Imbobo yokuqhuba i-Via hole yaziwa nangokuthi ngembobo. Ukuze kuhlangatshezwane nezidingo zamakhasimende, ibhodi lesekhethi ngembobo kufanele lixhunywe. Ngemva kokuzijwayeza okuningi, inqubo yokuxhuma i-aluminium yendabuko iyashintshwa, futhi imaski ye-solder yebhodi lesifunda kanye nokuxhuma kuqedwa nge-mesh emhlophe. umgodi. Ukukhiqizwa okuzinzile kanye nekhwalithi ethembekile.
I-Via hole idlala indima yokuxhuma kanye nokuqhutshwa kwemigqa. Ukuthuthukiswa kwemboni yezogesi nakho kukhuthaza ukuthuthukiswa kwe-PCB, futhi kubeka phambili izidingo eziphakeme enqubweni yokukhiqiza ibhodi eliphrintiwe kanye nobuchwepheshe bokukhweza phezulu. Ubuchwepheshe bokuxhuma imbobo baba khona, futhi kufanele buhlangabezane nezidingo ezilandelayo:
(1) Kunethusi kuphela emgodini, futhi isifihla-buso singaxhunywa noma singaxhunywanga;
(2) Kumelwe kube nethayela nomthofu embotsheni yokungena, enesidingo esithile sokujiya (ama-microns angu-4), futhi kungabikho uyinki we-solder mask okufanele ungene embobeni, okubangele ubuhlalu bethayela emgodini;
(3) Izimbobo zokuphumela ngaphandle kufanele zibe nezimbobo zepulaki yepulaki yemaski ye-solder, i-opaque, futhi akumele zibe namasongo kathayela, ubuhlalu bethayela, kanye nezidingo zokuthi flat.
Ngokuthuthukiswa kwemikhiqizo ye-elekthronikhi ekuqondeni "okulula, okuncane, okufushane nokuncane", ama-PCB nawo athuthuke ekuminyana okuphezulu kanye nobunzima obukhulu. Ngakho-ke, inani elikhulu lama-PCB e-SMT kanye ne-BGA avele, futhi amakhasimende adinga ukuxhunywa lapho efaka izingxenye, ikakhulukazi imisebenzi emihlanu:
(1) Vimbela ukujikeleza okufushane okubangelwa ithini elidlula endaweni esuka embotsheni lapho i-PCB ithengiswa ngamagagasi; ikakhulukazi uma sibeka i-via hole kuphedi ye-BGA, kufanele siqale senze imbobo yepulaki bese sinamathisela igolide ukuze kube lula ukuhlanganisa i-BGA.
(2) Gwema izinsalela ezigelezayo emigodini;
(3) Ngemuva kokuthi ukunyuswa kwangaphezulu kwefekthri kagesi kanye nokuhlanganiswa kwezingxenye sekuqediwe, i-PCB kufanele ikhishwe ukuze yenze ingcindezi engalungile emshinini wokuhlola ukuze iqedele:
(4) Vimbela ukunamathisela kwe-solder okungaphezulu ukuthi kungagelezi embobeni, kubangele ukusoda okungamanga futhi kuthinte nokubekwa;
(5) Vimbela ubuhlalu bethayela bungaphumi ngesikhathi sokusongezwa kwamagagasi, okubangela amasekhethi amafushane.
Ukugcwaliseka kwenqubo yokuxhuma imbobo ye-conductive
Kumabhodi okukhweza angaphezulu, ikakhulukazi i-BGA ne-IC, amapulagi angena ngembobo kufanele abe isicaba, abe yi-convex futhi abe yi-concave plus noma susa u-1mil, futhi akumele kube khona ithani elibomvu onqenqemeni lwembobo edlula; i- via hole ifihla ibhola likathayela, ukuze kufinyelelwe amakhasimende Inqubo yokuxhuma ngezimbobo ingachazwa njengehlukahlukene. Ukugeleza kwenqubo kude ikakhulukazi futhi ukulawula inqubo kunzima. Kuvame ukuba nezinkinga ezifana nokwehla kwamafutha ngesikhathi sokulinganisa komoya oshisayo kanye nokuhlolwa kokumelana ne-solder kawoyela oluhlaza; ukuqhuma kwamafutha ngemva kokwelapha. Manje ngokuya ngezimo zangempela zokukhiqiza, izinqubo ezahlukahlukene zokuxhuma ze-PCB ziyafingqwa, futhi ezinye iziqhathaniso nezincazelo zenziwa kule nqubo kanye nezinzuzo kanye nokubi:
Qaphela: Isimiso sokusebenza sokulinganisa komoya oshisayo ukusebenzisa umoya oshisayo ukususa i-solder eningi ebusweni nasezimbotsheni zebhodi lesifunda eliphrintiwe, kanti i-solder esele iboshwe ngokulinganayo kumaphedi, imigqa ye-solder engavimbeli kanye namaphoyinti okupakisha angaphezulu, okuyindlela yokwelapha engaphezulu yebhodi lesifunda eliphrintiwe.
1. Inqubo yokuxhuma ngemva kokulinganisa komoya oshisayo
Ukugeleza kwenqubo yilokhu: imaski ye-solder yebhodi→HAL→umgodi wepulaki→ukwelapha. Inqubo yokungaxhumi yamukelwa ukukhiqizwa. Ngemva kokulinganisa komoya oshisayo, isikrini seshidi le-aluminium noma isikrini sokuvimbela inki sisetshenziselwa ukuqedela ukuxhuma ngembobo okudingeka amakhasimende kuzo zonke izinqaba. Uyinki wokuxhuma ungaba uyinki we-photosensitive noma uyinki we-thermosetting. Endabeni yokuqinisekisa umbala ofanayo wefilimu emanzi, kungcono ukusebenzisa inki efanayo nebhodi lebhodi. Le nqubo ingaqinisekisa ukuthi izimbobo ezidlulayo ngeke zilahlekelwe uwoyela ngemva kokuba umoya oshisayo ulinganisiwe, kodwa kulula ukubangela ukuthi uyinki wembobo yepulaki ungcolise ingaphezulu lebhodi futhi ungalingani. Amakhasimende athambekele ekuthengiseni okungamanga (ikakhulukazi ku-BGA) ngesikhathi sokunyuswa. Ngakho amakhasimende amaningi awayamukeli le ndlela.
2. Ukulinganisa komoya oshisayo kanye nenqubo yokuxhuma
2.1 Sebenzisa ishidi le-aluminium ukuze uxhume imbobo, uqinise, futhi upholishe ibhodi ukuze udlulise isithombe
Le nqubo yobuchwepheshe isebenzisa umshini wokumba we-CNC ukukhipha ishidi le-aluminium elidinga ukuxhunywa ukwenza isikrini, bese uxhuma imbobo ukuze uqinisekise ukuthi imbobo ye-via igcwele. Uyinki wembobo yepulaki ungasetshenziswa noyinki we-thermosetting, futhi izici zawo kufanele zibe namandla. , Ukuncipha kwe-resin kuncane, futhi amandla okubopha ngodonga lwembobo kuhle. Ukugeleza kwenqubo ithi: ukwelashwa kwangaphambili → imbobo yepulaki → ipuleti lokugaya → ukudluliswa kwephethini → i-etching → imaski ye-solder yebhodi. Le ndlela ingaqinisekisa ukuthi imbobo yepulaki ye-via hole iyisicaba, futhi ngeke kube nezinkinga zekhwalithi njengokuqhuma kukawoyela kanye nokwehla kwamafutha onqenqemeni lwembobo ngesikhathi sokulinganisa komoya oshisayo. Kodwa-ke, le nqubo idinga ukujiya kwethusi okwesikhathi esisodwa ukuze ugqinsi lwethusi lodonga lwembobo luhlangabezane nezinga lekhasimende. Ngakho-ke, izidingo ze-copper plating yayo yonke ipuleti ziphakeme kakhulu, futhi ukusebenza komshini wokugaya ipuleti nakho kuphakeme kakhulu, ukuqinisekisa ukuthi i-resin ebusweni bethusi isuswe ngokuphelele, futhi indawo yethusi ihlanzekile futhi ayingcolisiwe. . Amafekthri amaningi e-PCB awanayo inqubo yethusi ejiya ngesikhathi esisodwa, futhi ukusebenza kwemishini akuhlangabezani nezidingo, okuholela ekusetshenzisweni okuningi kwale nqubo kumafekthri e-PCB.
2.2 Ngemva kokuxhuma imbobo ngeshidi le-aluminium, phrinta ngokuqondile imaski ye-solder engaphezulu kwebhodi
Le nqubo isebenzisa umshini wokumba we-CNC ukukhipha ishidi le-aluminium elidinga ukuxhunywa ukwenza isikrini, ukulifaka emshinini wokuphrinta wesikrini ukuze lixhunywe, bese ulipake imizuzu engeqile kwengama-30 ngemva kokuqeda ukuxhuma, bese usebenzisa i-36T. isikrini ukuze sihlole ngqo ubuso bebhodi. Ukugeleza kwenqubo yilokhu: i-pretreatment-plug hole-silk screen-pre-baking-exposure-development-curing
Le nqubo ingaqinisekisa ukuthi i-via hole imbozwe kahle ngamafutha, imbobo yepulaki isicaba, nombala wefilimu omanzi uyahambisana. Ngemuva kokuthi umoya oshisayo ulinganisiwe, ungaqinisekisa ukuthi i-via hole ayifakwanga, futhi imbobo ayifihli ubuhlalu be-tin, kodwa kulula ukubangela uyinki emgodini ngemva kokuphulukisa Amaphedi okunamathisela abangela ukungahambi kahle; ngemva kokuba umoya oshisayo ulinganisiwe, imiphetho ye-vias iqhuma futhi amafutha asusiwe. Kunzima ukusebenzisa le nqubo ukulawula ukukhiqizwa, futhi kuyadingeka ukuthi onjiniyela bezinqubo basebenzise izinqubo ezikhethekile kanye nemingcele ukuqinisekisa ikhwalithi yezimbobo zamapulaki.
2.3 Ishidi le-aluminium lixhunywa embobeni, lithuthukiswe, lilashwe ngaphambili, futhi lipholishwe, bese kwenziwa imaski ye-solder engaphezulu.
Sebenzisa umshini wokumba we-CNC ukuze ukhiphe ishidi le-aluminium elidinga izimbobo zokuxhuma ukuze wenze isikrini, ulifake emshinini wokuphrinta wesikrini se-shift ukuze uxhume izimbobo. Izimbobo zokuxhuma kufanele zigcwale futhi ziphumele ezinhlangothini zombili, bese ziqina futhi zigaye ibhodi ukuze liphathwe phezulu. Ukugeleza kwenqubo ithi: pre-treatment-plug hole-pre-baking-development-pre-curing-board surface solder mask. Ngenxa yokuthi le nqubo isebenzisa ukupholisa imbobo yepulaki ukuze kuqinisekiswe ukuthi imbobo edlulayo ayiwi noma ayiqhumi ngemva kwe-HAL, kodwa ngemva kwe-HAL, ubuhlalu bukathini obufihlwe ngezimbobo kanye nethayela buvulwe ngezimbobo kunzima ukubuxazulula ngokuphelele, ngakho amakhasimende amaningi akabamukeli.
2.4 Imaski ye-solder ebusweni bebhodi kanye nembobo yepulaki kuqedwa kanyekanye.
Le ndlela isebenzisa isikrini esingu-36T (43T), esifakwe emshinini wokuphrinta wesikrini, kusetshenziswa i-backing plate noma umbhede wezinzipho, ngenkathi uqedela indawo yebhodi, xhuma zonke izimbobo, ukugeleza kwenqubo yilokhu: isikrini se-pretreatment-silk- -Pre- ukubhaka-ukuchayeka-ukuthuthukiswa-ukwelapha. Isikhathi senqubo sifushane, futhi izinga lokusebenzisa imishini liphezulu. Kungaqinisekisa ukuthi izimbobo ezidlulayo ngeke zilahlekelwe uwoyela futhi izimbobo ezidlulayo ngeke zifakwe ithini ngemva kokuba umoya oshisayo ulinganiswe, kodwa ngenxa yokuthi isikrini sikasilika sisetshenziselwa ukuxhuma , Kukhona inani elikhulu lomoya ku-vias. Ngesikhathi sokwelashwa, umoya uyakhula futhi udabule imaski ye-solder, okubangela imigodi nokungalingani. Kuzoba nenani elincane likathayela emigodini yokulinganisa umoya oshisayo. Njengamanje, ngemva kwenani elikhulu lokuhlolwa, inkampani yethu ikhethe izinhlobo ezahlukene zamayinki kanye ne-viscosity, yalungisa ukucindezelwa kokuphrinta kwesikrini, njll., futhi ngokuyisisekelo ixazulule ama-voids nokungalingani kwe-vias, futhi yamukele le nqubo yobuningi. ukukhiqiza.