Ukufafaza ngothayela kuyisinyathelo nenqubo kunqubo yokuhlola ye-PCB. IIbhodi le-PCBicwiliswa echibini le-solder elincibilikisiwe, ukuze zonke izindawo zethusi eziveziwe zizombozwa nge-solder, bese i-solder eyeqile ebhodini isuswa ngumsiki womoya oshisayo. susa. Amandla e-solder nokuthembeka kwebhodi lesifunda ngemva kokufafaza ithini kungcono. Kodwa-ke, ngenxa yezici zayo zenqubo, ukukhanya okungaphezulu kokwelashwa kwe-tin spray akukuhle, ikakhulukazi ezingxenyeni ezincane ze-elekthronikhi ezifana namaphakheji we-BGA, ngenxa yendawo encane yokushisela, uma ukuvuleka kungalungile, kungase kubangele izinkinga ezifana izifunda ezimfushane.

inzuzo:

1. Ukumanzisa kwezingxenye ngesikhathi senqubo ye-solder kungcono, futhi i-soldering kulula.

2. Ingavimbela indawo yethusi eveziwe ukuthi ingagqwali noma ifakwe i-oxidized.

ukushiyeka:

Ayifanelekeli izikhonkwane ze-soldering ezinezikhala ezinhle kanye nezingxenye ezincane kakhulu, ngoba ukukhanya okungaphezulu kwebhodi le-tin-sprayed akulungile. Kulula ukukhiqiza ubuhlalu bethayela ekuqinisekiseni i-PCB, futhi kulula ukubangela ukujikeleza okufushane kwezingxenye ezinamaphini we-gap amahle. Uma isetshenziselwa inqubo ye-SMT enezinhlangothi ezimbili, ngenxa yokuthi uhlangothi lwesibili luye lwathola ukushisa okuphezulu kokugeleza kabusha kwe-solder, kulula kakhulu ukuphinda uncibilikise isifutho sikathayela futhi ukhiqize ubuhlalu obuthayela noma amaconsi amanzi afanayo athintwa amandla adonsela phansi abe ngamaphoyinti ayindilinga. ukwehla, okwenza ukuthi indawo engaphezulu ingabukeki nakakhulu. Ukucaba nakho kuthinta izinkinga zokushisela.

Okwamanje, okunye ukuhlola kwe-PCB kusebenzisa inqubo ye-OSP kanye nenqubo yokucwiliswa kwegolide ukuze kuthathelwe indawo inqubo yokufafaza ngamathini; ukuthuthukiswa kobuchwepheshe buye kwenza ezinye izimboni zamukela ithini lokucwiliswa kanye nenqubo yesiliva yokucwiliswa, kuhambisana nokuthambekela kokungabi nomthofu eminyakeni yamuva, ukusetshenziswa kwenqubo yokufafaza ngamathini kuye kwaba nomkhawulo owengeziwe.