Isingeniso kuMask SORDER

I-Pad Pad i-soldermask, ebhekisa engxenyeni yebhodi yesekethe ukuze ipendwe ngamafutha aluhlaza. Eqinisweni, lo mask we-solder usebenzisa umphumela ongemuhle, ngakho-ke ukwakheka kwemakhi we-solder kufakwe ebhodini, imaskhi yomthengisi ayipendwe ngamafutha aluhlaza, kepha isikhumba sethusi siyavezwa. Imvamisa ukuze ukhuphule ubukhulu besikhumba sethusi, imaskhi yesidlali isetshenziselwa ukubhala imigqa ukuze ikhiphe uwoyela oluhlaza, bese i-tin ingezwa ukukhulisa ubukhulu be-wire yethusi.

Izidingo ze-solder mask

Imaskhi ye-solder ibaluleke kakhulu ekulandiseni iziphambeko zokuthengisa ekuboniseni ukuthengisa. Abaqambi be-PCB kufanele banciphise izikhala noma izikhala zomoya ezizungeze amaphilisi.

Yize iningi lonjiniyela bezinqubo lingahle lihlukanise zonke izici ze-pad ebhodini nge-mask yomthengisi, ukuhlukaniswa kwe-PIN kanye nosayizi wePad wezakhi ze-pitch kahle kuzodinga ukucatshangelwa okukhethekile. Yize ukuvulwa kwama-mask we-solerder noma amafasitela angafakwanga ezinhlangothini ezine ze-QFP kungamukeleka, kungahle kube nzima ukulawula amabhuloho we-solder phakathi kwezikhonkwane zezakhi. Ukuze umxazululi we-BGA, izinkampani eziningi zinikeza imaskhi yesitshelu engathinti amaphilisi, kepha ihlanganisa noma yiziphi izici eziphakathi kwamaphilisi ukuvikela amabhuloho we-solder. Iningi lama-PCB entanethi elingaphezulu limbozwe nge-mask yomthengisi, kepha uma ubukhulu bemaskhili solder bukhulu kune-0.04mm, kungathinta ukusetshenziswa kwe-solder passe. I-Surface Mount PCBS, ikakhulukazi labo abasebenzisa izingxenye ezinhle zokuphamba, badinga imaski yomthengisi ophansi.

Ukukhiqizwa komsebenzi

Izinto zokwenziwa mamaski we-soler kumele zisetshenziswe ngenqubo enamanzi ekaketshezi noma i-laight yefilimu eyomile. Izinto zokwenziwa ze-solerment ze-solerment zihlinzekwa ngobukhulu be-0.07-0.1mm, ezingalungele eminye imikhiqizo yeNtaba yeNtaba, kodwa lokhu okuqukethwe akunconyelwe izicelo ezisondelene nazo. Zimbalwa izinkampani ezihlinzeka ngamafilimu owomile anciphile ngokwanele ukufeza amazinga we-pitch amahle, kepha kunezinkampani ezimbalwa ezinganikeza izinsiza zomakethi we-photossensitive mask. Ngokuvamile, ukuvulwa kwama-mask we-soler mask kufanele kube ngu-0.15mm kukhulu kune-pad. Lokhu kuvumela igebe le-0.07mm emaphethelweni ephedi. Izinto ze-lol-profilitive ze-spoin mask mask zezomnotho futhi zivame ukucaciswa izinhlelo zokusebenza ze-surce fur ukuhlinzeka ngosayizi wesici esiqondile nezikhala.

Isingeniso ku-soldering ungqimba

Isendlalelo so-soldering sisetshenziselwa ukupakishwa kwe-SMD futhi sihambelana nama-pads wezakhi ze-SMD. Ngokucutshungulwa kwe-SMT, ipuleti lensimbi livame ukusetshenziswa, futhi i-PCB ehambelana namaphaphu wengxenye ihlanjululwe, bese kufakwa u-solder plate. Lapho i-PCB ingaphansi kwepuleti lensimbi, i-solder unamathisele epanini ngalinye, futhi i-pad ngayinye ingahle ibambeke nge-soler, ngakho-ke imvamisa imaskhi ye-solder akufanele ibe mkhulu kunosayizi we-pad wangempela noma olingana nosayizi we-pad uqobo.

Izinga elidingekayo licishe lifane nelo lezakhi zentaba ezisezingeni eliphezulu, futhi izinto eziphambili zimi ngalendlela elandelayo:

1. Ukuqala: I-Thermalrelief ne-Antipad yi-0.5mm enkulu kunesayizi yangempela

2. Erminier: Thermalrelief ne-antipad yi-0.5mm enkulu kunesayizi yangempela ye-pad ejwayelekile

3. Okuzenzakalelayo: ungqimba oluphakathi

Indima ye-solder mask ne-flux ungqimba

Isendlalelo se-mask soler sivimbela ikakhulukazi i-foil ye-Copper yebhodi yokujikeleza kusuka ekuvezeni ngqo emoyeni futhi idlala indima evikelayo.

Isendlalelo so-soldering sisetshenziselwa ukwenza i-mesh yensimbi yefektri yensimbi yensimbi, kanti i-mesh yensimbi ingafaka ngokunembile ukunamathisela okuthengiswayo kumapathini we-patch adinga ukuthengiselwa lapho kuthathwa.

Umehluko phakathi kwe-PCB soldering ungqimba kanye ne-mask ye-solder

Zombili lezi zingqimba zisetshenziselwa ukuthengisa. Akusho ukuthi umuntu uthengiswe kanti omunye unamafutha aluhlaza; Kepha:

1. Isendlalelo se-mask solerder sisho ukuvula iwindi kumafutha aluhlaza wonke imaskhi ye-solder mask, inhloso ukuvumela i-welding;

2. Ngokuzenzakalelayo, indawo engenayo imaski ye-solder kumele ipendwe ngamafutha aluhlaza;

I-3. Isendlalelo so-soldering sisetshenziselwa ukupakishwa kwe-SMD.