Isingeniso se-Solder Mask
I-resistance pad i-soldermask, ebhekisela engxenyeni yebhodi lesifunda elizopendwa ngamafutha aluhlaza. Eqinisweni, le mask ye-solder isebenzisa okukhiphayo okungalungile, ngakho-ke ngemva kokuma kwe-mask ye-solder kumephu ebhodini, imaski ye-solder ayipendiwe ngamafutha aluhlaza, kodwa isikhumba sethusi sivezwa. Ngokuvamile ukuze kwandiswe ukushuba kwesikhumba sethusi, imaski ye-solder isetshenziselwa ukubhala imigqa ukuze kukhishwe amafutha aluhlaza, bese kwengezwa ithini ukuze kwandiswe ukushuba kocingo lwethusi.
Izidingo ze-solder mask
Imaski ye-solder ibaluleke kakhulu ekulawuleni amaphutha e-solder ku-reflow soldering. Abaklami be-PCB kufanele banciphise izikhala noma izikhala zomoya ezizungeze amaphedi.
Nakuba onjiniyela abaningi bezinqubo bengathanda ukuhlukanisa zonke izici zephedi ebhodini ngemaski ye-solder, isikhala sephini kanye nosayizi wephedi wezingxenye zephimbo elihle kuzodinga ukucatshangelwa okukhethekile. Nakuba ukuvuleka kwemaski ye-solder noma amafasitela angaklanyiwe ezinhlangothini ezine ze-qfp kungase kwamukeleke, kungase kube nzima kakhulu ukulawula amabhuloho e-solder phakathi kwezikhonkwane zengxenye. Ngemaski ye-solder ye-bga, izinkampani eziningi zinikeza imaski ye-solder engathinti ama-pads, kodwa ihlanganisa noma yiziphi izici phakathi kwama-pads ukuvimbela amabhuloho e-solder. Ama-PCB amaningi okukhweza ambozwe ngemaski ye-solder, kodwa uma ubukhulu bemaski ye-solder bukhulu kuno-0.04mm, kungase kuthinte ukusetshenziswa kwe-solder paste. Ama-PCB okukhweza angaphezulu, ikakhulukazi lawo asebenzisa izingxenye ze-pitch-pitch, adinga imaski ephansi ye-photosensitive solder.
Ukukhiqizwa komsebenzi
Izinto ezisetshenziswa kumamaski e-solder kumele zisetshenziswe ngenqubo emanzi ewuketshezi noma ngefilimu eyomile. Izinto zokwakha zemaski yefilimu eyomile zihlinzekwa ngogqinsi luka-0.07-0.1mm, olungafanelekela imikhiqizo ethile yokukhweza ngaphezulu, kodwa lokhu kwaziswa akunconyelwe ukusetshenziswa kwe-close-pitch. Zimbalwa izinkampani ezihlinzeka ngamafilimu omile azacile ngokwanele ukuze ahlangabezane nezindinganiso ezinhle ze-pitch, kodwa kunezinkampani ezimbalwa ezingahlinzeka ngempahla ye-solder ye-photosensitive ewuketshezi. Ngokuvamile, ukuvulwa kwemaski ye-solder kufanele kube kukhulu ngo-0.15mm kunephedi. Lokhu kuvumela igebe elingu-0.07mm emaphethelweni ephedi. Izinto zemaski zesoda ezithambile ezinoketshezi olunephrofayili ephansi ziyonga futhi zivame ukucaciswa izinhlelo zokusebenza zokukhweza phezulu ukuze kuhlinzekwe osayizi besici abanembile nezikhala.
Isingeniso sesendlalelo se-solder
Isendlalelo se-soldering sisetshenziselwa ukupakishwa kwe-SMD futhi sihambisana namaphedi wezingxenye ze-SMD. Ekucutshungulweni kwe-SMT, ipuleti lensimbi livame ukusetshenziswa, futhi i-PCB ehambisana nengxenye yamaphedi iyashaywa, bese i-solder paste ibekwa epuleti lensimbi. Uma i-PCB ingaphansi kwepuleti lensimbi, i-solder paste iyavuza, futhi ikuphedi ngayinye Ingagcotshwa nge-solder, ngakho-ke imvamisa imaski ye-solder akufanele ibe nkulu kunosayizi wephedi wangempela, okungcono ibe ngaphansi noma ilingane usayizi wephedi wangempela.
Izinga elidingekayo licishe lifane nelezinto zokukhweza ngaphezulu, futhi izakhi eziyinhloko zimi kanje:
1. I-BeginLayer: I-ThermalRelief ne-AnTIPad zinkulu ngo-0.5mm kunosayizi wangempela wephedi evamile.
2. I-EndLayer: I-ThermalRelief ne-AntiPad zinkulu ngo-0.5mm kunosayizi wangempela wephedi evamile.
3. OKUNGENZIWA NGAPHAKATHI: isendlalelo esiphakathi
Indima ye-solder mask kanye nesendlalelo se-flux
Isendlalelo semaski ye-solder sivimbela ikakhulukazi i-foil yethusi yebhodi lesifunda ukuthi ingavezwa ngokuqondile emoyeni futhi idlala indima yokuvikela.
Isendlalelo sokunamathisela sisetshenziselwa ukwenza insimbi yensimbi yefekthri yensimbi enezikhala, futhi insimbi yensimbi ingafaka ngokunembile ukunamathisela kwe-solder kuma-patch pads adinga ukudayiswa lapho kuthayinwa.
Umehluko phakathi kwesendlalelo sokunamathisela se-PCB kanye nemaski ye-solder
Zombili izingqimba zisetshenziselwa ukuhlanganisa. Akusho ukuthi enye iyathengiswa kanti enye ingamafutha aluhlaza; kodwa:
1. I-solder mask layer isho ukuvula iwindi kumafutha aluhlaza we-mask yonke ye-solder, inhloso iwukuvumela ukushisela;
2. Ngokuzenzakalelayo, indawo engenamaski e-solder kufanele ipendwe ngamafutha aluhlaza;
3. I-soldering layer isetshenziselwa ukupakishwa kwe-SMD.