Isingeniso seIbhodi Lesifunda Lethusi ElijiyileUbuchwepheshe

(1) Ukulungiswa kwangaphambili kwe-plating kanye nokwelashwa kwe-electroplating

Inhloso eyinhloko yokuqina kwe-copper plating iwukuqinisekisa ukuthi kukhona ungqimba oluqinile olwanele lokucwenga ithusi emgodini ukuze kuqinisekiswe ukuthi inani lokumelana lingaphakathi kwebanga elidingwa inqubo. Njenge-plug-in, iwukuba ulungise isikhundla futhi uqinisekise amandla okuxhuma; njengedivaysi ebekwe phezulu, ezinye izimbobo zisetshenziswa kuphela njengezimbobo, ezidlala indima yokuqhuba ugesi nhlangothi zombili.

(2) Izinto zokuhlola

1. Ngokuyinhloko hlola ikhwalithi ye-metalization yembobo, futhi uqinisekise ukuthi akukho okweqile, i-burr, imbobo emnyama, imbobo, njll emgodini;

2. Hlola ukuthi ingabe kukhona ukungcola nokunye okweqile ebusweni be-substrate;

3. Hlola inombolo, inombolo yomdwebo, idokhumenti yenqubo kanye nencazelo yenqubo ye-substrate;

4. Thola indawo yokukhweza, izidingo zokukhweza kanye nendawo yokumboza ithangi lokucwenga elingathwala;

5. Indawo yokucwenga kanye nemingcele yenqubo kufanele icace ukuze kuqinisekiswe ukuzinza nokuba nokwenzeka kwemingcele yenqubo ye-electroplating;

6. Ukuhlanza nokulungiswa kwezingxenye zokuhambisa, ukwelashwa kokuqala kokufakwa kukagesi ukwenza ikhambi lisebenze;

7. Thola ukuthi ukwakheka koketshezi lokugeza kuyafaneleka yini kanye nendawo engaphezulu yepuleti le-electrode; uma i-anode eyindilinga efakwe kukholamu, ukusetshenziswa kufanele futhi kuhlolwe;

8. Hlola ukuqina kwezingxenye zokuxhumana kanye nohla lokuguquguquka kwamandla kagesi kanye namanje.

(3) Ukulawulwa kwekhwalithi kokugqinswa kwe-copper plating

1. Bala ngokunembile indawo yokucwebeza futhi ubhekisele emthonyeni wenqubo yokukhiqiza yangempela kokwamanje, nquma kahle inani elidingekayo lamanje, phatha kahle ushintsho lwamanje enqubweni ye-electroplating, futhi uqinisekise ukuzinza kwemingcele yenqubo ye-electroplating. ;

2. Ngaphambi kwe-electroplating, qala usebenzise ibhodi lokulungisa iphutha ukuze ucwebezelise isilingo, ukuze ukugeza kube sesimweni sokusebenza;

3. Thola isiqondiso sokugeleza kwenani lamanje, bese unquma ukuhleleka kwamapuleti alengayo. Empeleni, kufanele isetshenziswe kusukela kude kuya eduze; ukuqinisekisa ukufana kokusatshalaliswa kwamanje kunoma iyiphi indawo;

4. Ukuqinisekisa ukufana kokugqoka emgodini kanye nokuvumelana kokuqina kokugqoka, ngaphezu kwezinyathelo zobuchwepheshe zokugqugquzela nokuhlunga, kuyadingeka futhi ukusebenzisa umfutho wamanje;

5. Ukuqapha njalo izinguquko zamanje phakathi nenqubo ye-electroplating ukuze uqinisekise ukwethembeka nokuzinza kwenani lamanje;

6. Hlola ukuthi ukujiya kongqimba lwethusi lokucwenga kwembobo kuyahlangabezana yini nezidingo zobuchwepheshe.

(4) Inqubo ye-Copper Plating

Enqubweni yokuqina kwe-copper plating, imingcele yenqubo kufanele iqashwe njalo, futhi ukulahlekelwa okungadingekile kuvame ukubangelwa ngenxa yezizathu ezizimele nezinjongo. Ukuze wenze umsebenzi omuhle wokuqinisa inqubo yethusi, izici ezilandelayo kufanele zenziwe:

1. Ngokwevelu yendawo ebalwa yikhompuyutha, kuhlanganiswe nolwazi oluqoqwe njalo ekukhiqizeni kwangempela, kwenyusa inani elithile;

2. Ngokwenani lamanje elibaliwe, ukuze kuqinisekiswe ubuqotho bengqimba yokucwenga emgodini, kuyadingeka ukwandisa inani elithile, okungukuthi, i-inrush current, enanini lamanje langempela, bese ubuyela ku- inani langempela phakathi nesikhathi esifushane;

3. Lapho i-electroplating yebhodi lesifunda ifinyelela emaminithini angu-5, khipha i-substrate ukuze ubone ukuthi ungqimba lwethusi ebusweni nodonga lwangaphakathi lomgodi luphelele, futhi kungcono ukuthi zonke izimbobo zibe ne-metallic luster;

4. Kufanele kugcinwe ibanga elithile phakathi kwe-substrate ne-substrate;

5. Lapho i-copper plating eqinisiwe ifinyelela isikhathi esidingekayo se-electroplating, inani elithile lamanje kufanele ligcinwe ngesikhathi sokususwa kwe-substrate ukuze kuqinisekiswe ukuthi ubuso nezimbobo ze-substrate elandelayo ngeke zibe mnyama noma zibe mnyama.

Izinyathelo zokuzivikela:

1. Hlola imibhalo yenqubo, funda izidingo zenqubo futhi ujwayelane nepulani yomshini we-substrate;

2. Hlola ingaphezulu le-substrate ukuze uthole imihuzuko, ama-indentation, izingxenye zethusi eziveziwe, njll.;

3. Yenza ukucutshungulwa kwesilingo ngokusho kwe-floppy disk yokucubungula ngomshini, wenze ukuhlola kuqala, bese ucubungula zonke izingcezu zokusebenza ngemva kokuhlangabezana nezidingo zobuchwepheshe;

4. Lungiselela amathuluzi okulinganisa namanye amathuluzi asetshenziselwa ukuqapha ubukhulu bejometri ye-substrate;

5. Ngokusho kwezakhiwo ze-raw material ye-substrate yokucubungula, khetha ithuluzi elifanele lokugaya (i-milling cutter).

(5) Ukulawulwa kwekhwalithi

1. Sebenzisa ngokuqinile isistimu yokuhlola i-athikili yokuqala ukuze uqinisekise ukuthi usayizi womkhiqizo uhlangabezana nezidingo zedizayini;

2. Ngokusho kwezinto zokusetshenziswa zebhodi lesifunda, khetha ngokufanelekile imingcele yenqubo yokugaya;

3. Uma ulungisa indawo yebhodi lesifunda, yibambe ngokucophelela ukuze ugweme ukulimala kwesendlalelo se-solder kanye ne-solder mask ebusweni bebhodi lesifunda;

4. Ukuqinisekisa ukuhambisana kwezilinganiso zangaphandle ze-substrate, ukunemba kwesikhundla kufanele kulawulwe ngokuqinile;

5. Uma uhlakaza futhi uhlanganisa, ukunakwa okukhethekile kufanele kukhokhwe ekugxiliseni isendlalelo sesisekelo se-substrate ukuze kugwenywe ukulimala kwesendlalelo sokumboza ebusweni bebhodi lesifunda.