1. I-plum blossom pad.
1: Imbobo yokulungisa idinga ukungenziwa ngensimbi. Ngesikhathi se-wave soldering, uma imbobo yokulungisa iyimbobo eyenziwe ngensimbi, ithini izovimba imbobo ngesikhathi sokuphinda kufakwe i-soldering.
2. Ukulungisa izimbobo ezifakwayo njengamaphedi e-quincunx ngokuvamile asetshenziselwa ukufaka imbobo yenethiwekhi ye-GND, ngoba ngokuvamile i-PCB yethusi isetshenziselwa ukubeka ithusi kunethiwekhi ye-GND. Ngemva kokufakwa kwezimbobo ze-quincunx nezingxenye zegobolondo le-PCB, empeleni, i-GND ixhunywe emhlabeni. Kwesinye isikhathi, igobolondo le-PCB lidlala indima yokuvikela. Yiqiniso, abanye abadingi ukuxhuma imbobo yokufaka kunethiwekhi ye-GND.
3. Imbobo yesikulufu sensimbi ingase iminyaniswe, okuholela esimweni somngcele oyiziro sokuphansi nokungagxili, okubangele isistimu ukuthi ingajwayelekile ngendlela eyinqaba. Imbobo ye-plum blossom, kungakhathaliseki ukuthi ingcindezi ishintsha kanjani, ingahlala igcina isikulufu sigxilile.
2. Iphedi lembali eliphambanayo.
Amaphedi ezimbali eziphambanayo nawo abizwa ngokuthi ama-thermal pads, ama-hot air pads, njll. Umsebenzi wawo ukunciphisa ukuchithwa kokushisa kwephedi ngesikhathi se-soldering, ukuze kuvinjelwe i-soldering ebonakalayo noma ukuxebuka kwe-PCB okubangelwa ukuchithwa kokushisa ngokweqile.
1 Lapho iphedi yakho isigayiwe. Iphethini ephambanayo inganciphisa indawo yocingo oluphansi, inciphise isivinini sokulahla ukushisa, futhi yenze kube lula ukushisela.
2 Uma i-PCB yakho idinga ukubekwa komshini kanye nomshini wokuphinda uthele amanzi, iphedi yephethini ephambanayo ingavimbela i-PCB ukuthi ingaxebuki (ngoba kudingeka ukushisa okwengeziwe ukuze kuncibilike unamathisele we-solder)
3. i-teardrop pad
Izinyembezi ziyizixhumanisi eziconsayo ngokweqile phakathi kwephedi nentambo noma intambo kanye ne-via. Inhloso ye-teardrop ukugwema indawo yokuxhumana phakathi kwentambo nephedi noma intambo kanye ne-via lapho ibhodi lesifunda lishaywa amandla amakhulu angaphandle. Nqamula, ngaphezu kwalokho, isethi yezinyembezi ingenza futhi ibhodi lesifunda le-PCB libukeke lilihle kakhulu.
Umsebenzi we-teardrop ukugwema ukwehla okungazelelwe kobubanzi bomugqa wesignali futhi kubangele ukubonakaliswa, okungenza ukuxhumana phakathi kwe-trace kanye nengxenye ye-pad kube inguquko ebushelelezi, futhi kuxazulule inkinga yokuthi uxhumano phakathi kwephedi kanye ne-trace ephukile kalula.
1. Uma i-soldering, ingavikela i-pad futhi igweme ukuwa kwe-pad ngenxa ye-solder eminingi.
2. Qinisa ukwethembeka koxhumano (ukukhiqiza kungagwema ukushumeka okungalingani, imifantu ebangelwa ukuchezuka, njll.)
3. I-impedance ebushelelezi, yehlisa ukugxuma okubukhali kwe-impedance
Ekwakhiweni kwebhodi lesifunda, ukuze kwenziwe i-pad ibe namandla futhi ivimbele i-pad kanye nocingo ekunqanyulweni ngesikhathi sokwenziwa kwebhodi ngomshini, ifilimu yethusi ivame ukusetshenziselwa ukuhlela indawo yoshintsho phakathi kwephedi nocingo. , elimise okwenkephe, ngakho livame ukubizwa ngokuthi Izinyembezi (Izinyembezi)
4. igiya lokukhipha
Uke wazibona izinto zamandla ezishintshayo zabanye abantu zigodlwe ngamabomu ucwecwe lwethusi olungenalutho lwe-sawtooth ngaphansi kwe-inductance yemodi evamile? Uyini umphumela othize?
Lokhu kubizwa ngokuthi izinyo lokuphuma, igebe lokuphuma noma igebe lenhlansi.
Igebe lenhlansi yipheya likanxantathu elinama-engeli abukhali akhomba omunye komunye. Ibanga elikhulu phakathi kweminwe yi-10mil kanti ubuncane bungu-6mil. I-delta eyodwa iphansi, kanti enye ixhunywe kulayini wesignali. Lonxantathu akayona ingxenye, kodwa wenziwa ngokusebenzisa izendlalelo ze-copper foil kunqubo yomzila we-PCB. Labonxantathu badinga ukusetha ungqimba olungaphezulu lwe-PCB (i-componentside) futhi abakwazi ukumbozwa imaski ye-solder.
Esivivinyweni sokushintsha amandla kagesi noma ukuhlolwa kwe-ESD, amandla kagesi aphezulu azokhiqizwa kuzo zombili iziphetho ze-inductor yemodi evamile futhi i-arcing izokwenzeka. Uma iseduze nemishini ezungezile, imishini ezungezile ingase yonakale. Ngakho-ke, ithubhu yokukhipha noma i-varistor ingaxhunywa ngokuhambisana ukuze inciphise i-voltage yayo, ngaleyo ndlela idlala indima yokucima i-arc.
Umphumela wokubeka izinto zokuvikela umbani muhle kakhulu, kodwa izindleko ziphakeme kakhulu. Enye indlela yokwengeza amazinyo okukhipha kuzo zombili iziphetho ze-inductor yemodi evamile ngesikhathi sokuklanywa kwe-PCB, ukuze i-inductor ikhiphe ngamathiphu amabili okukhipha, igweme ukukhishwa ngezinye izindlela, ukuze okuzungezile Kanye nomthelela wamadivayisi wesiteji sakamuva kuncishiswe.
Igebe lokukhipha alidingi izindleko ezengeziwe. Ingadonswa lapho udweba ibhodi le-pcb, kodwa kubalulekile ukuqaphela ukuthi lolu hlobo lwegebe lokukhipha luyigebe lokukhipha umoya, elingasetshenziswa kuphela endaweni lapho i-ESD ikhiqizwa khona ngezikhathi ezithile. Uma isetshenziswa ezikhathini lapho i-ESD ivela khona kaningi, amadiphozithi ekhabhoni azokhiqizwa ezindaweni ezimbili ezingonxantathu phakathi kwezikhala zokuphuma ngenxa yokuphuma kaningi, okuzogcina kubangele ukujikeleza okufushane esikhaleni sokukhipha futhi kubangele i-short-circuit yesiginali. umugqa phansi. Okuholela ekuhlulekeni kwesistimu.