Ubudlelwano obuyisisekelo phakathi kokuhlelwa ne-PCB 2

Ngenxa yezimpawu zokushintsha kwamandla okushintsha kwamandla, kulula ukudala ukushintshwa kwamandla okushintsha ukukhiqiza ukuphazanyiswa kokulinganiselwa kwe-electromagnetic. Njengonjiniyela wokuhlinzekelwa kwamandla, unjiniyela wokuhambisana we-electromagnetic, noma unjiniyela we-PCB Lasout, kufanele uqonde izimbangela zezinkinga zokuhambisana kagesi futhi uxazulule izindlela, ikakhulukazi onjiniyela bezakhiwo badinga ukwazi ukuthi ungakugwema kanjani ukwanda kwezindawo ezingcolile. Lo mbhalo wethula ikakhulukazi amaphuzu asemqoka wamandla we-PCB Design.

 

15. Yehlisa indawo ebonakalayo (ebucayi) yesiginali ye-Loop Loop kanye nobude be-wiring ukunciphisa ukuphazamiseka.

16. Iminonjana emincane yesiginali ikude kakhulu nemigqa yesiginali enkulu ye-DV / DT (efana ne-C pole noma i-D Pole ye-Curnip Tube, i-Buffer (noma ukunikezwa amandla, ngamafuphi) ukunciphisa ukuhlangana, futhi umhlabathi kufanele ube nokuxhumana kahle nendiza yomhlabathi. Ngasikhathi sinye, kufanele kube manje ukulandelwa kwesiginali okuncane ngangokunokwenzeka kusuka emigqeni enkulu ye-DI / DT yokuvimbela i-crosstalk eyinduku. Kungcono ukungahambi ngaphansi kwesiginali enkulu ye-DV / DT lapho kulandelwa amasiginali amancane. Uma ingemuva lomkhondo omncane wesiginali ingahle libekwe esikhundleni (umhlabathi ofanayo), isinali somsindo sihlanganiswe nayo singancishiswa.

17. Kungcono ukubeka umhlabathi nxazonke nangemuva kwale minsalo enkulu ye-DV / DT ne-DT (kufaka phakathi izingqimba ze-Cube ezishintshayo (imvamisa i-arviator yeshubhu eshintshayo, futhi i-e / s pole ye-switch tube, noma i-sampling resistor) ngethreyimu ephansi yokususa. Lokhu kunganciphisa i-EMI enezithelo. Kumele kwaziwe ukuthi indawo encane yesiginali akufanele ixhunywe kulo mhlaba wokuvikelwa, ngaphandle kwalokho izokwethula ukuphazamiseka okukhulu. Ukulandelwa okukhulu kwe-DV / DT kuvame ukuphazamiseka ku-radiator kanye nomhlaba oseduze ngokuhambisana nekhono. Kungcono ukuxhuma i-radiator yeshubhu lokushintsha emhlabathini wokuvikela. Ukusetshenziswa kwamadivayisi wokushintsha okungaphezulu kweMount kuzokwehlisa amandla ahambisanayo, ngaleyo ndlela kunciphise ukuhlangana nokuhlangana.

18. Kungcono ukungasebenzisi i-vias yokulandela okuthambekele ekuphazanyisweni, ngoba kuzophazamisa zonke izingqimba ezidlulayo.

19. Ukuvikelwa kunganciphisa i-EMI ye-radioted EMI, kepha ngenxa yokwanda kwe-capmacitance kuya emhlabathini, kwenziwa i-EMI (Imodi ejwayelekile, noma inqobo nje uma ungqimba lokuvikelwa kwesivikelo kahle, ngeke kukhuphuke kakhulu. Ingabhekwa ekwakhiweni kwangempela.

20. Ukuvimbela ukuphazamiseka okujwayelekile kokuphazamiseka, sebenzisa indawo eyodwa yamaphoyinti namandla avela endaweni eyodwa.

21 Indlela yokuxhuma komhlaba ikhonjiswa kumdwebo olandelayo:

22. Lapho ubeka phansi, qala ngokwahlulela uhlobo lomhlaba ngaphambi kokuxhuma. I-Ground for Sampling and Porer Amplification kufanele ixhunywe esigxotsheni esingesihle se-capacitor yokuphuma, futhi isibonakaliso sesampula kufanele sithathwe esigxotsheni esihle se-capacitor yokuphuma. Umhlaba omncane wokulawulwa kwesiginali kanye nomhlabathi we-drive kufanele uvame ukuxhunywa kwi-E / S Pole noma iSampling Resistar yeshubhu lokushintsha ngokulandelana ukuvikela ukuphazamiseka okuvamile. Imvamisa umhlabathi wokulawula bese ushayela umhlaba we-IC awuholwa ngokwahlukana. Ngalesi sikhathi, ukuholelwa okuholela ekuphikiseni kwesampula nale nkundla engenhla kumele kube okuncane ngangokunokwenzeka ukunciphisa ukuphazamiseka okujwayelekile kokuphazamiseka futhi kuthuthukise ukunemba kwesampula yamanje.

23. Inethiwekhi yesampula ye-voltage ye-voltage ingcono kakhulu ukuseduze kwephutha lokukhulisa hhayi kokukhipha. Lokhu kungenxa yokuthi amasiginali we-Insidedance aphansi atholakala kalula ekuphazanyisweni kunezimpawu eziphakeme zokuphazamiseka. Iminonjana yesampula kufanele isondele ngangokunokwenzeka komunye nomunye ukunciphisa umsindo othathwe.

24. Naka ukwakheka kwe-Inductors ukuze ube kude futhi okuhlangene komunye nomunye ukuze kuncishiswe ukwehla okubonakalayo, ikakhulukazi ama-inductor ama-Inductor kanye nezihlungi.

25. Nakani ukunaka ukwakheka lapho i-capacitor ephezulu kakhulu kanye ne-capacitor ephansi yemvamisa isetshenziswa ngokufana, i-capacitor ephezulu kakhulu isondele kumsebenzisi.

26 Ukuphazanyiswa okujwayelekile okujwayelekile kuyindlela ehlukile ehlukile (ngezansi kwe-1m), kanye nokuphazamiseka okuthe xaxa kuyindlela ejwayelekile, imvamisa kuhambisana nemisebe.

27. Uma isinali elivame kakhulu lihambisana nokuhola kokufaka, kulula ukwakha i-EMI (Imodi ejwayelekile). Ungabeka indandatho kazibuthe kokufaka okuholayo eduze kokuhlinzekwa kwamandla. Uma i-EMI incishisiwe, ibonisa le nkinga. Isixazululo sale nkinga ukunciphisa ukuhlanganiswa noma ukunciphisa i-EMI yesifunda. Uma umsindo ovame ukuvalwa ubucwebekile ungahlanzekile futhi wenziwe ku-Mov Working, i-EMI (Imodi Ehlukile) izokwakhiwa. Ngalesi sikhathi, indandatho kazibuthe ayikwazi ukuxazulula inkinga. I-String ama-Inductor amabili afudumele aphezulu (okufanayo) lapho kuholwa khona ukuhola kokunikezwa kwamandla. Ukwehla kukhombisa ukuthi le nkinga ikhona. Isixazululo sale nkinga ukuthuthukisa ukuhlunga, noma ukunciphisa isizukulwane somsindo omkhulu we-buffecting nge-buffering, ukuhlanganisa nezinye izindlela.

28. Ukulinganiswa kwemodi ehlukile nemodi ejwayelekile yamanje:

29 Ucingo olungenayo luvikelwe kangcono nge-chassis Ground (Indlela injengoba kuchaziwe ngenhla). Isihlungi se-EMI sokuphuma kufanele siphathwe ngendlela efanayo. Zama ukwandisa ibanga phakathi komugqa ongenayo kanye nomlandeli we-DV / DT ophakeme, futhi ubheke lokho.