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Isikhathi sokulethwa kwebhodi lenkampani yenethiwekhi kunzima ukuxazulula, futhi imboni ye-OSAT iphakamisa ukushintsha ifomu lokupakisha

Imboni yokupakisha nokuhlola ye-IC isebenza ngesivinini esigcwele.Izikhulu eziphezulu ze-outsourcing packaging and testing (OSAT) zasho ngokungananazi ukuthi ngo-2021 kulinganiselwa ukuthi uhlaka oluholayo lwe-wire bonding, i-substrate yokupakisha, kanye ne-epoxy resin yokupakisha (Epoxy) kulindeleke ukuthi isetshenziswe ngo-2021. Ukuhlinzekwa kanye nesidingo sezinto ezifana ne-Molding Compund kuqinile, futhi kulinganiselwa ukuthi kuzoba yinjwayelo ngo-2021.

Phakathi kwazo, isibonelo, ama-chips e-high-efficiency computing (HPC) asetshenziswa kumaphakheji e-FC-BGA, kanye nokushoda kwama-substrates e-ABF kuye kwabangela abakhiqizi be-chip bamazwe ngamazwe abahamba phambili ukuthi baqhubeke nokusebenzisa indlela yomthamo wephakheji ukuze kuqinisekiswe umthombo wezinto.Mayelana nalokhu, ingxenye yokugcina yemboni yokupakisha nokuhlola iveze ukuthi ayifuni kakhulu imikhiqizo ye-IC, njengama-memory main control chips (Controller IC).

Ekuqaleni ngendlela ye-BGA yokupakisha, ukupakisha kanye nezitshalo zokuhlola ziyaqhubeka nokutusa amakhasimende e-chip ukuthi ashintshe izinto futhi asebenzise ukupakishwa kwe-CSP okusekelwe kuma-substrates e-BT, futhi alwele ukulwela ukusebenza kwe-NB/PC/game console CPU, GPU, ama-server e-Netcom chips. , njll. , Kusafanele usebenzise ibhodi lenkampani yenethiwekhi ye-ABF.

Eqinisweni, isikhathi sokulethwa kwebhodi lenkampani yenethiwekhi seyenziwe side kakhulu kusukela eminyakeni emibili edlule.Ngenxa yokwanda kwakamuva kwezintengo zethusi ze-LME, uhlaka oluholayo lwakho kokubili i-IC namamojula wamandla lunyukile ngenxa yesakhiwo sezindleko.Ngokuqondene nendandatho Ngezinto ezifana ne-oxygen resin, imboni yokupakisha nokuhlola nayo yaxwayisa ekuqaleni kuka-2021, futhi isimo esiqinile sokuhlinzekwa kanye nesidingo ngemva konyaka omusha wenyanga sizoba sobala kakhulu.

Isiphepho seqhwa sangaphambilini e-Texas e-United States sibe nomthelela ekuhlinzekweni kwezinto zokupakisha njenge-resin nezinye izinto zokusetshenziswa zamakhemikhali ezikhuphuka nomfula.Abakhiqizi bempahla baseJapan abaningana abakhulu, okuhlanganisa neShowa Denko (ehlanganiswe ne-Hitachi Chemical), basazoba no-50% kuphela wempahla yokuqala kusukela ngoMeyi kuya kuJuni., Futhi uhlelo lwe-Sumitomo lubike ukuthi ngenxa yomthamo wokukhiqiza ngokweqile otholakala eJapane, i-ASE Investment Holdings kanye nemikhiqizo yayo ye-XX, ethenga izinto zokupakisha ezivela ku-Sumitomo Group, ngeke ithinteke kakhulu okwamanje.

Ngemuva kokuthi umthamo wokukhiqiza ovela phezulu uqinile futhi uqinisekiswe yimboni, imboni yama-chip ilinganisela ukuthi nakuba uhlelo lwamandla oluhleliwe selufinyelele cishe unyaka ozayo, isabelo sinqunywa cishe.Isithiyo esisobala kakhulu sokuvimbela ukuthunyelwa kwe-chip sisesigabeni sakamuva.Ukupakisha nokuhlola.

Umthamo wokukhiqiza oqinile wokupakishwa kwe-wire-bonding (WB) kuzoba nzima ukuxazulula yonke indlela kuze kube sekupheleni konyaka.I-Flip-chip packaging (FC) nayo igcine izinga layo lokusebenzisa lisezingeni eliphezulu ngenxa yesidingo se-HPC nama-chips ezimayini, futhi ukupakishwa kwe-FC kufanele kube okuvuthwe kakhulu.Ukunikezwa okuvamile kwama-substrates okulinganisa kunamandla.Nakuba okushoda kakhulu amabhodi e-ABF, namabhodi e-BT asamukelekile, imboni yokupakisha nokuhlola ilindele ukuthi ukucinana kwama-substrates e-BT nakho kuzofika esikhathini esizayo.

Ngaphezu kweqiniso lokuthi ama-chips e-elekthronikhi ezimoto anqunywa emgqeni, indawo yokupakisha nokuhlola ilandele ukuhola komkhakha we-Foundry.Ekupheleni kwekota yokuqala nasekuqaleni kwekota yesibili, iqale yathola i-oda lama-wafers avela kubathengisi bama-chip bamazwe ngamazwe ngo-2020, kwase kwengezwa amasha ngo-2021. Umthamo wokukhiqiza wama-wafer usizo lwase-Austrian nalo kulinganiselwa ukuthi luzoqala. engxenyeni yesibili.Njengoba inqubo yokupakisha nokuhlola iphuzile cishe ngezinyanga ezi-1 kuye kwezingu-2 kusukela ku-Foundry, ama-oda amakhulu okuhlola azovutshelwa maphakathi nonyaka.

Uma ubheka phambili, nakuba imboni ilindele ukuthi umthamo wokupakisha nokuhlola okuqinile ngeke kube lula ukuxazulula ngo-2021, ngesikhathi esifanayo, ukwandisa ukukhiqizwa, kuyadingeka ukuwela umshini wokubopha ucingo, umshini wokusika, umshini wokubeka kanye nokunye ukupakisha. impahla edingekayo yokupakisha.Isikhathi sokulethwa naso selulelwe cishe kwesisodwa.Iminyaka nezinye izinselele.Kodwa-ke, imboni yokupakisha nokuhlola isagcizelela ukuthi ukunyuka kwezindleko zokupakisha nokuhlola isisekelo "kusewumsebenzi ocophelelayo" okufanele ucabangele ubudlelwano bamakhasimende besikhathi esimaphakathi nesikhathi eside.Ngakho-ke, singakwazi futhi ukuqonda ubunzima obukhona bamakhasimende e-IC design ukuqinisekisa umthamo ophezulu kakhulu wokukhiqiza, futhi sinikeze amakhasimende iziphakamiso ezifana nezinguquko zempahla, izinguquko zephakheji, nezingxoxo zentengo, nazo ezisekelwe esisekelweni sokubambisana okuzuzisa isikhathi eside. namakhasimende.

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I-boom yezimayini iqinise ngokuphindaphindiwe umthamo wokukhiqiza we-BT substrates
I-boom yezimayini emhlabeni wonke isiphinde yabusa, futhi ama-chips ezimayini asephinde abe indawo eshisayo emakethe.Amandla e-kinetic wama-oda e-supply chain aye anda.Abakhiqizi be-substrate be-IC ngokuvamile baveze ukuthi amandla okukhiqiza ama-substrate e-ABF avame ukusetshenziselwa ukwakhiwa kwe-chip yezimayini esikhathini esedlule ayesephelile.I-Changlong, ngaphandle kwemali eyanele, ayikwazi ukuthola ukunikezwa okwanele.Amakhasimende ngokuvamile ashintshela kumanani amakhulu amabhodi enkampani ye-BT, okuphinde kwenza imigqa yokukhiqiza yebhodi lenkampani ye-BT yabakhiqizi abahlukahlukene ibiqinile kusukela Onyakeni Omusha Wenyanga kuze kube manje.

Imboni efanele iveze ukuthi empeleni kunezinhlobo eziningi zama-chips ezingase zisetshenziselwe ukumba izimayini.Kusukela kuma-GPU aphambilini asezingeni eliphezulu kuya kuma-ASICs akhethekile akamuva ezimayini, kubuye kubhekwe njengesixazululo esisungulwe kahle.Iningi lamabhodi e-BT carrier asetshenziselwa lolu hlobo lokuklama.Imikhiqizo ye-ASIC.Isizathu sokuthi kungani amabhodi e-BT carrier angasetshenziswa kuma-ASICs wezimayini kungenxa yokuthi le mikhiqizo isusa imisebenzi engasasebenzi, ishiya kuphela imisebenzi edingekayo yezimayini.Uma kungenjalo, imikhiqizo edinga amandla aphezulu ekhompiyutha kusafanele isebenzise amabhodi enkampani ye-ABF.

Ngakho-ke, kulesi sigaba, ngaphandle kwe-chip yezimayini nenkumbulo, elungisa umklamo webhodi lenkampani yenethiwekhi, kukhona indawo encane yokushintshwa kwezinye izinhlelo zokusebenza.Abangaphandle bakholelwa ukuthi ngenxa yokushiswa kabusha ngokuzumayo kwezicelo zezimayini, kuzoba nzima kakhulu ukuncintisana nabanye abakhiqizi abakhulu be-CPU kanye ne-GPU asebemise umugqa isikhathi eside umthamo wokukhiqiza webhodi lenkampani ye-ABF.

Ingasaphathwa eyokuthi iningi lemigqa yokukhiqiza emisha eyandiswe yizinkampani ezahlukene isivele inenkontileka yilaba bakhiqizi abahamba phambili.Lapho i-boom yezimayini ingazi ukuthi izonyamalala nini ngokuzumayo, izinkampani ze-chip yezimayini azinaso ngempela isikhathi sokujoyina.Ngomugqa omude wokulinda wamabhodi esithwali we-ABF, ukuthenga amabhodi esithwali se-BT ngesilinganiso esikhulu kuyindlela ephumelela kakhulu.

Uma sibheka isidingo sezinhlelo zokusebenza ezahlukahlukene zamabhodi e-BT enkampanini yokuqala ka-2021, noma ngokujwayelekile ukukhula okuphezulu, izinga lokukhula lama-chips ezimayini liyamangaza uma kuqhathaniswa.Ukubuka isimo sama-oda ekhasimende akusona isidingo sesikhashana.Uma iqhubeka engxenyeni yesibili yonyaka, faka inkampani yenethiwekhi ye-BT.Esikhathini esivamile sonyaka esiphezulu sebhodi, esimweni sesidingo esikhulu somakhalekhukhwini i-AP, i-SiP, i-AiP, njll., ukuqina komthamo wokukhiqiza we-BT substrate kungase kukhule nakakhulu.

Izwe langaphandle futhi likholelwa ukuthi akunqatshiwe ukuthi isimo sizoshintsha sibe yisimo lapho izinkampani ze-chip yezimayini zisebenzisa ukukhuphuka kwentengo ukuze zibambe umthamo wokukhiqiza.Phela, izicelo zezimayini okwamanje zibekwe njengamaphrojekthi wokubambisana wesikhathi esifushane kubakhiqizi abakhona bebhodi lenkampani ye-BT.Kunokuba ube umkhiqizo odingekayo wesikhathi eside esikhathini esizayo njengamamojula e-AiP, ukubaluleka nokubalulekile kwezinsizakalo kuseyizinzuzo zomakhalekhukhwini bendabuko, izinto zikagesi ezithengwayo kanye nabakhiqizi bamachip okuxhumana.

Imboni yezokuthutha ivumile ukuthi isipiliyoni esinqwabelene kusukela ekuqaleni kokuvela kwesidingo sezimayini sibonisa ukuthi izimo zemakethe zemikhiqizo yezimayini ziyaguquguquka uma kuqhathaniswa, futhi akulindelekile ukuthi isidingo sigcinwe isikhathi eside.Uma amandla okukhiqiza amabhodi esithwali se-BT azonwetshwa ngempela esikhathini esizayo, kufanele futhi ancike kuwo.Isimo sokuthuthukiswa kwezinye izinhlelo zokusebenza ngeke sandise kalula ukutshalwa kwezimali ngenxa nje yesidingo esikhulu kulesi sigaba.