Lokhu okulandelayo kuyizindlela eziningana zokuhlola ibhodi ye-PCBA:

Ukuhlolwa kwebhodi le-PCBAIsinyathelo esiyisihluthulelo sokuqinisekisa ukuthi ikhwalithi ephezulu, ephakeme, futhi imikhiqizo ephezulu ye-PCBA ye-PCBA ihanjiswa kumakhasimende, inciphise iziphambeko ezandleni zamakhasimende, futhi igweme ngemuva kokuthengisa. Lokhu okulandelayo kuyizindlela eziningana zokuhlola ibhodi ye-PCBA:

  1. Ukuhlolwa okubukwayo, ukuhlolwa okubukwayo ukubheka yona ngesandla. Ukuhlolwa okubukwayo kwe-PCBA Assembly kuyindlela yokuqala kunazo zonke ekuhlolweni kwekhwalithi ye-PCBA. Vele usebenzise amehlo futhi ingilazi ekhulisayo ukuhlola umjikelezo webhodi le-PCBA kanye nokuthengisa kwezinto ze-elekthronikhi ukubona ukuthi kukhona itshe lethuna. , Namabhuloho, i-tinthe xaxa, ukuthi ngabe amalunga alolishi avinjelwe yini, noma ngabe kukhona ukuthengisa okuncane futhi okuphelele kokuthengisa. Futhimbisana nengilazi ekhulisa ukuthola i-PCBA
  2. Umhloli wesekethe (i-ICT) i-ICT angakhomba izinkinga zokuthengisa kanye nezakhi ku-PCBA. Inesivinini esiphakeme, ukuqina okuphezulu, hlola umjikelezo omfushane, vula umjikelezo ovulekile, ukumelana, amandla.
  3. Ukuhlolwa okuzenzakalelayo okuzenzakalelayo (aooi) Ukutholwa okuzenzakalelayo okuzenzakalelayo kungfree noku-inthanethi, futhi kunomehluko phakathi kwe-2D ne-3D. Njengamanje, i-AOI ithandwa kakhulu efektri ye-patch. I-AOI isebenzisa uhlelo lokuqashelwa kwezithombe ukuskena lonke ibhodi le-PCBA bese uyisebenzisa kabusha. Ukuhlaziywa kwedatha yomshini kusetshenziselwa ukuthola ikhwalithi ye-PCBA Board Welding. Ikhamera iskena ngokuzenzakalela iziphambeko ezisezingeni lebhodi lePCBA livivinywa. Ngaphambi kokuhlolwa, kuyadingeka ukuthola ibhodi Elilungile, futhi ugcine idatha yebhodi le-OK e-AOI. Ukukhiqizwa kwesisindo okwalandela kususelwa kule bhodi elungile. Yenza imodeli eyisisekelo ukuthola ukuthi amanye amabhodi alungile.
  4. Umshini we-X-ray (i-X-ray) yezingxenye ze-elekthronikhi ezifana ne-BGA / QFP, i-ICT ne-AOI ayikwazi ukuthola ikhwalithi yokuthengisa yezikhonkwane zayo zangaphakathi. I-X-ray ifana nomshini we-chest X-ray, ongadlula emshinini we-PCB ukuze ubone ukuthi ngabe ukuthengiswa kwezikhonkwane kwangaphakathi kuthengiswa, njll. I-X-Ray isebenzisa i-X-Bhodi ukuze iphinde i-PCB BOOD ukubuka ingaphakathi. I-X-RAY isetshenziswa kabanzi kwimikhiqizo enezidingo eziphezulu zokuthembela, ezifana ne-Aviation Electronics, Izithuthi Zokwe-Electronic
  5. Ukuhlolwa kwesampula ngaphambi kokukhiqizwa kwabantu abaningi ngaphambi komhlangano kanye noMhlangano, ukuhlolwa kwesampula kokuqala kuvame ukwenziwa, ukuze kugwenywe inkinga yezimpawu ezihlanganisiwe ekukhiqizeni inkinga, okuholela ezinkingeni zokukhiqiza amabhodi okuqala.
  6. Ukuphenya okundizayo komhloli we-Flying Probe kulungele ukuhlolwa kwama-PCB anobunzima obukhulu adinga izindleko zokuhlola ezibizayo. Idizayini nokuhlolwa kwe-Flying Probe kungaphothulwa ngosuku olulodwa, futhi izindleko zomhlangano ziphansi. Iyakwazi ukubheka ukuvela, izikhindi kanye nokuqondiswa kwezinto ezifakwe kwi-PCB. Futhi, kusebenza kahle ukukhomba ukwakheka kwengxenye kanye nokuqondanisa.
  7. Ukuhlaziywa Kwezimpethu Zokukhiqiza (MDA) Inhloso ye-MDA nje ukuhlola iBhodi ukuze iveze iziphambeko zokukhiqiza. Njengoba iningi lezinkinga zokukhiqiza ziyizingqinamba ezilula zokuxhumeka, iMDA ikhawulelwe ekulinganiseni ukuqhubeka. Imvamisa, umhloli uzokwazi ukuthola ubukhona babameli, ama-capacitors, kanye nama-transistors. Ukutholwa kwemibukela ehlanganisiwe kungatholakala futhi kusetshenziswa ama-diode avikela ukukhombisa ukubekwa okufanele.
  8. Ukuhlolwa kokuguga. Ngemuva kokuthi i-PCBA iye yakhwela futhi ifake i-post-soldering, ukuhlolwa okuphansi kwebhodi, ukuhlolwa kokuqala, ngemuva kokuhlolwa kwesisindo, ngemuva kokuhlolwa kwe-PCBA kuhlolwe, izakhi zomsebenzi zijwayelekile, njll.