Umgodi ophethe ngomgodi waziwa nangokuthi nge-hole. Ukuze uhlangabezane nezidingo zamakhasimende, ibhodi yesekethe ngombala kufanele ixhunywe. Ngemuva kokuzijwayeza okuningi, inqubo yendabuko ye-aluminium pluving iguquliwe, futhi i-mask yesekethe ye-salder ye-porgity ye-plug iphothulwa nge-mesh emhlophe. hole. Ukukhiqizwa okuzinzile nekhwalithi ethembekile.
Nge-Via Hole idlala indima yokuxhumana nokuhlangana kwemigqa. Ukuthuthukiswa komkhakha we-elekthronikhi nakho kukhuthaza ukuthuthukiswa kwe-PCB, futhi kubeka nezidingo eziphakeme phambili kwinqubo yokukhiqiza yeBhodi ephrintiwe kanye ne-Surface Mount Technology. Ngobuchwepheshe be-Phole Plugging bangene, futhi kufanele bahlangabezane nezidingo ezilandelayo:
(1) Kukhona ithusi kuphela ku-hole, futhi imaskhi ye-solder ingaxhunywa noma ingaxhunyiwe;
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Ngokuthuthukiswa kwemikhiqizo ye-elekthronikhi ekuqondeni "kokukhanya, mncane, amafushane futhi amancane", ama-PCB nawo athuthukiswe ekubuthakathaka okuphezulu nobunzima obuphezulu. Ngakho-ke, inani elikhulu le-SMT ne-BGA PCBS selivele, futhi amakhasimende adinga ukufakwa lapho kukhuphuka khona izinto, ikakhulukazi imisebenzi emihlanu:
. Ikakhulu lapho sibeka umgodi we-via kwi-BGA Pad, kufanele siqale ngenze umgodi we-plug bese uthwebula igolide ukuze wenze lula i-BGA Soldering.
(2) Gwema izinsalela ze-Flux ezigodini ze-Via;
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(5) Vikela ubuhlalu be-tin kusuka ekuqhumeni ngesikhathi sokuthengisa amagagasi, kubangele amasekethe amafushane.
Ukuqaphela inqubo yokuhambisa umgodi evuthayo
Kwamabhodi e-Surface Mount, ikakhulukazi ama-BGA nokubekwa kwe-IC, ama-Via Hole plugs kumele abe yisicaba, i-convex kanye ne-concave plus noma i-an cursil, futhi akumelwe kube ne-tin ebomvu emaphethelweni omgodi we-via; I-Via Hole ifihla ibhola le-tin, ukuze lifinyelele kumakhasimende inqubo yokuxhumanisa ngezimbobo zingachazwa zihlukahlukene. Ukugeleza kwenqubo kudala futhi inqubo yokulawula inqubo inzima. Kunezinkinga ezivame ukudonsa kawoyela ngesikhathi sokushisa komoya okushisayo kanye nokuhlolwa okuqinile komoya okuluhlaza; Ukuqhuma kwamafutha ngemuva kokuphulukisa. Manje ngokuya ngezimo zangempela zokukhiqiza, izinqubo ezahlukahlukene zokuxhuma ze-PCB zifingqiwe, futhi ukuqhathanisa okuthile nezincazelo zenziwa kwinqubo kanye nezinzuzo nokubi:
Qaphela: Umgomo osebenzayo we-Hot Air Leveling ukusebenzisa umoya oshisayo ukuze ususe i-solder eyeqile kusuka ebusweni nasezimbozweni zebhodi yokujikeleza ephrintiwe, futhi imigqa ye-solder engahambisani ihlanganiswe emaphaketheni, indawo yokupakisha engahambisani nayo, okuyindlela yokwelashwa engaphezulu, okuyindlela yokwelashwa engaphezulu kweyokwelashwa yebhodi yesekethe ephrintiwe eyodwa.
1. Inqubo yokufaka phakathi ngemuva kokushisa komoya okushisayo
Ukugeleza kwenqubo yile: Board Surder Soler Mask → Hal → I-Plug Hole → Ukwelapha. Inqubo engaxhunyiwe ku-pluving yamukelwa ukukhiqizwa. Ngemuva kokushisa komoya okushisayo, isikrini se-aluminium sheet noma isikrini sokuvinjwa kwe-ink sisetshenziselwa ukuqedela i-via hole plug edingwa amakhasimende kuzo zonke izinqaba. I-ink yokufaka i-ink ingaba yinki noma i-ink ye-thermosetting. Endabeni yokuqinisekisa umbala ofanayo wefilimu emanzi, kungcono ukusebenzisa i-ink efanayo ne-board yebhodi. Le nqubo ingaqinisekisa ukuthi izimbobo ngeke zilahlekelwe uwoyela ngemuva kokuthi umoya oshisayo ukhungathekile, kepha kulula ukudala i-ink ye-plug ink ukungcolisa indawo yebhodi futhi ongalingani. Amakhasimende athambekele ekuthengisweni kwamanga (ikakhulukazi ku-BGA) ngesikhathi sokukhwela. Amakhasimende amaningi kangaka awamukeli le ndlela.
2. I-Hot Air Leveling and Proging Process
2.1 Sebenzisa i-Aluminium Sheet ukuze uxhume umgodi, uqinise, futhi uPolish ibhodi lokudluliswa kwezithombe
Le nqubo yezobuchwepheshe isebenzisa umshini wokumba umgodi we-CNC ukumba ishidi le-aluminium elidinga ukuxhunywa ukuze kwenziwe isikrini, futhi lixhume umgodi ukuze uqinisekise ukuthi umgodi we-via ugcwele. I-plug hole uyinki nayo ingasetshenziswa nge-thermosetting ink, futhi izici zayo kumele ziqine. , I-shrinkage ye-resin incane, futhi amandla obugqila ngodonga lomgodi muhle. Ukugeleza kwenqubo yilena: Ukwelashwa kwangaphambi kokwelashwa → I-Plug Hole → Plate Plate → Ukudluliswa Kwephethini Le ndlela ingaqinisekisa ukuthi umgodi we-plug we-via hole uyisicaba, futhi ngeke kube nezinkinga zekhwalithi ezinjengokuqhuma kwamafutha kanye nowoyela wehla emaphethelweni omgodi ngesikhathi sokushisa komoya oshisayo. Kodwa-ke, le nqubo idinga ukuqina kwesikhashana kwethusi ukwenza ukuqina kodonga lwe-hole kuhlangabezane nezinga lekhasimende. Ngakho-ke, izidingo zeplatiso yethusi yepuleti ziphezulu kakhulu, futhi ukusebenza komshini wokugaya ipuleti nakho kuphakeme kakhulu, ukuqinisekisa ukuthi i-resin ebusweni bethusi isuswe ngokuphelele, futhi indawo yethusi ihlanzekile futhi ingahlanzekile. Amafektri amaningi we-PCB awanayo inqubo yokuqina ye-Copper yesikhathi esisodwa, futhi ukusebenza kwemishini akuhlangabezani nezidingo, okuholela ekusetshenzisweni kwale nqubo kumafektri e-PCB.
2.2 Ngemuva kokuxhuma umgodi nge-aluminium sheet, phrinta ngqo isikrini sebhodi lomthengisi
Le nqubo isebenzisa umshini wokushayela i-CNC ukumba ishidi le-aluminium elidinga ukuxhunywa ukuze kwenziwe isikrini, likufake emshinini wokuphrinta wesikrini ukuze kube nemizuzu engama-30 ngemuva kokuqeda ukufakwa kwebhodi. Ukugeleza kwenqubo yile: PlTRETHENTCHERY-PLUL HOOL-SILK Screen-Ukuvezwa Kokuvezwa - Ukuthuthukiswa Kwentuthuko
Le nqubo ingaqinisekisa ukuthi i-Via Hole imbozwe kahle ngamafutha, umgodi we-plug uyisicaba, kanti umbala wefilimu omanzi awuguquki. Ngemuva kokuthi umoya oshisayo udwetshwe, kungaqinisekisa ukuthi umgodi we-via awukhonjwanga, futhi umgodi awufihli ubuhlalu be-tin, kodwa kulula ukudala uyinki emgodini ngemuva kokuqhuma amaphakethe abambekayo; Ngemuva kokuthi umoya oshisayo uveziwe, imiphetho ye-vias icwebezelwe futhi uwoyela uyasuswa. Kunzima ukusebenzisa le nqubo ukulawula ukukhiqizwa, futhi kuyadingeka ukuthi ukucubungula onjiniyela ukusebenzisa izinqubo ezikhethekile namapharamitha ukuqinisekisa ikhwalithi yezimbobo ze-plua.
2.3 Iphepha le-aluminium lixhunyiwe emgodini, athuthukisiwe, aphulukiswe ngaphambili, aphoqelekile, bese kwenziwa imaski yomthengisi.
Sebenzisa umshini wokushayela we-CNC ukuze ukhiphe ishidi le-aluminium elidinga izimbobo ezixhunyiwe ukwenza isikrini, ulifake emshinini wokuphrinta wesikrini we-Shift Screen ngezimbobo ezixhunyiwe. Izimbobo ezixhunyiwe kumele zigcwale futhi zivikeleke kuzo zombili izinhlangothi, bese ziqinisa bese zigaya iBhodi yokwelashwa komhlaba. Ukugeleza kwenqubo yilena: Pre-Treality-Plug Hole-Development-Development-Development-Development-Development-Squing-Board Surger-Board SORTER-BODE ORVE-BODE SORTER MAST. Ngenxa yokuthi le nqubo isebenzisa umgodi we-plug efebe ukuqinisekisa ukuthi i-hole alahle noma iqhume ngemuva kwe-hal, kepha ngemuva kwe-hal, kepha ngemuva kwe-HIT, ama-tin ubuhlalu afihlekile ngezimbobo ze-tin kunzima ukuwaxazulula ngokuphelele, amakhasimende amaningi angabemukeli.
2.4 Ibhodi lomthengisi we-solder solder kanye nomgodi we-plug uqediwe ngasikhathi sinye.
Le ndlela isebenzisa isikrini se-36t (43t), efakwe emshinini wokuphrinta wesikrini, usebenzisa ipuleti elisekelayo noma umbhede wezipikili, ukuqeda konke ngokusebenzisa izimbobo, ukugeleza kwesikrini se-Screen--Prest- Isikhathi senqubo sifushane, futhi izinga lokusetshenziswa kwemishini liphezulu. Kungaqinisekisa ukuthi ngezimbobo ngeke zilahlekelwe uwoyela futhi ngokusebenzisa izimbobo ngeke zikhishwe ngemuva komoya oshisayo zisetshenzisiwe, kepha ngoba isikrini se-silk sisetshenziselwa ukufakwa, kukhona umoya omkhulu ovela ku-vias. Ngesikhathi sokwelapha, umoya uyanda futhi wephule imaskhi yomthengisi, ebangela imithambo nokungalingani. Kuzoba nenani elincane le-tin ngokusebenzisa izimbobo zokushisa komoya okushisayo. Njengamanje, ngemuva kwesibalo esikhulu sezivivinyo, inkampani yethu ikhethe izinhlobo ezahlukene ze-inks kanye ne-viscosity, yalungisa ingcindezi yokuphrinta kwesikrini, njll., Futhi ngokuyisisekelo ixazululwe le nqubo yokukhiqizwa kwabantu abaningi.