Ukuminyana komhlangano kuphezulu, imikhiqizo ye-elekthronikhi mincane ngosayizi futhi ilula ngesisindo, futhi ivolumu nengxenye yezingxenye ze-patch cishe i-1/10 yezingxenye ze-plug-in zendabuko.
Ngemuva kokukhethwa okujwayelekile kwe-SMT, umthamo wemikhiqizo ye-elekthronikhi uyancipha ngo-40% kuya ku-60%, futhi isisindo sincishiswa ngo-60% kuya ku-80%.
Ukuthembeka okuphezulu nokumelana nokudlidliza okuqinile. Izinga lokukhubazeka eliphansi lejoyinti le-solder.
Izici ezinhle zefrikhwensi ephezulu. Kwehlisiwe ukuphazamiseka kwe-electromagnetic kanye ne-RF.
Kulula ukufeza okuzenzakalelayo, ukuthuthukisa ukusebenza kahle kokukhiqiza. Yehlisa izindleko ngo-30% ~ 50%. Londoloza idatha, amandla, okokusebenza, abasebenzi, isikhathi, njll.
Kungani usebenzisa i-Surface Mount Skills (SMT)?
Imikhiqizo ye-elekthronikhi ifuna ukwenziwa kancane, futhi izingxenye ze-plug-in ezinembobo esezisetshenzisiwe ngeke zisancishiswa.
Umsebenzi wemikhiqizo ye-elekthronikhi usuphelele kakhulu, futhi isekethe edidiyelwe (IC) ekhethiwe ayinazo izingxenye ezinembobo, ikakhulukazi ama-ics amakhulu, ahlanganiswe kakhulu, kanye nezingxenye zepetshi ezingaphezulu kufanele zikhethwe.
Ubuningi bomkhiqizo, i-automation yokukhiqiza, ifekthri ibe nezindleko eziphansi eziphumayo eziphezulu, ikhiqize imikhiqizo esezingeni ukuze ihlangabezane nezidingo zamakhasimende futhi iqinise ukuncintisana kwemakethe
Ukuthuthukiswa kwezingxenye ze-elekthronikhi, ukuthuthukiswa kwamasekethe ahlanganisiwe (ics), ukusetshenziswa okuningi kwedatha ye-semiconductor
Inguquko yobuchwepheshe be-elekthronikhi ibalulekile, ijahe ukuthambekela komhlaba
Kungani usebenzise inqubo engahlanzekile kumakhono wokukhweza ngaphezulu?
Enqubweni yokukhiqiza, amanzi angcolile ngemva kokuhlanza umkhiqizo kuletha ukungcoliswa kwekhwalithi yamanzi, umhlaba kanye nezilwane nezitshalo.
Ngaphezu kokuhlanza amanzi, sebenzisa izinyibilikisi zemvelo eziqukethe ama-chlorofluorocarbon (CFC&HCFC)Ukuhlanza nakho kubangela ukungcoliswa kanye nokulimala emoyeni nasemoyeni. Okusele kwe-ejenti yokuhlanza kuzodala ukugqwala ebhodini lomshini futhi kuthinte kakhulu ikhwalithi yomkhiqizo.
Yehlisa ukusebenza kokuhlanza kanye nezindleko zokulungisa umshini.
Akukho ukuhlanza okunganciphisa umonakalo odalwe yi-PCBA ngesikhathi sokunyakaza nokuhlanza. Kusenezingxenye ezithile ezingakwazi ukuhlanzwa.
I-flux residue ilawulwa futhi ingasetshenziswa ngokuhambisana nezidingo zokubukeka komkhiqizo ukuvimbela ukuhlolwa okubonakalayo kwezimo zokuhlanza.
I-flux eyinsalela iye yathuthukiswa ngokuqhubekayo ngomsebenzi wayo kagesi ukuze kuvinjwe umkhiqizo osuphelile ekuvuzeni kukagesi, okuholela ekulimaleni.
Yiziphi izindlela zokuhlonza iziqephu ze-SMT zesikhungo sokucubungula isichibi se-SMT?
Ukutholwa ekucubunguleni i-SMT kuyindlela ebaluleke kakhulu yokuqinisekisa ikhwalithi ye-PCBA, izindlela zokuthola eziyinhloko zifaka ukutholwa okubonakalayo okwenziwa ngesandla, ukutholwa kwegeji ye-solder paste, ukutholwa okuzenzakalelayo, ukutholwa kwe-X-ray, ukuhlolwa kwe-inthanethi, ukuhlolwa kwenaliti endizayo, njll., ngenxa yokuqukethwe okuhlukile kokutholwa nezici zenqubo ngayinye, izindlela zokuthola ezisetshenziswa kunqubo ngayinye nazo zihlukile. Endleleni yokuthola ye-smt patch processing plant, ukutholwa okubonakalayo okwenziwa ngesandla kanye nokuhlola okuzenzakalelayo kwe-Optical kanye nokuhlolwa kwe-X-ray yizindlela ezintathu ezivame ukusetshenziswa kakhulu ekuhlolweni kwenqubo yokuhlanganiswa kwendawo. Ukuhlola ku-inthanethi kungaba kokubili ukuhlola okumile nokuhlola okuguquguqukayo.
I-Global Wei Technology ikunikeza isingeniso esifushane kwezinye izindlela zokuthola:
Okokuqala, indlela yokuthola okubukwayo okwenziwa ngesandla.
Le ndlela inokokufaka okuncane futhi ayidingi ukuthuthukisa izinhlelo zokuhlola, kodwa iyanensa futhi incike futhi idinga ukuhlola ngokubukeka indawo elinganisiwe. Ngenxa yokuntuleka kokuhlola okubukwayo, akuvamile ukusetshenziswa njengendlela yokuhlola ikhwalithi ye-welding eyinhloko kumugqa wokucubungula we-SMT wamanje, futhi iningi lawo lisetshenziselwa ukuvuselela nokunye.
Okwesibili, indlela yokuthola i-optical.
Ngokuncishiswa kosayizi wephakeji yengxenye ye-PCBA chip kanye nokwanda kokuminyana kwesichibi sebhodi lesifunda, ukuhlolwa kwe-SMA kuya kuba nzima nakakhulu, ukuhlolwa kwamehlo okwenziwa ngesandla akunamandla, ukuzinza nokuthembeka kwayo kunzima ukuhlangabezana nezidingo zokukhiqiza nokulawula izinga, ngakho-ke. ukusetshenziswa kokutholwa okuguquguqukayo kuya ngokuya kubaluleke kakhulu.
Sebenzisa i-automated Optical inspection (AO1) njengethuluzi lokunciphisa amaphutha.
Ingasetshenziselwa ukuthola nokuqeda amaphutha kusenesikhathi enqubweni yokucubungula isichibi ukuze kuzuzwe ukulawula okuhle kwenqubo. I-AOI isebenzisa amasistimu okubona athuthukile, izindlela ezintsha zokuphakela ukukhanya, ukukhuliswa okuphezulu nezindlela eziyinkimbinkimbi zokucubungula ukuze kuzuzwe amazinga aphezulu okuthwebula amaphutha ngesivinini esiphezulu sokuhlola.
Isikhundla se-AOl emugqeni wokukhiqiza we-SMT. Ngokuvamile kunezinhlobo ezi-3 zemishini ye-AOI emugqeni wokukhiqiza we-SMT, eyokuqala i-AOI ebekwa esibukweni sokuphrinta ukuze kutholwe iphutha lokunamathisela i-solder, okubizwa ngokuthi i-post-screen printing AOl.
Eyesibili i-AOI ebekwa ngemva kwesichibi ukuze kutholwe amaphutha okukhweza idivayisi, ebizwa ngokuthi i-post-patch AOl.
Uhlobo lwesithathu lwe-AOI lufakwa ngemva kokugeleza kabusha ukuze kutholwe amaphutha okukhwezwa kwedivayisi nokushisela ngesikhathi esifanayo, okubizwa ngokuthi i-post-reflow AOI.
