1. Inqubo engezansi

Ingqimba ye-Chemical Copper isetshenziselwa ukukhula okuqondile kwemigqa yomqhubi wendawo kwi-Non-Coression Substrate Substrate Suptrate ngosizo lwe-inhibitor eyengeziwe.

Izindlela zokungeza ebhodini lesekethe zingahlukaniswa ngokungezwa okugcwele, ukwengezwa kwesigamu nokungezwa ngokwengxenye nezinye izindlela ezahlukahlukene.

2. Backpanels, ama-backplanes

Kuyinto obukhulu (njenge-0.093 ", 0.125") Ibhodi yesekethe, elisetshenziselwa ngokukhethekile ukuxhuma nokuxhuma amanye amabhodi. Lokhu kwenziwa ngokufaka isixhumi se-Multi-Pin emgodini oqinile, kepha hhayi ngokuzingisa, bese kuthathwa ngakunye ngocingo lapho isixhumi esidlula khona ebhodini. Isixhumi singafakwa ngokuhlukile ebhodini lesekethe elijwayelekile. Ngenxa yalokhu iBhodi ekhethekile, i-Phole ayikwazi ukuthengisa, kepha ake i-SHOW Wall, ngakho-ke izidingo zekhwalithi yekhwalithi yazo ayizimisele kakhulu, kodwa cishe kube lula ukwamukela lolu hlobo lwe-oda, kepha cishe lube yinto ephezulu yemboni ekhethekile e-United States.

I-3. Inqubo Yokwakha

Le nsimu entsha yokwenza ubuningi be-multilayer, ukuKhanyiswa Kwasekuqaleni kuthathwe kwinqubo ye-IBM ye-IBC, lapho kususelwa ku-Photos52 ngaphambi kwe-Photon Photos, kusukela nge-Photon Double Phonel, kusukela ku-Photon Double Phonel, kusukela ku-Photon Double Phonel "Service kufana ne-Photos nge-Fomu elandelayo" (isithombe - Nge), bese kuthi-ke kukhulise umqhubi wamakhemikhali wesendlalelo se-Copper ne-Copper Plating, nangemva kokucabanga okucatshangelwayo kanye nokufaka umugqa kanye nokufaka ucingo olusha, kungathola ucingo olusha futhi nomgodi oyimpumputhe. Ukulandela okuphindaphindiwe kuzoveza inani elidingekayo lezendlalelo. Le ndlela ayikwazi ukugwema kuphela izindleko ezibizayo zokumba ngomshini, kepha futhi anciphise ububanzi bomgodi ube ngaphansi kwe-10mil. Eminyakeni engu-5 ~ 6 edlule, zonke izinhlobo zokwephula ubuchwepheshe bendabuko bamukela ubuchwepheshe be-multilayer ezilandelanayo, embonini yaseYurophu ngaphansi kwe-push, yenza le nqubo yokwakha, imikhiqizo ekhona ibhalwe ngaphezulu kwezinhlobo ezingaphezu kwe-10. Ngaphandle kokuthi "ama-pores photosensive"; Ngemuva kokususa isembozo sethusi ngezimbobo, izindlela ezihlukile "zemigodi" ezinjenge-alkaline cheming etching, i-laser ablation, kanye ne-plasma etching zamukelwe amapuleti ezi-organic. Ngaphezu kwalokho, i-resin resin ehlanganisiwe yethusi i-foil foil (i-resin coep foil foil) ihlanganiswe ne-resin elukhuni futhi ingasetshenziswa ukwenza ipuleti elinemincane elinamancanyana elinobuningi obunokukhanya okulandelanayo. Esikhathini esizayo, imikhiqizo ye-elekthronikhi yomuntu ehlukahlukene ibe yilolu hlobo lomhlaba omncane we-multi omhlophe futhi omfushane.

4. I-CERMET

I-Ceramic powder kanye ne-metal powder kuxutshaniswe, futhi okunamathelayo kufakwa njengohlobo lokuhlanganiswa, olungaphrintwa phezu kwebhodi yokujikeleza (noma i-waryer yangaphakathi) ngefilimu eliwugqinsi noma ngefilimu "yangaphandle, esikhundleni sangaphandle ngesikhathi somhlangano.

5. Ukudubula

Kuyinqubo yeBhodi yeseketheli ye-Porcelain Hybrid Circuit. Imigqa yesekethe yokunamathisela kwefilimu okuwugqinsi kwezinhlobo ezahlukahlukene zensimbi eyigugu ephrintiwe ebusweni bebhodi elincane lixoshwa emazingeni okushisa aphezulu. Izithwali ezahlukahlukene ze-organic ku-paste yefilimu eminyene zishiswa, zishiya imigqa yomqhubi wensimbi oyigugu ukuze isetshenziswe njengezintambo zokuxhumana

6. I-Crossover

Ukuwela okunezinhlangothi ezintathu kwezintambo ezimbili endaweni ebhodini kanye nokugcwaliswa kwe-infaiting medium phakathi kwamaphoyinti okudonsa abizwa. Ngokuvamile, indawo eluhlaza eluhlaza eluhlaza kanye ne-jumper yefilimu yekhabhoni, noma indlela yesendlalelo engenhla nangaphansi kwe-wiring iyi "Crossoover" enjalo.

7. Ibhodi ye-Worting

Elinye igama lebhodi elinama-wiring amaningi, lenziwa ngocingo oluyindilinga oluhlanganisiwe olunamathiselwe ebhodini futhi lihlanganiswe nezimbobo. Ukusebenza kwalolu hlobo lweBhodi Ye-Multiplex kulayini wokudluliselwa okuphezulu kakhulu kungcono kunomugqa wesikwele esicwengekile egxishwe yi-PCB ejwayelekile.

8.

Inkampani yeSwitzerland Dyconex yathuthukisa ukwakhiwa kwenqubo eZurich. Kuyindlela enelungelo lobunikazi yokususa i-foil ye-Copper ezikhundleni zezimbobo epuletini First, bese uyibeka nge-CF4, bese uyigcwalisa nge-CH4, bese uyigcwalisa nge-CHRASTER YOKUZIPHATHA KAKHULU, ongasetshenziselwa izimbobo zesisekelo (ngaphansi kwe-10mil). Inqubo yezentengiselwano ibizwa ngokuthi i-dycostrate.

9. I-Electro-I-Photoresist

I-Electrical PhotoSestist, i-Electrophoretic PhotoSesusistance iyindlela entsha yokwakha "yokulwa ne-PhotoShive", ekuqaleni esetshenziselwa ukubonakala kwezinto eziyinkimbinkimbi zensimbi "upende kagesi", osanda kwethulwa kuhlelo lokusebenza lwe- "PhotoSestistance". Nge-Electroplating, izinhlayiya ze-colloidal ezikhokhiswayo ze-resin ekhokhiswayo ye-Photosession Resin zihlotshiswe ngendlela efanayo ebusweni bethusi beBhodi yesekethe njengoba i-inhibitor ibhekene ne-etching. Njengamanje, kusetshenziswe ekukhiqizeni okuningi enqubweni ye-Copper Direct Etching ye-Laminate yangaphakathi ye-Laminate. Lolu hlobo lwe-ed photoresist lungabekwa e-anode noma e-cathode ngokulandelana ngokuya ngezindlela ezahlukahlukene zokusebenza, ezibizwa ngokuthi "Anode Photoresist" ne "Photoresist". Ngokwesimiso esihlukile sezithombe, kukhona "i-polymerization" (ukusebenza kabi) kanye "nokuwohloka kwezithombe" (ukusebenza okuhle) nezinye izinhlobo ezimbili. Njengamanje, uhlobo olubi lwe-ed photoresistance seluthengisiwe, kepha lungasetshenziswa kuphela njengomenzeli wokumelana neplanethi. Ngenxa yobunzima be-photosensitive ku-pay-hole, ayikwazi ukusetshenziselwa ukudluliswa kwesithombe kwepuleti yangaphandle. Ngokuqondene "ne-Heal Ed", engasetshenziswa njenge-ejenti ye-Photoresist yepuleti yangaphandle (ngenxa yolwelwesi lwe-photossensitive, ukuntuleka komkhakha we-hole kusaphazamiseka ekusebenziseni ukusetshenziswa kwezintambo eziningi, ukuze ukukhiqizwa kwemigqa emincane kungatholakala kalula. Igama libizwa nangokuthi i-electrothoretic Photoresist.

10. I-Flush Conductor

YiBhodi Yesekethe ekhethekile etshalwa ngokuphelele ngokubukeka futhi icindezela yonke imigqa yomqhubi epuletini. Umkhuba wephaneli wayo eyodwa ukusebenzisa indlela yokudlulisa isithombe e-ETCH ingxenye ye-foil ye-Copper yendawo yebhodi ebhodini lesisekelo eliqinile. Izinga lokushisa eliphakeme nendlela ephezulu yokucindezela kuzoba umugqa webhodi ungene epuletini elukhuni, ngasikhathi sinye ukuqedela umsebenzi wokuqina weplate resin, emgqeni ungene ebusweni nakwisigibeli besifunda. Imvamisa, ungqimba lwethusi oluncanyana lufakwe endaweni yokujikeleza ethosiwe ukuze ungqimba lwe-0.3mil nickel, ungqimba lwe-20-intshi, noma ungqimba lwegolide olungu-10 lungahlelwa ukuhlinzeka ngokumelana nokuxhumana okuphansi futhi kube lula ukuslayida ngesikhathi sokuxhumana ngokuslayida. Kodwa-ke, le ndlela akufanele isetshenziselwe i-pth, ukuze ivimbele umgodi ukuthi uqhume lapho ucindezela. Akulula ukufeza indawo ebushelelezi ebhodini, futhi akufanele isetshenziswe ekushiseni okuphezulu, uma kwenzeka i-resin inwebeka bese icindezela umugqa ngaphandle. Eyaziwa nangokuthi i-etchand-push, ibhodi eliqediwe libizwa ngokuthi ibhodi elinamakhanda futhi lingasetshenziselwa izinhloso ezikhethekile njengokushintshana kwe-rotary kanye noxhumana nabo besula.

11. Frit

Ku-Poly Shirt Film (PTF) Ukuphrinta ukunamathisela, ngaphezu kwamakhemikhali ensimbi ayigugu, i-glass powder isadingeka ukuthi ingezwe ukuze kuthathwe umphumela wokuncibilika kokushisa okushisayo, ukuze ukunamathisela kokuphrinta okuphezulu kwe-ceramic substrate kungadala uhlelo oluqinile lwensimbi yensimbi.

12. Inqubo Engezansi Engezansi

Kusendaweni eshidi yokufakelwa okuphelele, ngaphandle kwe-electrodeposition yendlela yensimbi (iningi elikhulu yi-Chemic Copper), ukukhula komjikelezo wokujikeleza okukhethiwe, enye into etholakala kahle "i-electroless" ephelele ".

13. I-Hybrid ehlanganisiwe Circtuit

Kuyinto ephansi ye-porcelain encane ephansi, endaweni yokuphrinta yokufaka umugqa wensimbi ohlekisayo we-ink, bese kuthi ngento ephezulu yokushisa inki i-ink organic ship away, ishiye umugqa womqhubiseli ebusweni, futhi ingafeza izingxenye zokubopha umqhubi. Kuluhlobo lomjikelezo wesifunda lobuchwepheshe befilimu obukhulu phakathi kwebhodi lokujikeleza eliphrintiwe kanye ne-semiconductor ehlanganisiwe ye-semiconductor ehlanganisiwe. Phambilini osetshenziselwa izicelo zezempi noma eziphezulu, i-hybrid ikhule kangako ngokushesha eminyakeni yamuva ngenxa yezindleko zayo eziphakeme, ukwehlisa amakhono ezempi, kanye nobunzima ekukhiqizeni okuncane, kanye nokukhiqizwa kwe-miniit amabhodi wesifunda.

14. I-STROSESER

I-InterPoser ibhekisela kunoma yiziphi izingqimba ezimbili zabaqhubi abaqhutshwa ngumzimba ophangayo oqhutshwa ngokungeza i-filler esebenzayo endaweni ezokwenza. Isibonelo, emgodini ongenalutho wepuleti ye-multilayer, izinto ezifana nokugcwalisa isiliva noma uthukutha unamathisela udonga lwama-Orthodox Hole Hole, noma izinto ezinjenge-vertical UnidiRectional, noma izinto zonke zihumusha zalolu hlobo.

15. I-Laser Direct imaging (LDI)

Kuyinto ukucindezela ipuleti elinamathiselwe kwifilimu eyomile, ayisasebenzi ukuvezwa okungalungile kokudluliselwa kwesithombe, kepha esikhundleni se-Computer Command Laser ugongolo, ngqo kwifilimu eyomile yokuthwebula okusheshayo kwezithombe. Udonga oluseceleni lwefilimu eyomile ngemuva kokuzenzakalela mpo kakhudlwana ngoba ukukhanya okukhishwe kufana nogongolo lwamandla ahlanganisiwe. Kodwa-ke, indlela ingasebenza kuphela ebhodini ngalinye, ngakho-ke ijubane lokukhiqizwa kwesisindo lishesha kakhulu kunokusebenzisa ukuvezwa kwefilimu nokuvezwa kwendabuko. I-LDI ingakhiqiza kuphela amabhodi angama-30 osayizi ophakathi ngehora, ngakho-ke kungavela ngezikhathi ezithile esigabeni sokufakazelwa kweshidi noma intengo ephezulu. Ngenxa yezindleko eziphakeme zokuzalwa, kunzima ukukhuthaza embonini

16.I-Laser Maching

Embonini ye-elekthronikhi, kunemishini eminingi eqondile, njengokusika, ukumba, ukuthukwa, njll. I-laser ibhekisa ku "ukukhanya okulula okuvuselelwa okuvuselelwa kwemisebe" izifinyezo, okuhunyushwe ngokuthi "i-laser" embonini yezwe ngokuhumusha kwayo kwamahhala, ngaphezulu kuze kube seqophelweni. I-laser yadalwa ngo-1959 nge-american physicist th moser, eyasebenzisa ugongolo olulodwa lokukhanya ukukhiqiza ukukhanya kwe-laser kumarubi. Iminyaka yocwaningo idale indlela entsha yokucubungula. Ngaphandle komkhakha we-elekthronikhi, ingasetshenziswa nasezinkameni zezokwelapha nakwezempi

17. Ibhodi Yezintambo Micro

Ibhodi yesifunda elikhethekile elinesixhumanisi se-Pth interborction laziwa kakhulu ngokuthi i-Multiwireboard. Lapho ubuningi be-wiring buphezulu kakhulu (160 ~ 250in / in2), kepha ububanzi bentambo buncane kakhulu (ngaphansi kwama-25mil), kuyaziwa nangokuthi ibhodi yesekethe ebekwe uphawu micro.

18. I-CirXuit ebunjiwe

Isebenzisa isikhunta esinezici ezintathu, yenza indlela yokubumba noma indlela yokuguqula ukuqedela inqubo ye-Stereo Circuit Board, ebizwa ngokuthi isifunda esibunjiwe noma isifunda sokuxhumeka kwesistimu

19. IBhodi ye-Muliwiring (i-Discrete Wiring Board)
Isebenzisa i-wire emfishane kakhulu, ngqo ebusweni ngaphandle kwepuleti lethusi elinama-wiring amathathu, bese-ke nge-coating fixed and dring holed kanye ne-cliating hole, i-multi-will complonct board, eyaziwa ngokuthi "i-multi-wire Lokhu kwakhiwa yi-PCK, inkampani yaseMelika, futhi isakhiqizwa nguHitachi nenkampani yaseJapan. Le mwb ingonga isikhathi ekwakhiweni futhi ilungele inani elincane lemishini enemibuthano eyinkimbinkimbi.

20. Unamathisela wensimbi enhle

Kungukuphana okuphaphama kokuphrinta kwesekethe amafilimu. Lapho iphrinta i-ceramic substrate ngokuphrinta kwesikrini, bese kubaphathi be-organic kushiswe ekushiseni okuphezulu, kuvela umjikelezo wensimbi omuhle wensimbi. I-powder yensimbi esetshenziselwe i-paste kufanele ibe yinsimbi enhle ukugwema ukwakheka kwama-oxides amazinga okushisa aphezulu. Abasebenzisi bezimpahla banegolide, iplatinamu, i-rhodium, i-palladium noma ezinye izinsimbi eziyigugu.

21. Amaphakethe kuphela ebhodi

Ezinsukwini zokuqala zokusetshenziswa kwe-paile, amabhodi athile athembekile aphezulu avele ashiye i-hole kanye ne-weld ring ngaphandle kwepuleti futhi afihle imigqa yokuxhumanisa engxenyeni ephansi yangaphakathi ukuqinisekisa ikhono elithengisiwe. Lolu hlobo lwezendlalelo ezimbili ezengeziwe zeBhodi ngeke ziphrinte upende oluhlaza oluhlaza, ngokubonakala ukunakwa okukhethekile, ukuhlolwa kwekhwalithi kuqinile kakhulu.

Njengamanje ngenxa yokukhuphuka kwe-wiring, imikhiqizo eminingi ye-elekthronikhi ephathekayo (efana nefoni ephathekayo), i-internonner yobuso obuphukile i-smt soldering pad noma i-pailing hole hole "(pads-on-hole), njengoba i-interconnect) Ukulimala kwe-Copper Surface, ipuleti le-SMT libuye libe namapada kuphela ebhodi

22. Ifilimu elibanzi le-polymer (PTF)

Kukunamathisela okuphrinta okuphrinta okuyigugu okuyigugu ekwenziweni kwemibuthano, noma ukunamathisela kokuphrinta okwakha ifilimu yokumelana ephrintiwe, engxenyeni yokuphrinta ye-ceramic, ngokuphrinta kwesikrini nokushisa okushisa okuphezulu nokushisa okuphezulu okushisa. Lapho isithwali se-organic sishisiwe, kwakhiwa uhlelo lwemibuthano yesifunda eqinile. Amapuleti anjalo ngokuvamile abizwa ngokuthi yimibuthano e-hybrid.

23. Inqubo esemi-additive

Kukhonkotha ezintweni eziyisisekelo zokufakelwa, ukukhulisa umjikelezo odinga kuqala ngqo nge-Chemical Copper, ushintsho futhi lusho ukuthi i-Electroplate Copper isho ukuthuthumela okulandelayo, shayela "inqubo" yesengezo ".

Uma indlela ye-Chemical Copper isetshenziselwa konke ukuqina komugqa, inqubo ibizwa ngokuthi "isengezo esiphelele". Qaphela ukuthi le ncazelo engenhla isuka ku- * Ukucaciswa kwe-IPC-T-50 kushicilelwe ngoJulayi 1992, okuhlukile ku-IPC-T-50D yasekuqaleni (Novemba 1988). I-Early "D version", njengoba yaziwa kakhulu embonini, ibhekisela kwi-substrate engaphansi kwe-foil engenalutho, engaqhutshwa, noma emincane (enjenge-1 / 8oz noma 1 / 8oz). Ukudluliswa kwesithombe kwe-ejenti yokumelana kabi kulungiselelwe futhi umjikelezo odingekayo uhlanganiswe yi-Ched Ched Chepper noma ithusi. I-New 50E ayisho igama elithi "ncapha lethu". Igebe phakathi kwalezi zitatimende ezimbili likhulu, futhi imibono yabafundi ibukeka ivela ngezikhathi.

Inqubo eyi-24.Substrate

Yindawo engezansi yokususwa kwe-foil engenamsebenzi ye-topper engenamsebenzi, indlela yokujikeleza yesekethe eyaziwa ngokuthi "indlela yokunciphisa", iyona ebaluleke kakhulu ebhodini lesekethe iminyaka eminingi. Lokhu kuphambene nendlela "yokungezelela" yokwengeza imigqa yomqhubi weCopper ngqo kwi-substrate engenasisekelo.

25. I-Shiwe Circuit yefilimu

I-PTF (i-polymer i-paste yefilimu ebanzi), equkethe izinsimbi eziyigugu, iphrintiwe ku-ceramic substrate (njenge-aluminium trioxide) bese idubula ngamazinga okushisa aphezulu okwenza uhlelo lokujikeleza okuphezulu, olubizwa ngokuthi "umjikelezo wamafilimu". Kuluhlobo lomjikelezo omncane we-hybrid. I-jumper yesiliva i-jumper kuma-PC esinezinhlangothi zombili nayo iyabhalwa ngefilimu kodwa ayidingi ukuxoshwa emazingeni okushisa aphezulu. Imigqa ephrintiwe ebusweni bezigatshana ezahlukahlukene ibizwa nge- "Fily Film" kuphela lapho ubukhulu bungaphezu kuka-0.1mm [4mil], kanye nobuchwepheshe bezokwenziwa "bubizwa ngokuthi" ubuchwepheshe befilimu obukhulu ".

26. Ubuchwepheshe befilimu obuncanyana
Kungumqhubi futhi ukuxhumanisa isifunda okunamathiselwe ku-substrate, lapho ubukhulu bungaphansi kuka-0.1mm [4mil], ukuhlanganiswa kwe-catholic, i-electroning, i-anodizing, i-anodizing, njll, ibizwa ngokuthi "ubuchwepheshe befilimu obuncanyana". Imikhiqizo engokoqobo ine-Fing Hybrid Circuit kanye neFile Film Completated Circuit, njll

27. Dlulisa umjikelezo we-lamicatied

Kuyindlela entsha yokukhiqiza ebhodini le-Circuit Board, kusetshenziswa usayizi we-93mil kusetshenzwe kahle ipuleti yensimbi engenasici, okokuqala yenza ukuhanjiswa kwehluzo ezingezinhle zefilimu eyomile, bese kuthi-ke i-Pepper ye-Pepper esheshayo yethusi. Ngemuva kokuhlubula ifilimu eyomile, isitholi sensimbi engenasici esingabizi singacindezelwa ekushiseni okuphezulu siye kwifilimu eliqine. Ngemuva kwalokho khipha ipuleti yensimbi engenasici, ungathola ubuso be-Flat Circuit Eshuped Circuit Bholi. Ingalandelwa ngokumba kanye nezimbobo zokufaka izimboni ukuthola ukuxhumana kwe-interlayer.

CC - 4 CopperCleper4; I-Photoresist ebekelwe i-Edelectro-ebekiwe iyindlela ephelele yokwengeza eyenziwe yinkampani ekhethekile ye-American PCK kwi-substrate ekhethekile yamahhala (bheka i-athikili ekhethekile ku-47 umagazini we-47 yolwazi lwe-Circuit board imininingwane ngemininingwane). I-MLC (I-Cultilayer Ceramic) (I-Local Inter LAMAMAR NGOKUGCINA); I-PID encane yeplate (isithombe esibonakalayo) I-PTF (Media Media) I-polymer file file Circuit (ene-paste yamafilimu athambile ebhodi lokujikeleza) ye-SLC (imijikelezo ye-laminanamin); Umugqa we-Raiting Coating ubuchwepheshe obusha oshicilelwe yi-IBM Yasu Laboratory, Japan ngoJuni-1993. Kuyinto yokuxhumanisa ehlukene nge-centrain coating ngopende oluhlaza okotshani, olususa isidingo sokumba kanye nezimbobo zokufaka ipuleti.