A. PCB Factory Procest Factors
1. I-etching ngokweqile ye-foil yethusi
I-electrolytic yethusi i-foil esetshenziswe emakethe ngokuvamile igcwele uhlangothi olulodwa (olwaziwa kakhulu ngokuthi yi-aingathi i-foil) kanye neplanithi yethusi elilodwa (evame ukwaziwa njenge-foil ebomvu). I-Foil ye-Copper ejwayelekile imvamisa i-foil yethusi ye-galvanized ngaphezulu kwe-70um, i-foil ebomvu ne-18um. I-Foil elandelayo elandelayo ayinakunqatshwa kwe-batch yethusi. Lapho umklamo wokujikeleza ungcono kunomugqa we-etching, uma ukucaciswa kwe-foil ye-Copper kodwa amapharamitha atching awashintshi, lokhu kuzokwenza ukuthi i-folper fol ihlala esikhaleni esise-etching isikhathi eside kakhulu.
Ngoba i-zinc ekuqaleni iyinsimbi esebenzayo, lapho ucingo lwethusi ku-PCB selifakwe esikhandlayo isikhathi eside, lizokwenza ukucekelwa phansi komugqa okuphezulu, okubangela ukusekelwa komugqa omncane, okungukuthi, ucingo lwethusi luyaphela.
Esinye isimo ukuthi ayikho inkinga ngamapharamitha we-PCB Etching, kepha ukugeza nokugeza akukuhle ngemuva kokukhipha, okwenza ukuthi ucingo lwethusi luzungezwe yisixazululo se-etching esisele. Uma kungacutshungulwa isikhathi eside, kuzothuthukisa futhi uhlangothi lwethusi lwethusi lwethusi oludlulayo nokwenqatshwa. ithusi.
Lesi simo ngokuvamile sigxile emigqeni emincane, noma lapho isimo sezulu sinomswakama, izinkinga ezifanayo zizovela kulo lonke i-PCB. Shaya ucingo lwethusi ukuze ubone ukuthi umbala wendawo yawo yokuxhumana ne-Base Layer (okubizwa ngokuthi yi-Routen Umbala we-foil uhlukile. Okubonayo umbala wethusi wangempela wesendlalelo esingezansi, kanye namandla we-peel we-foil we-post kulayini obukhulu nakho kuyajwayelekile.
2. Ukushayisana kwendawo kwenzeka kwinqubo yokukhiqiza ye-PCB, kanti nocingo lwethusi lwahlukaniswa ne-substrate ngamandla angaphandle
Lokhu kusebenza okubi kunenkinga yokuma okuhle, kanti ucingo lwethusi kuzovezwa kusontekile, noma ukuklwebheka noma amamaki anomthelela endaweni efanayo. Cwecwa ngocingo lwethusi engxenyeni enesici bese ubheka indawo enzima ye-foil ye-Copper, ungabona ukuthi umbala we-foil we-foil wethusi ujwayelekile, futhi ngeke kube khona ukugqwala okuhlangenwe nakho okubi, futhi amandla e-foil wethusi ajwayelekile.
3. I-Conb PCB Circuit Design
Ukuqamba amasekethe amancanyana ane-foil ye-Copper eliwugqinsi kuzokwenza futhi ukufakwa ngokweqile kwesifunda nokulahla ithusi.
B.Isizathu senqubo yama-laminate
Ngaphansi kwezimo ezijwayelekile, i-foil yethusi kanye ne-prepreg ihlanganiswe ngokuphelele inqobo nje uma ingxenye yokushisa ephezulu ye-laminate icindezelwe isikhathi esingaphezu kwemizuzu engama-30, ngakho-ke ukucindezela kuzovame ukungathinti amandla okubopha i-foil yethuli kanye ne-substrate ku-laminate. Kodwa-ke, kwinqubo yokufaka nokufaka ama-laminates, uma ukungcoliswa kwe-PP noma ukulimala kwe-post foil okulimazayo, kuzoholela ekuphambukeni okunganele phakathi kwe-foil yethusi kanye noma izintambo ze-foil ye-post
C. Izizathu zezinto zokwakha ze-limisani
1. Njengoba kushiwo ngenhla, ama-foil ajwayelekile we-electrolytic akhona yonke imikhiqizo eye yagcwala noma ikhompiyutha-plated ku-foil foil. Uma inani eliphakeme le-foil le-wool alinakujwayelekile ngesikhathi sokukhiqiza, noma lapho i-galvaning / ithusi lamagatsha ampofu, abangela amandla ethusi uqobo akwanele. Ngemuva kokuthi into ecindezelwe eshidekile ye-foil Lolu hlobo lokwenqatshwa kwethusi olubi ngeke lube nokugqwala okuhlangenwe nakho okusobala lapho ubheka ucingo lwethusi ukuze ubone indawo enzima ye-foil yethusi (okungukuthi, indawo yokuxhumana ne-foil ephelele yethusi izoba mpofu kakhulu.
2. Ukuguquguquka okungemuhle kwe-foil ye-copper ne-resin I-degree yokuwela iphansi iphansi, futhi kuyadingeka ukusebenzisa i-foil ye-Copper ngenani elikhethekile ukuze ulifafaze. I-foil ye-copper esetshenzisiwe ekukhiqizeni ama-lamin afaki uhlelo lwe-resin, okuholela ekutheni i-peel mandla enganele ye-foil yensimbi yensimbi-clad yensimbi, kanye nokuchithwa kocingo olungahambi kahle lapho kufakwa.