Amabhodi esekethe aphrintiwe (ama-PCB) akha isisekelo esiyisisekelo esisekela ngokomzimba futhi esixhuma izingxenye ze-elekthronikhi kusetshenziswa imikhondo yethusi eqhutshwayo namaphedi ahlanganiswe ne-non-conductive substrate. Ama-PCB abalulekile kuwo wonke amadivaysi kagesi, avumela ukufezeka kwemiklamo yesekethe eyinkimbinkimbi kakhulu ibe amafomethi adidiyelwe futhi akhiqizwa ngobuningi. Ngaphandle kobuchwepheshe be-PCB, imboni yezogesi ibingeke ibe khona njengoba siyayazi namuhla.
Inqubo yokwenziwa kwe-PCB iguqula izinto zokusetshenziswa njengendwangu ye-fiberglass ne-copper foil ibe amabhodi aklanywe ngokunemba. Kubandakanya izinyathelo eziyinkimbinkimbi ezingaphezu kweshumi nanhlanu ukusebenzisa i-automation eyindida kanye nokulawula inqubo eqinile. Ukugeleza kwenqubo kuqala ngokuthwebula isikimu nesakhiwo sokuxhunywa kwesekethe kusofthiwe ye-electronic design automation (EDA). Amamaski omsebenzi wobuciko abe esechaza izindawo zomkhondo eziveza ngokukhethekile ama-laminates e-photosensitive copper kusetshenziswa ukuthwebula kwezithombe. I-Etching isusa ithusi elingadalulwanga ukuze ishiye izindlela ezingazodwa zokuqhuba kanye namaphedi okuxhumana.
Amabhodi anezingqimba eziningi ahlanganisa ndawonye i-laminate ye-copper eqinile eboshwe kanye namashidi okuhlanganisa angaphambi kokulungiswa, ahlanganisa iminonjana ekukhanyeni ngaphansi kwengcindezi ephezulu kanye nezinga lokushisa. Imishini yokumba ibiphethe izinkulungwane zezimbobo ezincane kakhulu ezixhumeka phakathi kwezendlalelo, ezibese zimbozwa ngethusi ukuze kuqedelwe ingqalasizinda yokujikeleza kwe-3D. Ukubhoboza okwesibili, ukucwenga, kanye nokwenza umzila kuqhubeke kushintsha amabhodi kuze kube yilapho elungele ukumbozwa kwesikrini sikasilika sobuhle. Ukuhlola okuzenzakalelayo nokuhlola kuqinisekisa ngokumelene nemithetho yokuklama kanye nokucaciswa ngaphambi kokulethwa kwamakhasimende.
Onjiniyela bashayela izindlela ezintsha ze-PCB eziqhubekayo ezivumela izinto zikagesi eziqinile, ezisheshayo, nezithembeke kakhulu. I-High density interconnect (i-HDI) nanoma ibuphi ubuchwepheshe bezendlalelo manje buhlanganisa izendlalelo ezingaphezu kuka-20 ukuze kumzila amaphrosesa edijithali ayinkimbinkimbi namasistimu omsakazo (RF). Amabhodi aguquguqukayo ahlanganisa izinto eziqinile nezivumelana nezimo ukuze ahlangabezane nezidingo zomumo onzima. I-Ceramic and insulation metal backing (IMB) substrates isekela amafrikhwensi aphezulu kakhulu afika kumilimitha-wave RF. Imboni iphinde yamukele izinqubo nezinto ezisetshenziswayo zokuzinzisa imvelo.
Inzuzo yemboni ye-PCB yomhlaba wonke idlula amaRandi ayizigidi eziyizinkulungwane ezingama-75 kubakhiqizi abangaphezu kuka-2,000, njengoba ikhule ku-CAGR engu-3.5% ngokomlando. Ukwehlukana kwezimakethe kusalokhu kuphezulu nakuba ukuhlanganiswa kuqhubeka kancane kancane. I-China imele isizinda sokukhiqiza esikhulu kunazo zonke esinamasheya angaphezu kuka-55% kuyilapho i-Japan, i-Korea ne-Taiwan ilandela ngaphezu kuka-25% ngokuhlangene. INyakatho Melika yenza ngaphansi kuka-5% womkhiqizo womhlaba. Isimo semboni sishintshela ekuzuzeni i-Asia ngezinga, izindleko, kanye nokuba seduze kwamaketanga amakhulu wokuhlinzeka ngogesi. Kodwa-ke, amazwe agcina amandla e-PCB endawo asekela ukuvikela kanye nokuzwela kwempahla yengqondo.
Njengoba amagajethi abathengi ekhula, izicelo ezivelayo kwingqalasizinda yezokuxhumana, ukufakwa kukagesi kwezokuthutha, i-automation, i-aerospace, nezinhlelo zezokwelapha zikhuthaza ukukhula kwemboni ye-PCB yesikhathi eside. Ukuthuthukiswa okuqhubekayo kobuchwepheshe kuphinde kusize ekwandiseni ama-electronics kabanzi kuzo zonke izimo zokusetshenziswa kwezimboni nezohwebo. Ama-PCB azoqhubeka nokusebenzela umphakathi wethu wedijithali nohlakaniphile phakathi namashumi eminyaka ezayo.