized (i ʻike pinepine ʻia ʻo ka foil hina) a me ke keleawe ʻaoʻao hoʻokahi ʻaoʻao (ʻike pinepine ʻia ʻo red foil), ʻoi aku ka nui o ke keleawe ma mua o 70um galvanized. ʻO ka pepa keleawe, ka ʻulaʻula a me ka 18um ma lalo o ka pahu lehu kumu ʻaʻole ia he pūʻulu keleawe.
2. Local collision i loko o ka PCB kaʻina, a me ke keleawe uea ua hoʻokaʻawale 'ia mai ka substrate ma waho mechanical ikaika. Hōʻike ʻia kēia hemahema ma ke ʻano he kūlana maikaʻi ʻole a i ʻole ka hoʻonohonoho ʻana, ʻo ka hāʻule ʻana o ke uwea keleawe e ʻike ʻia ka distortion, a i ʻole ma ke ala like o ka mākaʻikaʻi / hopena. E ʻoki i ka ʻāpana ʻino o ka uea keleawe e ʻike ai i ka ʻili keleawe keleawe, hiki iā ʻoe ke ʻike i ke kala maʻamau o ka ʻili keleawe keleawe, ʻaʻohe ʻaoʻao ʻino ʻino, ʻoi aku ka ikaika o ka peeling copper foil.
3, ʻAʻole kūpono ka hoʻolālā kaapuni PCB, me ka hoʻolālā keleawe keleawe mānoanoa o ka laina lahilahi, e hoʻoulu ai i ka laina etching a me ke keleawe.
ʻO ke kumu kaʻina hana laminate
Ma lalo o nā kūlana maʻamau, ʻoiai ʻoi aku ka lōʻihi o ka pauku wela wela o ka laminate ma mua o 30 mau minuke, ua hui pū ʻia ka pahu keleawe a me ka pepa semi-cured, no laila ʻaʻole e hoʻopilikia ka paʻi ʻana i ka ikaika paʻa o ke keleawe keleawe a me ka substrate i ka laminate. Eia nō naʻe, i ke kaʻina hana o ka laminate stacking a me ka hoʻopaʻa ʻana, inā he pollution PP a i ʻole ka pohō keleawe o ka ʻili, e alakaʻi ia i ka lawa ʻole o ka ikaika paʻa ma waena o ke keleawe keleawe a me ka substrate ma hope o ka laminate, e hopena i ka hoʻonohonoho ʻana (no ka pā nui wale nō) a i ʻole uea keleawe sporadic. poho, akā, ʻaʻole he mea ʻino ka ikaika wehe ʻana o ka pepa keleawe kokoke i ka laina wehe.
Laminate kumu kumu
1, ʻO ka pahu keleawe electrolytic maʻamau he galvanized a i ʻole nā huahana i hoʻopaʻa ʻia i ke keleawe, inā ʻaʻole i lawa ka waiwai kiʻekiʻe o ka hana ʻana o ka hulu hipa, a i ʻole galvanized / copper plating, uhi dendritic maikaʻi ʻole, ka hopena i ka ʻili keleawe ponoʻī ʻaʻole lawa, ʻo ka foil maikaʻi ʻole. paʻi papa i hana ʻia me ka PCB plug-in i loko o ka hale hana uila, e hāʻule ka uea keleawe e ka hopena o waho. ʻO kēia ʻano ʻano ʻino o ka ʻili ʻana i ka uea keleawe keleawe foil ili (ʻo ia hoʻi, pili i ka ʻili me ka substrate) ma hope o ka ʻike ʻana o ka ʻaoʻao ʻaoʻao, akā ʻilihune ka ʻili holoʻokoʻa o ka ʻili keleawe.
2. Poor adaptability of copper foil and resin: kekahi mau laminates with special properties i keia manawa, e like me ka HTg sheet, no ka like ole o ka resin system, the curing agent used is common PN resin, resin molecular chain structure is simple, low crosslinking degree when curing, e hoʻohana kūikawā peak copper foil a me ka pili. I ka hana ʻana o ka laminate me ka hoʻohana ʻana i ke keleawe keleawe a me ka ʻōnaehana resin, ʻaʻole lawa ka ikaika o ka ʻili ʻana i ka pepa metala, e ʻike pū ʻia ka hoʻopili ʻana i ka uea keleawe maikaʻi ʻole.
Eia kekahi, hiki paha i ka hoʻopili pono ʻole ʻana i ka mea kūʻai aku ke alakaʻi i ka nalowale o ka welding pad (ʻoi aku ka nui o nā panela hoʻokahi a me ka pālua, ʻo nā papa multilayer he wahi nui o ka papahele, wikiwiki ka wela wela, kiʻekiʻe ka wela, ʻaʻole maʻalahi. e hāʻule iho):
ʻO ka wili pinepine ʻana i kahi wahi e hoʻopaʻa ʻia ai ka pā;
He maʻalahi ka wela o ka hao hao i ka weld mai ka pā;
ʻOi aku ka nui o ke kaomi ʻana e ke poʻo hao hao ma ka pā a lōʻihi loa ka manawa wiliwili e wili ai ka papa.