Kungani udinga ikhava ngegolide le-PCB?

1. I-Surface ye-PCB: I-OSP, i-HASL, i-HASL engenamthofu, i-Immersion Tin, i-ENIG, i-Immersion Silver, i-Hard gold plating, Ukufaka igolide lebhodi lonke, umunwe wegolide, i-ENEPIG...

I-OSP: izindleko eziphansi, ukuthengiselana okuhle, izimo zokugcina ezinzima, isikhathi esifushane, ubuchwepheshe bezemvelo, ukushisela okuhle, bushelelezi…

I-HASL: imvamisa kuba amasampula e-HDI PCB amaningi (izendlalelo ezi-4 – 46), isetshenziswe yizokuxhumana eziningi ezinkulu, amakhompyutha, imishini yezokwelapha kanye namabhizinisi asemkhathini kanye namayunithi ocwaningo.

Umunwe wegolide: ukuxhumana phakathi kwe-memory slot kanye ne-memory chip, wonke amasignali athunyelwa ngomunwe wegolide.

Umunwe wegolide uqukethe inqwaba yezinto ezithinta igolide, ezibizwa ngokuthi "umunwe wegolide" ngenxa yendawo embozwe ngegolide kanye nokuhlelwa kwazo okufana nomunwe. Umunwe wegolide empeleni USEBENZISA inqubo ekhethekile yokwembathisa ithusi ngegolide, elimelana kakhulu ne-oxidation futhi lisebenza kakhulu. Kodwa intengo yegolide iyabiza, i-tin plating yamanje isetshenziselwa ukufaka esikhundleni senkumbulo eyengeziwe. Kusukela ngekhulunyaka elidlule lama-90s, izinto zikathayela zaqala ukusabalala, ibhodi lomama, inkumbulo, namadivayisi wevidiyo afana “nomunwe wegolide” cishe ahlala esetshenziswa izinto zikathayela, ezinye izesekeli ezisebenza kahle kakhulu zeseva/indawo yokusebenzela zizothinta indawo ukuze uqhubeke umkhuba wokusebenzisa igolide plated, ngakho intengo has a kancane ezibizayo.

  1. Kungani usebenzise i-ibhodi lokucwenga igolide?

Ngokuhlanganiswa kwe-IC phezulu nangaphezulu, izinyawo ze-IC ziminyene kakhulu. Nakuba inqubo yokufafaza ithini emile inzima ukushaya i-welding pad flat, okuletha ubunzima ekukhwezeni kwe-SMT; Ngaphezu kwalokho, impilo yeshalofu yepuleti lokufafaza ithini ifushane kakhulu. Nokho, ipuleti legolide lixazulula lezi zinkinga:

1.) Okwezobuchwepheshe bokukhweza komhlaba, ikakhulukazi i-0603 kanye ne-0402 i-ultra-small table mount, ngoba ukucaba kwe-welding pad kuhlobene ngokuqondile nekhwalithi yenqubo yokuphrinta ye-solder paste, ngemuva kwekhwalithi ye-welding yokugeleza kabusha umthelela obalulekile, ngakho-ke, ipuleti lonke elibekwe ngegolide ekugqineni okuphezulu kanye nobuchwepheshe bokukhweza ithebula obuncane kakhulu buvame ukubonakala.

2.) Esigabeni sokuthuthukiswa, umthelela wezici ezifana nokuthengwa kwezingxenye ngokuvamile akulona ibhodi lokushisela ngokushesha, kodwa ngokuvamile kufanele ulinde amasonto ambalwa noma ngisho nezinyanga ngaphambi kokusetshenziswa, impilo yeshalofu yebhodi legolide lide kune-terne. metal izikhathi eziningi, ngakho wonke umuntu uzimisele ukwamukela. Ngaphandle kwalokho, i-PCB efakwe ngegolide ngamadigri ezindleko zesampula yesiteji uma kuqhathaniswa namapuleti e-pewter

3.)

4.) Kodwa ngezintambo eziminyene kakhulu, ububanzi bomugqa, isikhala sesifinyelele ku-3-4MIL

Ngakho-ke, kuletha inkinga yesifunda esifushane socingo lwegolide: ngemvamisa ekhulayo yesiginali, umthelela wokudluliselwa kwesignali ezinhlobonhlobo eziningi ngenxa yomphumela wesikhumba uba sobala ngokwengeziwe.

(umthelela wesikhumba : I-high frequency alternating current, i-current izovame ukugxila ngaphezulu kokugeleza kwentambo. Ngokusho kwesibalo, ukujula kwesikhumba kuhlobene nobuningi.)

  1. Kungani usebenzise i-ukucwiliswa kwegolide PCB?

Kunezici ezithile zombukiso we-PCB wegolide wokucwiliswa njengoba ngezansi:

1.) Isakhiwo sekristalu esakhiwe ngokucwiliswa kwegolide nokucwecwa kwegolide sihlukile, umbala wegolide lokucwiliswa uzoba muhle kakhulu kunegolide elicwebezelayo futhi ikhasimende laneliseke kakhulu. Khona-ke ukucindezeleka kwepuleti legolide elicwilisiwe kulula ukulawula, okulungele kakhulu ukucutshungulwa kwemikhiqizo. Ngesikhathi esifanayo futhi ngoba igolide lithambile kunegolide, ngakho ipuleti igolide ungagqoki - ukumelana igolide ngomunwe.

2.) I-Immersion Gold kulula ukuyishisela kunokucwecwa ngegolide, futhi ngeke kubangele ukushisela okubi kanye nezikhalazo zamakhasimende.

3.) igolide le-nickel litholakala kuphela kuphedi lokushisela ku-ENIG PCB, ukudluliswa kwesignali kumphumela wesikhumba kungqimba lwethusi, okungeke kuthinte isignali, futhi ungaholeli i-short-circuit yocingo lwegolide. I-soldermask kumjikelezo ihlanganiswe ngokuqinile nezendlalelo zethusi.

4.) Isakhiwo sekristalu segolide lokucwiliswa siminyene kune-plating yegolide, kunzima ukukhiqiza i-oxidation

5.) Ngeke kube nomthelela esikhaleni lapho kwenziwa isinxephezelo

6.) Ubucaba nempilo yokusebenza kwepuleti legolide kuhle njengaleyo yepuleti legolide.

 

  1. I-Immersion Gold VS Gold Plating

 

Kunezinhlobo ezimbili zobuchwepheshe bokucwebezelisa igolide: enye i-electric gold plating, enye i-Immersion Gold

 

Ngenqubo yokugcoba igolide, umphumela we-tin uyancipha kakhulu, futhi umphumela wegolide ungcono; Ngaphandle uma umenzi edinga ukubopha, noma manje abakhiqizi abaningi bazokhetha inqubo yokucwilisa igolide!

Ngokuvamile, ukwelashwa okungaphezulu kwe-PCB kungahlukaniswa ngalezi zinhlobo ezilandelayo: i-plating yegolide (i-electroplating, igolide lokucwiliswa), i-silver plating, i-OSP, i-HASL (enomthofu nangaphandle kwayo), okuyizipuleti ze-FR4 noma ze-CEM-3, isisekelo sephepha. izinto zokwakha kanye ne-rosin coating surface treatment; On the tin abampofu (ukudla tin mpofu) lokhu uma ukususwa unama abakhiqizi kanye nezizathu zokucubungula impahla.

Kunezizathu ezithile zenkinga ye-PCB:

  1. Ngesikhathi sokuphrinta kwe-PCB, kungakhathaliseki ukuthi kukhona indawo yefilimu egcwele uwoyela ku-PAN, ingavimba umphumela wethini; lokhu kungaqinisekiswa ukuhlolwa kwe-solder float

  2. Kungakhathaliseki ukuthi isikhundla sokuhlobisa se-PAN singahlangabezana nezidingo zokuklama, okungukuthi, noma ngabe i-welding pad ingaklanywa ukuze kuqinisekiswe ukusekelwa kwezingxenye.

  3. I-welding pad ayingcolisiwe, engalinganiswa ngokungcoliswa kwe-ion; t

Mayelana nendawo:

Igolide plating, kungenza PCB isitoreji isikhathi eside, futhi by imvelo yangaphandle izinga lokushisa kanye nomswakama ushintsho kuncane (uma kuqhathaniswa nokunye ukwelashwa surface), ngokuvamile, ingagcinwa isikhathi esingangonyaka; I-HASL noma iholele ukwelashwa kwe-HASL kwamahhala kwesibili, i-OSP futhi, ukwelashwa okubili endaweni yokushisa kwemvelo kanye nesikhathi sokugcinwa komswakama ukunaka okuningi.

Ngaphansi kwezimo ezijwayelekile, ukwelashwa kwendawo yesiliva kuhluke kancane, intengo nayo iphakeme, izimo zokulondoloza zidinga kakhulu, isidingo sokusebenzisa ukucubungula ukupakisha kwephepha lesibabule! Futhi uyigcine cishe izinyanga ezintathu! Emthelela wethini, igolide, i-OSP, isifutho sethini empeleni siyafana, abakhiqizi kufanele bacabangele ukusebenza kwezindleko!