Umthelela wobunzima benqubo ye-PCB yokugoqa umunwe wegolide nezinga lekhwalithi elamukelekayo

Ekwakhiweni okunembayo kwemishini yesimanje ye-elekthronikhi, ibhodi lesifunda eliphrintiwe le-PCB lidlala indima ebalulekile, futhi i-Gold Finger, njengengxenye eyinhloko yokuxhumeka okuthembeke kakhulu, izinga layo elingaphezulu lithinta ngokuqondile ukusebenza nokuphila kwesevisi yebhodi.

Umunwe wegolide ubhekisela kubha yokuxhumana yegolide emaphethelweni e-PCB, esetshenziswa kakhulu ukusungula uxhumano lukagesi oluzinzile nezinye izingxenye ze-elekthronikhi (njengememori nebhodi lomama, ikhadi lezithombe nesixhumi esibonakalayo somsingathi, njll.). Ngenxa ye-conductivity yayo kagesi enhle kakhulu, ukumelana nokugqwala kanye nokumelana okuphansi kokuxhumana, igolide lisetshenziswa kabanzi ezingxenyeni ezinjalo zokuxhuma ezidinga ukufakwa nokususwa njalo nokugcina ukuzinza kwesikhathi eside.

Igolide Plating umphumela rough

Ukuncipha kokusebenza kukagesi: Indawo emagebhugebhu yomunwe wegolide izokhuphula ukumelana nokuxhumana, okuholela ekwenyukeni kokuncishiswa kokudluliswa kwesignali, okungase kubangele amaphutha okudlulisa idatha noma ukuxhumeka okungazinzile.

Ukuqina okwehlisiwe: Indawo ebukekayo kulula ukunqwabelana kuyo uthuli nama-oxide, asheshisa ukuguga kongqimba lwegolide futhi enciphisa impilo yesevisi yomunwe wegolide.

Izakhiwo zomshini ezilimele: Indawo engalingani ingase iklwebhe indawo yokuxhumana yelinye iqembu ngesikhathi ishutheka futhi ikhishwa, ithinte ukucinana kokuxhumana phakathi kwezinhlangothi zombili, futhi ingase ibangele ukufakwa noma ukususwa okuvamile.

Ukwehla kobuhle: nakuba lokhu kungeyona inkinga eqondile yokusebenza kwezobuchwepheshe, ukubukeka komkhiqizo nakho kuwukubonakaliswa okubalulekile kwekhwalithi, futhi ucwecwe lwegolide olumahhashi luzothinta ukuhlolwa okuphelele kwamakhasimende komkhiqizo.

Ileveli yekhwalithi eyamukelekayo

Ugqinsi lwegolide lokucwenga: Ngokuvamile, ukujiya kwegolide komunwe wegolide kuyadingeka ukuthi kube phakathi kuka-0.125μm no-5.0μm, inani elithile lincike ezidingweni zohlelo lokusebenza nokucatshangelwa kwezindleko. Umzimba omncane kulula ukuwugqoka, ugqinsi kakhulu kubiza kakhulu.

Ubulukhuni bobuso: I-Ra (i-arithmetic isho ubulukhuni) isetshenziswa njengenkomba yokulinganisa, futhi izinga elivamile lokwamukela ngu-Ra≤0.10μm. Leli zinga liqinisekisa ukuthintana kahle kukagesi nokuqina.

Ukufana kwe-coating: Ungqimba lwegolide kufanele lumbozwe ngokulinganayo ngaphandle kwamabala asobala, ukuchayeka kwethusi noma amabhamuza ukuze kuqinisekiswe ukusebenza okungaguquguquki kwendawo ngayinye yokuxhumana.

Ikhono le-Weld kanye nokuhlolwa kokumelana nokugqwala: ukuhlolwa kwesifutho sikasawoti, izinga lokushisa eliphezulu nokuhlolwa komswakama ophezulu nezinye izindlela zokuhlola ukumelana nokugqwala nokuthembeka kwesikhathi eside komunwe wegolide.

Ibhodi le-PCB yomunwe wegolide eligcwele igolide lihlobene ngokuqondile nokwethembeka kokuxhumana, impilo yesevisi kanye nokuncintisana kwemakethe yemikhiqizo ye-elekthronikhi. Ukunamathela ezindinganisweni eziqinile zokukhiqiza kanye nemihlahlandlela yokwamukela, kanye nokusetshenziswa kwezinqubo zekhwalithi ephezulu zokucwecwa kwegolide kuyisihluthulelo sokuqinisekisa ukusebenza komkhiqizo kanye nokwaneliseka komsebenzisi.

Ngokuthuthuka kobuchwepheshe, imboni yokukhiqiza izinto zikagesi nayo ihlale ihlola ezinye izindlela ezisebenza kahle kakhulu, ezithinta imvelo kanye nezongayo ezinamekwe ngegolide ukuze kuhlangatshezwane nezidingo eziphezulu zemishini kagesi yesikhathi esizayo.