Uyini umehluko phakathi kwe-PCB ye-HDI ne-PCB ejwayelekile?

Uma kuqhathaniswa namabhodi okujikeleza ajwayelekile, amabhodi wesifunda HDI anomehluko olandelayo nezinzuzo:

1.Size nesisindo

I-HDI Board: Kuncane futhi kube lula. Ngenxa yokusetshenziswa kwe-wiring ephezulu-density kanye ne-firener line wire spacecing, amabhodi e-HDI angafinyelela umklamo othe xaxa.

Ibhodi Yesekethe Ejwayelekile: Imvamisa inkulu futhi isindayo, ilungele izidingo ezilula neziphansi ze-wiring.

I-2.material nesakhiwo

I-HDI Circuity Board: Imvamisa sebenzisa amaphaneli ambaxambili njengebhodi eliyisisekelo, bese wenza isakhiwo sengqimba esiningi ngokugcwala okuqhubekayo, okwaziwa ngokuthi "Bum" ukunqwabelana kwezendlalelo eziningi (ubuchwepheshe bokupakisha wesifunda). Ukuxhumeka ngogesi phakathi kwezendlalelo kutholakala ngokusebenzisa izimbobo eziningi ezincane nezingcwatshwe.

Ibhodi Yesekethe Ejwayelekile: Isakhiwo sendabuko ehlukahlukene ikakhulukazi sixhumeka phakathi komgodi, futhi umgodi oboshelwe izimpumputhe nawo ungasetshenziswa ukufeza ukuxhumana kukagesi phakathi kwezendlalelo, kepha ukwakheka kwawo kukhulu, futhi i-wiring density iphansi, okulungele izidingo zesicelo esiphansi.

Inqubo ye-3.Production

IBhodi Yesekethe ye-HDI: Ukusetshenziswa kwe-Laser Direct Drilling Technology, kungafinyelela i-aperture encane yezimbobo eziyimpumputhe nezimbobo ezingcwatshwe, ukuthambekela ngaphansi kwe-150um. Ngasikhathi sinye, izidingo zokulawulwa kokunemba kwe-hole isikhundla, izindleko nokusebenza kahle kokukhiqiza ziphakeme.

Ibhodi Yesekethe Ejwayelekile: Ukusetshenziswa okuyinhloko kobuchwepheshe bokumba ngomshini, i-aperture kanye nenombolo yezendlalelo kuvame ukuba mkhulu.

Ubuningi be-4.wiring

I-HDI Circuity Board: I-wiring density iphakeme, ububanzi be-line kanye nebanga lomugqa ngokuvamile abungabi ngaphezu kwe-76.2um, kanye ne-welding contact point density inkulu kunesentimitha engu-50.

Ibhodi Yesekethe Ejwayelekile: Ububanzi be-wiring obuphansi, ububanzi obubanzi obubanzi kanye nebanga le-line, i-welding point contact point.

I-5.

Amabhodi we-HDI: Ubukhulu obungqimba be-dielectric buncana, imvamisa ngaphansi kwama-800Um, futhi ukufana kokulingana kuphezulu, ikakhulukazi emabhodini anobunzima kanye nama-substrates ahlanganisiwe ngokulawulwa kokulimala kokulimala

Ibhodi Yesekethe Ejwayelekile: Ubukhulu obuhle be-dielectric bukhulu, futhi izidingo zokulingana ukulingana ziphansi.

I-6.Electrical Perforty

IBhodi Yesekethe ye-HDI: inokusebenza okungcono kukagesi, ingathuthukisa amandla esibonakaliso nokwethembeka, futhi inentuthuko enkulu ekuphazanyisweni kwe-RF, ukuphazamiseka kwe-electromagnetic, ukukhishwa kwe-elermostatic, ukusebenza okushisayo nokunye.

Ibhodi Yesekethe Ejwayelekile: Ukusebenza kukagesi kuphansi, kufanelekile ukuthola izinhlelo zokusebenza ezinezidingo zokuhambisa eziphansi

7.Design Ukuvumelana nezimo

Ngenxa yokwakheka kwayo okuphezulu kwe-wiring design, amabhodi wesifunda HDI angabona imiklamo yesifunda eyinkimbinkimbi esendaweni ekhawulelwe. Lokhu kunikeza abaklami kakhulu ukuguquguquka okukhulu lapho kuklanywa imikhiqizo, kanye nekhono lokukhulisa ukusebenza nokusebenza ngaphandle kosayizi owandayo.

Yize amabhodi wesifunda we-HDI anezinzuzo ezisobala ekusebenzeni nasekuklameni, inqubo yokukhiqiza iyinkimbinkimbi, futhi izidingo zemishini nobuchwepheshe ziphezulu. I-Pullin Circuit isebenzisa ubuchwepheshe obusezingeni eliphakeme njengokushayela kwe-laser, ukuqondanisa okunembile kanye nokugcwaliswa kwe-micro-hole hole, okuqinisekisa izinga eliphezulu lebhodi le-HDI.

Uma kuqhathaniswa namabhodi wesifunda ajwayelekile, amabhodi wesifunda e-HDI anobunzima obuphakeme be-wiring, ukusebenza okungcono kukagesi nobukhulu obuncane, kepha inqubo yabo yokukhiqiza iyinkimbinkimbi futhi izindleko ziphezulu. Ubuningi be-wiring wiring kanye nokusebenza kukagesi kwamabhodi wesifunda ahlukahlukene ahlukahlukene akukuhle njengamabhodi wesifunda HDI, alungele izinhlelo zokusebenza eziphakathi neziphansi.