Lapho uklama i-PCB, omunye wemibuzo eyisisekelo okufanele icatshangelwe uwukusebenzisa izidingo zemisebenzi yesifunda ukuthi ingakanani isendlalelo sezintambo, indiza ephansi kanye nendiza yamandla, kanye nongqimba lwezintambo zebhodi lesifunda eliphrintiwe, indiza ephansi namandla. ukunqunywa kwendiza kwenani lezendlalelo nomsebenzi wesekethe, ubuqotho besignali, i-EMI, i-EMC, izindleko zokukhiqiza nezinye izidingo.
Ngemiklamo eminingi, kunezidingo eziningi ezingqubuzanayo ezidingweni zokusebenza kwe-PCB, izindleko eziqondiwe, ubuchwepheshe bokukhiqiza, kanye nobunkimbinkimbi besistimu. Idizayini ene-laminated ye-PCB ngokuvamile iyisinqumo sokuyekethisa ngemva kokucabangela izici ezihlukahlukene. Amasekhethi edijithali anesivinini esikhulu kanye namasekhethi e-whisker ngokuvamile aklanywa ngamabhodi amaningi.
Nazi izimiso eziyisishiyagalombili zedizayini ye-cascading:
1. Dukugqama
Ku-PCB enezingqimba eziningi, kuvame ukuba nongqimba lwesiginali (S), indiza yokuphakela amandla (P) kanye nendiza ephansi (GND). Indiza yamandla kanye nendiza ye-GROUND ngokuvamile izindiza eziqinile ezingahlukanisiwe ezizohlinzeka ngendlela yamanje yokubuyisela okuphansi kwe-impedance yamanje yemigqa yesignali eseduze.
Iningi lezendlalelo zesignali zitholakala phakathi kwale mithombo yamandla noma izendlalelo zendiza eyisethenjwa ephansi, zakha imigqa enebhande elinganayo noma e-asymmetric. Izendlalelo ezingaphezulu neziphansi ze-PCB ye-multilayer ngokuvamile zisetshenziselwa ukubeka izingxenye kanye nenani elincane lezintambo. Izintambo zalezi zimpawu akufanele zibe zinde kakhulu ukunciphisa imisebe eqondile ebangelwa izintambo.
2. Thola indiza eyodwa yereferensi yamandla
Ukusetshenziswa kwe-decoupling capacitor kuyisinyathelo esibalulekile sokuxazulula ubuqotho bokunikezwa kwamandla. Ama-Decoupling capacitor angabekwa kuphela phezulu naphansi kwe-PCB. Umzila we-decoupling capacitor, i-solder pad, kanye ne-hole pass kuzothinta kakhulu umphumela we-decoupling capacitor, okudinga ukuthi umklamo kufanele ucabange ukuthi umzila we-decoupling capacitor kufanele ube mfushane futhi ube banzi ngangokunokwenzeka, futhi intambo exhunywe emgodini kufanele futhi kube mfushane ngangokunokwenzeka. Isibonelo, kumjikelezo wedijithali onesivinini esikhulu, kungenzeka ukuthi ubeke i-decoupling capacitor phezulu kwesendlalelo se-PCB, yabela ungqimba 2 kusekethe yedijithali enesivinini esikhulu (njengeprosesa) njengesendlalelo samandla, isendlalelo sesi-3. njengesendlalelo sesignali, kanye nosendlalelo 4 njengendawo enesivinini esiphezulu sokujikeleza kwedijithali.
Ukwengeza, kuyadingeka ukuqinisekisa ukuthi umzila wesignali oshayelwa idivayisi yedijithali enesivinini esikhulu ithatha ungqimba lwamandla afanayo nendiza eyireferensi, futhi lesi sendlalelo samandla siyisendlalelo samandla wedivayisi yedijithali enesivinini esikhulu.
3. Nquma indiza yereferensi yamandla amaningi
Indiza yereferensi yamandla amaningi izohlukaniswa izifunda eziningana eziqinile ezinama-voltage ahlukene. Uma ungqimba lwesignali luseduze nesendlalelo samandla amaningi, isignali yamanje kusendlalelo sesignali esiseduze izohlangana nendlela yokubuya engagculisi, ezoholela ezikhaleni endleleni yokubuya.
Kumasignali edijithali anesivinini esikhulu, lo mklamo ongenangqondo wendlela yokubuya ungabangela izinkinga ezinkulu, ngakho-ke kuyadingeka ukuthi izintambo zesignali yedijithali enesivinini esikhulu kufanele zibe kude nendiza yereferensi yamandla amaningi.
4.Nquma izindiza eziningi ezibhekisela phansi
Izindiza eziningi ezibhekisela emhlabathini (izindiza eziphansi) zinganikeza indlela enhle yokubuyisela yamanje ye-impedance ephansi, enganciphisa i-EMl yemodi evamile. Indiza ephansi kanye nendiza yamandla kufanele kuhlanganiswe ngokuqinile, futhi ungqimba lwesignali kufanele luhlanganiswe ngokuqinile endizeni eyireferensi eseduze. Lokhu kungafezwa ngokunciphisa ukujiya kwe-medium phakathi kwezingqimba.
5. Inhlanganisela yezintambo zokuklama ngokunengqondo
Izendlalelo ezimbili ezihlukaniswe umzila wesignali zibizwa ngokuthi "inhlanganisela yezintambo". Inhlanganisela yezintambo ezinhle kakhulu iklanyelwe ukugwema ukugeleza kwamanje okubuyayo kusuka endizeni eyireferensi kuya kwenye, kodwa kunalokho igeleza isuka endaweni eyodwa (ubuso) bendiza eyinkomba iye kwenye. Ukuze uqedele i-wiring eyinkimbinkimbi, ukuguqulwa kwe-interlayer ye-wiring akunakugwenywa. Uma isignali iguqulwa phakathi kwezendlalelo, okwamanje okubuyayo kufanele kuqinisekiswe ukuthi ihamba kahle isuka endizeni eyireferensi eyodwa iye kwenye. Emklamo, kunengqondo ukucabangela izendlalelo eziseduze njengenhlanganisela yezintambo.
Uma indlela yesignali idinga ukwelula izendlalelo eziningi, ngokuvamile akuyona idizayini enengqondo ukuyisebenzisa njengenhlanganisela yezintambo, ngenxa yokuthi indlela edlula izendlalelo eziningi ayibambeki kumaza abuyayo. Nakuba intwasahlobo ingancishiswa ngokubeka i-decoupling capacitor eduze nomgodi wokudlula noma ukunciphisa ubukhulu bendawo phakathi kwezindiza ezibhekisela kuyo, akuwona umklamo omuhle.
6.Ukusetha isiqondiso sezintambo
Uma isiqondiso sezintambo sisethwe kusendlalelo sesignali efanayo, kufanele iqinisekise ukuthi izikhombisi-ndlela eziningi zezintambo ziyahambisana, futhi kufanele zibe i-orthogonal eziqondisweni zezintambo zezendlalelo zesignali eziseduze. Isibonelo, isiqondiso sezintambo sesendlalelo esisodwa sesignali singasethwa kusiqondiso se-"Y-axis", futhi isiqondiso sezintambo kwesinye isendlalelo sesignali esiseduze singasethwa ku-"X-axis".
7. Akufakwe uhlaka olulinganayo
Kungatholakala ku-lamination ye-PCB eklanyelwe ukuthi umklamo we-lamination wakudala cishe cishe zonke izingqimba, kunokuba izendlalelo ezingavamile, lesi simo sibangelwa izici ezihlukahlukene.
Kusukela inqubo yokukhiqiza ephrintiwe wesifunda ibhodi, singazi ukuthi zonke ungqimba conductive ebhodini wesifunda igcinwa phezu ungqimba core, impahla ungqimba core ngokuvamile kabili emaceleni cladding ibhodi, lapho ukusetshenziswa ngokugcwele ungqimba core. , ungqimba lwe-conductive lwebhodi lesifunda eliphrintiwe lilingana
Ngisho namabhodi wesekethe aphrintiwe ungqimba anezinzuzo zezindleko. Ngenxa yokungabi bikho kongqimba lwemidiya nokuhlanganisa ithusi, izindleko zezingqimba ezinezinombolo ezingavamile zezinto zokusetshenziswa ze-PCB ziphansi kancane kunezindleko zezendlalelo ezilinganayo ze-PCB. Nokho, izindleko zokucubungula ze-ODd-ungqimba lwe-PCB ngokusobala ziphakeme kunalezo ze-PCB esendlalelo esilinganayo ngoba i-ODd-layer PCB idinga ukungeza inqubo yokubopha ungqimba oluwumgogodla we-laminated nonstandard ngesisekelo senqubo yesakhiwo sesendlalelo esiyinhloko. Uma kuqhathaniswa nesakhiwo esivamile sesendlalelo esiwumongo, ukwengeza ukuvala ithusi ngaphandle kwesakhiwo sesendlalelo esiyinhloko kuzoholela ekusebenzeni kahle kokukhiqiza kanye nomjikelezo omude wokukhiqiza. Ngaphambi kwe-laminating, ungqimba lwangaphandle lwangaphakathi ludinga ukucutshungulwa okwengeziwe, okwandisa ubungozi bokunwaya nokuhlukumeza ungqimba lwangaphandle. Ukwenyuka kokuphathwa kwangaphandle kuzonyusa kakhulu izindleko zokukhiqiza.
Lapho izingqimba zangaphakathi nezangaphandle zebhodi lesifunda eliphrintiwe zipholile ngemva kwenqubo yokuhlanganisa isekethe enezingqimba eziningi, ukungezwani okuhlukile kwe-lamination kuzokhiqiza amazinga ahlukene okugoba ebhodini lesifunda eliphrintiwe. Futhi njengoba ubukhulu bebhodi bukhula, ingozi yokugoba ibhodi lesifunda eliphrintiwe eliyinhlanganisela elinezakhiwo ezimbili ezihlukene liyakhula. Amabhodi esekethe anesendlalelo esingajwayelekile kulula ukugoba, kuyilapho amabhodi esekethe aphrintelwe ngisho nesendlalelo angagwema ukugoba.
Uma ibhodi lesifunda eliphrintiwe lakhiwe ngenani elingavamile lezendlalelo zamandla kanye nenani elilinganayo lezendlalelo zesignali, indlela yokwengeza izendlalelo zamandla ingamukelwa. Enye indlela elula iwukwengeza isendlalelo esiphansi phakathi kwesitaki ngaphandle kokushintsha ezinye Izilungiselelo. Okusho ukuthi, i-PCB ixhunywe ngezintambo ngenani eliyinqaba lezendlalelo, bese ungqimba oluphansi luphindwa kabili phakathi nendawo.
8. Ukucabangela Izindleko
Mayelana nezindleko zokukhiqiza, amabhodi wesekethe we-multilayer nakanjani abiza kakhulu kunamabhodi esekethe angama-single kanye ne-double layer anendawo efanayo ye-PCB, futhi izendlalelo eziningi, izindleko ziphezulu. Kodwa-ke, uma kucatshangelwa ukufezeka kwemisebenzi yesifunda kanye ne-miniaturization yebhodi lesifunda, ukuze kuqinisekiswe ubuqotho besignali, i-EMl, i-EMC nezinye izinkomba zokusebenza, amabhodi esekethe amaningi kufanele asetshenziswe ngangokunokwenzeka. Sekukonke, umehluko wezindleko phakathi kwamabhodi esekethe anezingqimba eziningi kanye namabhodi esekethe anesendlalelo esisodwa kanye nezingqimba ezimbili awuphezulu kakhulu kunalokho obekulindelwe.