Ukuhlolwa kwebhodi le-PCBAkuyisinyathelo esibalulekile sokuqinisekisa ukuthi imikhiqizo ye-PCBA esezingeni eliphezulu, eqinile, futhi enokwethenjelwa kakhulu ihanjiswa kumakhasimende, inciphisa iziphambeko ezandleni zamakhasimende, futhi igweme ukuthengisa ngemva kokuthengisa. Okulandelayo izindlela ezimbalwa zokuhlola ibhodi le-PCBA:

1. Ukuhlola okubukwayo ，Ukuhlola okubukwayo ukukubheka ngokwakho. Ukuhlolwa okubonakalayo komhlangano we-PCBA kuyindlela yakudala kakhulu ekuhlolweni kwekhwalithi ye-PCBA. Vele usebenzise amehlo nengilazi yokukhulisa ukuze uhlole umjikelezo webhodi le-PCBA kanye nokuhlanganisa izingxenye ze-elekthronikhi ukuze ubone ukuthi likhona yini itshe lethuna. , Ngisho namabhuloho, amathani amaningi, kungakhathaliseki ukuthi amalunga e-solder ahlanganisiwe, kungakhathaliseki ukuthi kukhona ukudayiswa okuncane nokungaphelele. Futhi ubambisane nengilazi yokukhulisa ukuze uthole i-PCBA
2. I-In-Circuit Tester (ICT) ICT ingahlonza izinkinga ze-solder kanye nengxenye ku-PCBA. Inesivinini esikhulu, ukuzinza okuphezulu, hlola isifunda esifushane, isifunda esivulekile, ukumelana, amandla.
3. Ukuhlola ubudlelwano obuzenzakalelayo (i-AOI) obuzenzakalelayo bunokungaxhunyiwe ku-inthanethi futhi ku-inthanethi, futhi kunomehluko phakathi kwe-2D ne-3D. Njengamanje, i-AOI idume kakhulu embonini yokuchibiyela. I-AOI isebenzisa isistimu yokuqaphela izithombe ukuze iskene lonke ibhodi le-PCBA futhi iphinde iyisebenzise. Ukuhlaziywa kwedatha yomshini kusetshenziselwa ukunquma ikhwalithi yokushisela ibhodi le-PCBA. Ikhamera iskena ngokuzenzakalelayo iziphambeko zekhwalithi zebhodi le-PCBA ngaphansi kokuhlolwa. Ngaphambi kokuhlola, kubalulekile ukunquma ibhodi LOKULUNGILE, futhi ugcine idatha yebhodi le-OK ku-AOI. Ukukhiqizwa ngobuningi okulandelayo kusekelwe kuleli bhodi elilungile. Yenza imodeli eyisisekelo ukuze unqume ukuthi ingabe amanye amabhodi ALUNGILE.
4. Umshini we-X-ray (i-X-RAY) Ngezingxenye ze-elekthronikhi ezifana ne-BGA/QFP, i-ICT ne-AOI azikwazi ukubona ikhwalithi yokudayiswa kwezikhonkwane zazo zangaphakathi. I-X-RAY ifana nomshini we-X-ray wesifuba, ongadlula Hlola indawo ye-PCB ukuze ubone ukuthi ukusoda kwezikhonkwane zangaphakathi kudayisiwe, noma ngabe ukubekwa kusendaweni, njll. I-X-RAY isebenzisa ama-X-ray ukuze ingene. ibhodi le-PCB ukubuka ingaphakathi. I-X-RAY isetshenziswa kabanzi emikhiqizweni enezidingo ezinokwethenjelwa okuphezulu, efana ne-aviation Electronics, i-automotive electronics.
5. Ukuhlolwa kwesampula Ngaphambi kokukhiqizwa nokuhlanganiswa okuningi, ukuhlolwa kwesampula kokuqala kuvame ukwenziwa, ukuze inkinga yokukhubazeka okugxilile ingagwenywa ekukhiqizeni ngobuningi, okuholela ezinkingeni ekukhiqizeni amabhodi e-PCBA, okubizwa ngokuthi ukuhlola kokuqala.
6. Uphenyo olundizayo lomhloli ondizayo lufanele ukuhlolwa kwama-PCB ayinkimbinkimbi adinga izindleko zokuhlola ezibizayo. Ukuklanywa nokuhlolwa kwe-probe endizayo kungaqedwa ngosuku olulodwa, futhi izindleko zomhlangano ziphansi kakhulu. Iyakwazi ukuhlola ukuvuleka, izikhindi kanye nokuma kwezingxenye ezifakwe ku-PCB. Futhi, isebenza kahle ekuhlonzeni ukwakheka kwengxenye nokuqondanisa.
7. I-Manufacturing Defect Analyzer (MDA) Injongo ye-MDA wukuhlola nje ibhodi ukuze kwembulwe amaphutha okukhiqiza. Njengoba iziphambeko eziningi zokukhiqiza ziyizinkinga ezilula zokuxhuma, i-MDA inqunyelwe ukulinganisa ukuqhubeka. Ngokuvamile, umhloli uzokwazi ukubona ukuba khona kwama-resistors, ama-capacitor, nama-transistors. Ukutholwa kwamasekhethi ahlanganisiwe kungazuzwa kusetshenziswa ama-diode okuvikela ukukhombisa ukubekwa kwengxenye efanele.
8. Ukuhlolwa kokuguga. Ngemva kokuba i-PCBA seyenziwe ukukhwezwa kanye ne-DIP post-soldering, i-sub-board trimming, ukuhlolwa kwendawo kanye nokuhlolwa kwesiqephu sokuqala, ngemva kokuqedwa kokukhiqizwa ngobuningi, ibhodi le-PCBA lizohlolwa ngokuguga ukuze lihlole ukuthi umsebenzi ngamunye ujwayelekile yini, izingxenye ze-elekthronikhi zijwayelekile, njll.