Imbobo yokuqhuba i-Via hole yaziwa nangokuthi ngembobo.Ukuze kuhlangatshezwane nezidingo zamakhasimende, ibhodi lesekethe ngembobo kufanele lixhunywe.Ngemva kokuzijwayeza okuningi, inqubo yokuxhuma ye-aluminium yendabuko iyashintshwa, futhi imaski ye-solder yebhodi lesifunda kanye nokuxhuma kuqedwa nge-mesh emhlophe.umgodi.Ukukhiqizwa okuzinzile kanye nekhwalithi ethembekile.
I-Via hole idlala indima yokuxhumana kanye nokuqhutshwa kwamasekhethi.Ukuthuthukiswa kwemboni yezogesi nakho kukhuthaza ukuthuthukiswa kwe-PCB, futhi kubeka phambili izidingo eziphakeme enqubweni yokukhiqiza ibhodi eliphrintiwe kanye nobuchwepheshe bokukhweza phezulu.Ubuchwepheshe bokuxhuma imbobo baba khona, futhi kufanele buhlangabezane nezidingo ezilandelayo ngesikhathi esifanayo:
(1) Kukhona ithusi embotsheni ye-via, futhi imaski ye-solder ingaxhunywa noma ingaxhunywa;
(2) Kumelwe kube nethayela nomthofu embotsheni yokungena, enesidingo esithile sokujiya (ama-microns angu-4), futhi kungabikho uyinki we-solder mask okufanele ungene embobeni, okubangela ukuba ubuhlalu bethayela bufihlwe embobeni;
(3) Imbobo yokuphumela ngaphandle kufanele ibe nembobo yepulaki ye-solder, ekhanyayo, futhi akumele ibe nezindandatho zikathayela, ubuhlalu bethayela, kanye nezidingo zokuthi flat.
Ngokuthuthukiswa kwemikhiqizo ye-elekthronikhi ekuqondeni "okulula, okuncane, okufushane, nokuncane", ama-PCB nawo athuthuke abe nokuminyana okuphezulu kanye nobunzima obukhulu.Ngakho-ke, inani elikhulu lama-PCB e-SMT kanye ne-BGA avele, futhi amakhasimende adinga ukuxhunywa lapho efaka izingxenye, ikakhulukazi okuhlanganisa imisebenzi emihlanu:
(1) Vimbela ithini ukuthi lingadluli endaweni yengxenye ngembobo ukuze kubangele ukujikeleza okufushane lapho i-PCB ithengiswa ngamagagasi;ikakhulukazi uma sibeka i-via ku-pad ye-BGA, kufanele siqale senze imbobo yepulaki bese sihlanganiswa ngegolide ukuze kube lula ukuhlanganisa i-BGA.
(2) Gwema izinsalela ezigelezayo emigodini;
(3) Ngemuva kokuthi ukunyuswa kwangaphezulu kwefekthri kagesi kanye nokuhlanganiswa kwezingxenye sekuqediwe, i-PCB kufanele ikhishwe ukuze yenze ingcindezi engalungile emshinini wokuhlola ukuze iqedele:
(4) Vimbela ukunamathisela kwe-solder okungaphezulu ukuthi kungagelezi embobeni, kubangele ukusoda okungamanga futhi kuthinte nokubekwa;
(5) Vimbela amabhola kathayela ukuthi angaphumi ngesikhathi sokusongezwa kwamagagasi, okubangela amasekhethi amafushane.
Ukufezekiswa Kwenqubo Yokuxhuma Imbobo Eqhuba
Kumabhodi okukhweza angaphezulu, ikakhulukazi ukukhwezwa kwe-BGA ne-IC, ipulaki yembobo kufanele ibe isicaba, ibe yi-convex futhi ibe yi-concave futhi ihlanganise noma isuse u-1mil, futhi akumele kube nethayela elibomvu onqenqemeni lwembobo;i-via hole ifihla ibhola likathayela, ukuze kufinyelelwe ikhasimende Ngokwezidingo, inqubo yokuxhuma ngembobo ingachazwa njengehlukahlukene, ukugeleza kwenqubo kude kakhulu, ukulawulwa kwenqubo kunzima, futhi uwoyela uvame ukwehla ngesikhathi izinga lokushisa lomoya oshisayo kanye nokuhlolwa kokumelana ne-solder yamafutha aluhlaza;izinkinga ezifana nokuqhuma kwamafutha ngemva kokuqina.Manje ngokuya ngezimo zangempela zokukhiqiza, izinqubo ezahlukahlukene zokuxhuma ze-PCB ziyafingqwa, futhi ezinye iziqhathaniso nezincazelo zenziwa kule nqubo kanye nezinzuzo kanye nokubi:
Qaphela: Isimiso sokusebenza sokulinganisa komoya oshisayo ukusebenzisa umoya oshisayo ukususa i-solder eningi ebusweni nasezimbotsheni zebhodi lesifunda eliphrintiwe, kanti i-solder esele iboshwe ngokulinganayo kumaphedi, imigqa ye-solder engavimbeli kanye namaphoyinti okupakisha angaphezulu, okuyindlela yokwelapha engaphezulu yebhodi lesifunda eliphrintiwe.
1. Inqubo yokuxhuma imbobo ngemva kokulinganisa komoya oshisayo
Ukugeleza kwenqubo yilokhu: imaski ye-solder yebhodi→HAL→umgodi wepulaki→ukwelapha.Inqubo yokungaxhumi yamukelwa ukukhiqizwa.Ngemuva kokuthi umoya oshisayo ulinganisiwe, isikrini seshidi le-aluminium noma isikrini sokuvimba uyinki sisetshenziselwa ukuqedela ukuxhuma ngembobo okudingeka ikhasimende kuzo zonke izinqaba.Uyinki wembobo yepulaki ungaba uyinki ozwela izithombe noma uyinki we-thermosetting.Endabeni yokuqinisekisa umbala ofanayo wefilimu emanzi, uyinki wembobo yepulaki kungcono kakhulu ukusebenzisa uyinki ofanayo nongaphezulu kwebhodi.Le nqubo ingaqinisekisa ukuthi izimbobo zokudlula ngeke zilahlekelwe uwoyela ngemva kokuba umoya oshisayo ulinganisiwe, kodwa kulula ukubangela ukuthi uyinki wokuxhuma ungcolise ibhodi futhi ungalingani.Amakhasimende athambekele ekuthengiseni okungamanga (ikakhulukazi ku-BGA) ngesikhathi sokunyuswa.Ngakho amakhasimende amaningi awayamukeli le ndlela.
2. Inqubo yokulinganisa umoya oshisayo wembobo yepulaki yangaphambili
2.1 Sebenzisa ishidi le-aluminium ukuze uxhume imbobo, uqinise, futhi upholishe ibhodi ukuze udlulise izithombe
Le nqubo yobuchwepheshe isebenzisa umshini wokumba olawula izinombolo ukuze kukhishwe ishidi le-aluminium elidinga ukuxhunywa ukuze kwenziwe isikrini, futhi ixhume izimbobo ukuze kuqinisekiswe ukuthi ukuxhuma ngembobo kugcwele.Uyinki wembobo yepulaki ungasetshenziswa noyinki we-thermosetting.Izici zayo kufanele zibe lukhuni kakhulu., Ukuncipha kwe-resin kuncane, futhi amandla okubopha ngodonga lwembobo kuhle.Inqubo yokugeleza ithi: ukwelashwa kwangaphambili → imbobo yokuxhuma → ipuleti lokugaya → ukudluliswa kwephethini → i-etching → imaski ye-solder yebhodi
Le ndlela ingaqinisekisa ukuthi imbobo yepulaki ye-via hole iyisicaba, futhi ngeke kube nezinkinga zekhwalithi njengokuqhuma kukawoyela kanye nokwehla kwamafutha onqenqemeni lwembobo lapho ilingana nomoya oshisayo.Kodwa-ke, le nqubo idinga ukujiya kwethusi okwesikhathi esisodwa ukuze ugqinsi lwethusi lodonga lwembobo luhlangabezane nezinga lekhasimende.Ngakho-ke, izidingo ze-copper plating ebhodini lonke ziphakeme kakhulu, futhi ukusebenza komshini wokugaya ipuleti nakho kuphakeme kakhulu, ukuqinisekisa ukuthi i-resin ebusweni bethusi isuswe ngokuphelele, futhi indawo yethusi ihlanzekile futhi ayingcolisiwe. .Amafekthri amaningi e-PCB awanayo inqubo yethusi ejiya ngesikhathi esisodwa, futhi ukusebenza kwemishini akuhlangabezani nezidingo, okuholela ekusetshenzisweni okuningi kwale nqubo kumafekthri e-PCB.
2.2 Ngemva kokuxhuma imbobo ngeshidi le-aluminium, phrinta ngokuqondile imaski ye-solder engaphezulu kwebhodi
Le nqubo isebenzisa umshini wokumba we-CNC ukukhipha ishidi le-aluminium elidinga ukuxhunywa ukwenza isikrini, ukulifaka emshinini wokuphrinta wesikrini ukuze uvale imbobo, futhi ulipake isikhathi esingengaphezu kwemizuzu engama-30 ngemva kokuqedwa kokuxhuma, futhi usebenzise isikrini se-36T ukuze uhlole ngokuqondile ingaphezulu lebhodi.Ukugeleza kwenqubo ithi: pre-treatment-plug hole-silk screen-pre-baking-exposure-development-curing
Le nqubo ingaqinisekisa ukuthi i-via hole imbozwe kahle ngamafutha, imbobo yepulaki isicaba, futhi umbala wefilimu emanzi uyahambisana.Ngemva kokuba umoya oshisayo ulinganisiwe, ungaqinisekisa ukuthi i-via hole ayifakwanga futhi ubuhlalu bethayela abufihlwa emgodini, kodwa kulula ukubangela uyinki emgodini ngemva kokuphulukiswa.Ama-soldering pads abangela ukuqina okuncane;ngemva kokuba umoya oshisayo ulinganiswe, imiphetho ye-bubble ye-vias futhi ilahlekelwe amafutha.Kunzima ukusebenzisa le nqubo ukulawula ukukhiqizwa, futhi kuyadingeka ukuthi onjiniyela bezinqubo basebenzise izinqubo ezikhethekile kanye nemingcele ukuqinisekisa ikhwalithi yezimbobo zamapulaki.
2.3 Ishidi le-aluminium lixhunywa emigodini, lithuthukiswe, lilashwe ngaphambili, futhi lipholishwe, bese imaski ye-solder yenziwa phezulu.
Sebenzisa umshini wokumba we-CNC ukuze ukhiphe ishidi le-aluminium elidinga izimbobo zokuxhuma ukuze wenze isikrini, ulifake emshinini wokuphrinta wesikrini se-shift ukuze uxhume izimbobo.Izimbobo zokuxhuma kufanele zigcwale futhi ziphumele ezinhlangothini zombili, bese ziqina futhi zigaye ibhodi ukuze liphathwe phezulu.Ukugeleza kwenqubo ithi: pre-treatment-plug hole-pre-baking-development-pre-curing-board surface solder mask
Ngoba le nqubo isebenzisa ukwelapha kwembobo yepulaki ukuze kuqinisekiswe ukuthi imbobo yepulaki ayilahlekelwa amafutha noma iqhume ngemva kwe-HAL, kodwa ngemva kwe-HAL, kunzima ukuxazulula ngokuphelele inkinga yokugcina ubuhlalu bethayela embobeni nethini embobeni, amakhasimende amaningi awakwamukeli.
2.4 Imaski ye-solder kanye nembobo yepulaki kuqedwa kanyekanye.
Le ndlela isebenzisa isikrini esingu-36T (43T), esifakwe emshinini wokuphrinta wesikrini, kusetshenziswa iphedi noma umbhede wezinzipho, futhi lapho uqeda ingaphezulu lebhodi, zonke izimbobo zokudlula ziyaxhunywa.Ukugeleza kwenqubo ithi: ukuphrinta kwesikrini-ngaphambi kokubhaka- -Pre-baking-exposure-development-curing.
Isikhathi senqubo sifushane futhi izinga lokusebenzisa imishini liphezulu.Ingaqinisekisa ukuthi izimbobo ze-via ngeke zilahlekelwe uwoyela ngemva kokulingana komoya oshisayo, futhi izimbobo ezidlulayo ngeke zifakwe ithini.Kodwa-ke, ngenxa yokusetshenziswa kwesikrini sikasilika ukuxhuma izimbobo, kunomoya omkhulu ezimbobeni., Umoya uyakhula futhi uhlephule imaski ye-solder, okuholela emigodini nokungalingani.Kuyoba khona inani elincane ngokusebenzisa izimbobo ezifihliwe ekulevelini komoya oshisayo.Njengamanje, ngemva kwenani elikhulu lokuhlolwa, inkampani yethu ikhethe izinhlobo ezahlukene zamayinki kanye ne-viscosity, yalungisa ukucindezelwa kokuphrinta kwesikrini, njll., futhi ngokuyisisekelo ixazulule ama-voids nokungalingani kwe-vias, futhi yamukele le nqubo yobuningi. ukukhiqiza.