1. Inqubo Yokwengeza
Isendlalelo sethusi samakhemikhali sisetshenziselwa ukukhula okuqondile kwemigqa ye-conductor yendawo endaweni ye-non-conductor substrate ngosizo lwe-inhibitor eyengeziwe.
Izindlela zokwengeza ebhodini lesifunda zingahlukaniswa zibe ukwengeza okugcwele, ukufakwa kwesigamu kanye nokwengezwa okuyingxenye nezinye izindlela ezahlukene.
2. Backpanels, Backplanes
Iyibhodi lesifunda eliwugqinsi (elifana no-0.093″,0.125″), elisetshenziselwa ngokukhethekile ukuxhuma nokuxhuma amanye amabhodi. Lokhu kwenziwa ngokufaka i-multi-pin Connector emgodini oqinile, kodwa hhayi ngokuhlanganisa, bese ufaka izintambo ngayinye ngayinye ocingweni lapho Isixhumi sidlula khona ebhodini. Isixhumi singafakwa ngokwehlukana ebhodini lesifunda jikelele. Ngenxa yalokhu ibhodi elikhethekile, 'imbobo' yayo ayikwazi ukudayiswa, kodwa vumela udonga lwembobo kanye nentambo yokuqondisa ukusetshenziswa okuqinile kwekhadi, ukuze izidingo zayo zekhwalithi kanye nokuvula kuqine kakhulu, inani le-oda layo aliningi, ifektri yebhodi lesifunda jikelele alizimisele futhi akulula ukwamukela lolu hlobo lokuhleleka, kodwa selicishe libe yizinga eliphezulu lemboni ekhethekile e-United States.
3. Inqubo ye-BuildUp
Lona umkhakha omusha wokwenza i-multilayer encane, ukukhanyiselwa kwangaphambi kwesikhathi kususelwa kunqubo ye-IBM SLC, ekukhiqizeni kwayo isilingo sesitshalo saseJapan saseYasu kwaqala ngo-1989, indlela isuselwa kuphaneli yendabuko ephindwe kabili, njengoba amaphaneli amabili angaphandle aqala ikhwalithi ebanzi. njenge-Probmer52 ngaphambi kokumboza i-photosensitive ewuketshezi, ngemva kwengxenye yesixazululo esiqinile nesibucayi njengokwenza izimayini ngongqimba olulandelayo lwefomu elingashoni “umqondo wembobo yokubona” (Isithombe – Via), bese kuba ukukhulisa amakhemikhali okuhlanganisa i-conductor yethusi ne-copper plating. ungqimba, futhi ngemva kokuthwebula umugqa nokushumeka, kungathola intambo entsha kanye nokuxhuma okungaphansi kwembobo egqitshiwe noma imbobo eyimpumputhe. Ukwendlalela okuphindaphindiwe kuzoveza inani elidingekayo lezendlalelo. Le ndlela ayikwazi ukugwema kuphela izindleko ezibizayo zokumba imishini, kodwa futhi inciphisa ububanzi bembobo ibe ngaphansi kuka-10mil. Eminyakeni engu-5 ~ 6 edlule, zonke izinhlobo zokuphulwa kwesendlalelo sendabuko zisebenzisa ubuchwepheshe be-multilayer obulandelanayo, embonini yaseYurophu ngaphansi kwe-push, yenza inqubo enjalo ye-BuildUp, imikhiqizo ekhona ibalwe ngaphezu kwezinhlobo ezingu-10. Ngaphandle kwama-“photosensitive pores”; Ngemva kokukhipha ikhava yethusi enezimbobo, izindlela ezihlukene “zokwakhiwa kwemigodi” ezifana ne-alkaline chemical Etching, i-Laser Ablation, ne-Plasma Etching ziyamukelwa kumapuleti ezinto eziphilayo. Ngaphezu kwalokho, i-Resin Coated Copper Foil entsha (i-Resin Coated Copper Foil) ehlanganiswe ngenhlaka eqiniswe kancane ingase isetshenziselwe ukwenza ipuleti lezendlalelo eziningi elizacile, elincane nelincane elinesequential Lamination. Ngokuzayo, imikhiqizo ye-elekthronikhi yomuntu siqu ehlukahlukene izoba yilolu hlobo lomhlaba webhodi lebhodi elinezingqimba eziningi mncane ngempela.
4. Cermet
Impushana ye-Ceramic kanye ne-metal powder kuyaxutshwa, futhi i-adhesive yengezwa njengohlobo lokumboza, olungaphrintwa phezu kwebhodi lesifunda (noma ungqimba lwangaphakathi) ngefilimu ewugqinsi noma ifilimu elincanyana, njengendawo yokubeka "resistor", esikhundleni i-resistor yangaphandle ngesikhathi sokuhlanganisa.
5. Ukudubulana
Kuyinqubo yebhodi yesifunda ye-porcelain Hybrid. Imigqa yesifunda ye-Thick Film Paste yezinsimbi ezihlukahlukene eziyigugu eziphrintiwe ebusweni bebhodi elincane zishiswa ekushiseni okuphezulu. Izithwali ezihlukahlukene ze-organic kunamathisele ifilimu ewugqinsi ziyashiswa, kushiye imigqa yekhondatha yensimbi eyigugu ukuze isetshenziswe njengezintambo zokuxhuma.
6. I-Crossover
Ukuphambana kwezintambo ezintathu-ntathu kwezintambo ezimbili endaweni yebhodi kanye nokugcwaliswa kwe-insulating medium phakathi kwamaphoyinti okudonsa kubizwa. Ngokuvamile, indawo eyodwa kapende eluhlaza okotshani kanye ne-jumper yefilimu ye-carbon, noma indlela yongqimba ngenhla nangaphansi kwezintambo kukhona “i-Crossover” enjalo.
7. I-Discreate-Wiring Board
Elinye igama lebhodi le-multi-wiring , lenziwe ngocingo oluyindilinga olunamathele ebhodini futhi lumbozwe ngezimbobo. Ukusebenza kwalolu hlobo lwebhodi le-multiplex kumugqa wokudlulisa imvamisa ephezulu kungcono kunomugqa oyisikwele oyisicaba oqoshwe i-PCB ejwayelekile.
8. Isu le-DYCO
Inkampani yaseSwitzerland iDyconex ithuthukise iBuildup of the Process eZurich. Kuyindlela enelungelo lobunikazi yokukhipha ucwecwe lwethusi ezindaweni zezimbobo endaweni yepuleti kuqala, bese ulubeka endaweni evalekile ye-vacuum, bese uyigcwalisa nge-CF4, N2, O2 ukuze i-ionize ku-voltage ephezulu ukwenza i-Plasma esebenza kakhulu. , engasetshenziswa ukugqwala isisekelo sezindawo ezinembobo futhi ikhiqize izimbobo ezincane zomhlahlandlela (ngaphansi kuka-10mil). Inqubo yokuhweba ibizwa nge-DYCOstrate.
9. I-Electro-Deposited Photoresist
I-photoresistance kagesi, i-electrophoretic photoresistance iyindlela entsha yokwakha "i-photosensitive resistance", eyasetshenziswa ekuqaleni ukubukeka kwezinto eziyinkimbinkimbi zensimbi "upende kagesi", osanda kwethulwa kuhlelo lokusebenza lwe-"photoresistance". Ngokusebenzisa i-electroplating, izinhlayiya ze-colloidal ezishajwayo ze-photosensitive charged resin zipulekwa ngokulinganayo endaweni yethusi yebhodi lesekethe njengesivimbeli ngokumelene nokubhibha. Njengamanje, isetshenziswe ekukhiqizeni ngobuningi ohlelweni lwe-copper etching ngqo ye-laminate yangaphakathi. Lolu hlobo lwe-ED photoresist lungafakwa ku-anode noma ku-cathode ngokulandelana ngezindlela ezihlukene zokusebenza, ezibizwa nge-“anode photoresist” kanye “ne-cathode photoresist”. Ngokomgomo ohlukile we-photosensitive, kukhona “i-photosensitive polymerization ” (Negative Working) kanye ” ne-photosensitive decomposition ” (Positive Working) nezinye izinhlobo ezimbili. Njengamanje, uhlobo olungeluhle lwe-ED photoresistance seluthengiswa, kodwa lungasetshenziswa kuphela njenge-ejenti yokumelana ne-planar. Ngenxa yobunzima be-photosensitive ku- through-hole, ayikwazi ukusetshenziselwa ukudlulisa isithombe sepuleti langaphandle. Ngokuqondene ne-“positive ED”, engasetshenziswa njenge-ejenti ye-photoresist yepuleti langaphandle (ngenxa ye-photosensitive membrane, ukuntuleka komphumela we-photosensitive odongeni lwembobo akuthinteki), imboni yaseJapane isaqinisa imizamo thengisa ukusetshenziswa kokukhiqiza ngobuningi, ukuze ukukhiqizwa kwemigqa emincane kuzuzwe kalula. Leli gama libizwa nangokuthi i-Electrothoretic Photoresist.
10. I-Flush Conductor
Kuyibhodi lesekethe elikhethekile elibonakala liyisicaba ngokuphelele futhi licindezela yonke imigqa ye-conductor epuletini. Umkhuba wephaneli yayo eyodwa ukusebenzisa indlela yokudlulisa isithombe ukunamathisela ingxenye yefoyili yethusi yendawo yebhodi ebhodini lempahla eyisisekelo eliqine kancane. Amazinga okushisa aphezulu kanye nendlela yokucindezela okukhulu kuzoba umugqa webhodi ongene epuletini eliqiniswe kancane, ngesikhathi esifanayo ukuqedela umsebenzi wokuqina we-resin yepuleti, ungene emgqeni ongaphezulu kanye nawo wonke amabhodi esekethe ayisicaba. Imvamisa, ungqimba oluncane lwethusi luqoshwa endaweni yesekethe ehlehliswayo ukuze ungqimba lwe-nickel ongu-0.3mil, ungqimba lwe-rhodium lwamayintshi angu-20, noma ungqimba lwegolide oluyi-intshi elingu-10 kukwazi ukugxivizwa ukuze kunikeze ukumelana okuphansi kokuxhumana kanye nokushelela kalula phakathi nokuslayida. . Kodwa-ke, le ndlela akufanele isetshenziselwe i-PTH, ukuze kuvinjwe imbobo ukuthi ingaqhumi lapho ucindezela. Akulula ukufeza indawo ebushelelezi ngokuphelele yebhodi, futhi akufanele isetshenziswe ekushiseni okuphezulu, uma kwenzeka i-resin ikhula bese iphusha umugqa ngaphandle. Eyaziwa nangokuthi i-Etchand-Push, Ibhodi eliqediwe libizwa nge-Flush-Bonded Board futhi lingasetshenziselwa izinjongo ezikhethekile ezifana ne-Rotary Switch kanye Nokwesula Oxhumana Nabo.
11. I-Frit
Kunamathisela wokuphrinta we-Poly Thick Film (PTF), ngaphezu kwamakhemikhali ensimbi ayigugu, impushana yengilazi isadingeka ukuze kwengezwe ukuze kudlale umphumela wokufingqa nokunamathela ekuncibilikeni kwezinga lokushisa eliphezulu, ukuze ukunamathisela okuphrintiwe kuqhubeke. i-ceramic substrate engenalutho ingakha uhlelo oluqinile lwesekethe yensimbi eyigugu.
12. Inqubo Eyengeza Ngokugcwele
Kuphezu kweshidi lokufakwa okuphelele, ngaphandle kwe-electrodeposition yendlela yensimbi (iningi liyithusi lamakhemikhali), ukukhula komkhuba wokujikeleza okukhethiwe, enye inkulumo engalungile ukuthi "I-Electroless Full".
13. I-Hybrid Integrated Circuit
Kuyi-porcelain encane encane engaphansi, endleleni yokunyathelisa ukuze kusetshenziswe umugqa weyinki wensimbi ohloniphekile, bese kuthi ngoyinki wokushisa ophezulu ushiswe, ushiye umugqa womqhubi phezulu, futhi ungenza izingxenye zokubopha phezulu ze-welding. Kuwuhlobo lomthwali wesifunda wobuchwepheshe befilimu obukhulu phakathi kwebhodi lesifunda eliphrintiwe kanye nedivayisi yesekethe ehlanganisiwe ye-semiconductor. Ngaphambilini esetshenziselwa izicelo zezempi noma eziphakeme kakhulu, i-Hybrid ikhule kancane kakhulu eminyakeni yamuva ngenxa yezindleko zayo eziphakeme, ukwehla kwamandla ezempi, nobunzima bokukhiqiza okuzenzakalelayo, kanye nokukhula okuncane nokuyinkimbinkimbi kwamabhodi wesifunda.
14. Umkhulumeli
I-Interposer ibhekisela kunoma yiziphi izendlalelo ezimbili zamakhondakta athwetshulwa umzimba we-insulating eziqhutshwa ngokungeza isigcwalisi esihambisayo endaweni okufanele ibe yi-conductive. Isibonelo, embobeni engenalutho yepuleti le-multilayer, izinto ezinjengokugcwalisa ukunamathisela kwesiliva noma ukunamathisela kwethusi ukuze kuthathelwe indawo udonga lwembobo yethusi ye-orthodox, noma izinto ezifana nosendlalelo senjoloba yokuqhuba unidirectional mpo, zonke zingabahlanganisi balolu hlobo.
15. I-Laser Direct Imaging (LDI)
Ukucindezela ipuleti elinamathiselwe efilimini eyomile, ungabe usasebenzisa ukuchayeka okungekuhle ukuze udlulise isithombe, kodwa esikhundleni somugqa womyalo wekhompyutha we-laser, ngqo kwifilimu eyomile ukuze kuthwetshulwe ngokushesha izithombe ze-photosensitive. Udonga oluseceleni lwefilimu eyomile ngemva kokuthwebula luqonde kakhulu ngenxa yokuthi ukukhanya okukhishwayo kuhambisana nenduku eyodwa yamandla agxilile. Kodwa-ke, indlela ingasebenza kuphela ebhodini ngalinye ngabanye, ngakho-ke isivinini sokukhiqiza ngobuningi siyashesha kakhulu kunokusebenzisa ifilimu nokuchayeka kwendabuko. I-LDI ingakhiqiza kuphela amabhodi angama-30 osayizi omaphakathi ngehora, ngakho-ke ingavela ngezikhathi ezithile kuphela esigabeni sokuhlolwa kweshidi noma inani eliphezulu leyunithi. Ngenxa yezindleko eziphakeme zokuzalwa, kunzima ukukhuthaza embonini
16.I-Laser Maching
Embonini ye-elekthronikhi, kuningi ukucubungula okunembile, njengokusika, ukubhola, ukushisela, njll., kungasetshenziswa futhi ukwenza amandla okukhanya kwe-laser, okubizwa ngokuthi indlela yokucubungula i-laser. I-LASER isho izifinyezo “Zokukhulisa Ukukhanya Okuvuselelwe Ukukhishwa Kwemisebe”, ezihunyushwe ngokuthi “LASER” yimboni yezwekazi ngokuhumusha kwayo kwamahhala, kufinyelele iphuzu. I-Laser yadalwa ngo-1959 yisazi sefiziksi saseMelika u-th moser, owasebenzisa i-beam eyodwa yokukhanya ukukhiqiza ukukhanya kwe-Laser kumarubi. Iminyaka yocwaningo idale indlela entsha yokucubungula. Ngaphandle kwemboni ye-electronics, ingasetshenziswa futhi emikhakheni yezokwelapha nezempi
17. Ibhodi Lezintambo Ezincane
Ibhodi lesifunda elikhethekile elinokuxhumana kwe-PTH interlayer livame ukubizwa ngokuthi i-MultiwireBoard. Uma ukuminyana kwezintambo kuphezulu kakhulu (160 ~ 250in/in2), kodwa ububanzi bezintambo buncane kakhulu (ngaphansi kuka-25mil), yaziwa nangokuthi ibhodi lesifunda elivaliwe.
18. Umjikelezo Obunjiwe
Isebenzisa isikhunta esinezinhlangothi ezintathu, yenza ukubumba komjovo noma indlela yokuguqula ukuze kuqedelwe inqubo yebhodi lesekhethi ye-stereo, ebizwa ngokuthi iSekethe Ebunjiwe noma isekethe yoxhumano lwesistimu
19 . I-Muliwiring Board ( Ibhodi Lezintambo Ezihlukene)
Isebenzisa intambo encane kakhulu enoqweqwe lwawo, ngqo ngaphezulu ngaphandle kwepuleti lethusi lezintambo ezihlukene ezintathu, bese ngokuhlanganisa imbobo engaguquki, yokubhoboza nembobo, ibhodi yesekethe ye-multi-layer interconnect, eyaziwa ngokuthi “ibhodi lezintambo eziningi. ”. Lokhu kuthuthukiswa yi-PCK, inkampani yaseMelika, futhi isakhiqizwa yi-Hitachi ngenkampani yaseJapane. Le MWB ingonga isikhathi ekwakhiweni kwayo futhi ifanele inombolo encane yemishini enamasekhethi ayinkimbinkimbi.
20. Noble Metal Paste
Iwunamathisela ophathekayo wokuphrinta kwesekethe yefilimu ewugqinsi. Uma iphrintwa ku-substrate ye-ceramic ngokuphrinta kwesikrini, bese isithwali se-organic sishiswa ekushiseni okuphezulu, kuvela isekethe yensimbi engaguquki. I-conductive metal powder eyengezwe ku-paste kumele ibe insimbi ehloniphekile ukugwema ukwakheka kwama-oxide emazingeni okushisa aphezulu. Abasebenzisi bezimpahla banegolide, iplatinum, i-rhodium, i-palladium noma ezinye izinsimbi eziyigugu.
21. Ibhodi Lamaphedi Kuphela
Ezinsukwini zokuqala zokusebenzisa imbobo yembobo, amanye amabhodi ezendlalelo eziningi athembeke kakhulu avele ashiya imbobo nendandatho yokushisela ngaphandle kwepuleti futhi afihla imigqa exhumayo kungqimba olungaphakathi olungezansi ukuze kuqinisekiswe ikhono elithengisiwe nokuphepha komugqa. Lolu hlobo lwezingqimba ezimbili ezengeziwe zebhodi ngeke luphrintiwe welding green paint, ekubukeni kokunaka okukhethekile, ukuhlolwa kwekhwalithi kuqinile kakhulu.
Njengamanje ngenxa yokwanda kokuminyana kwezintambo, imikhiqizo eminingi ye-elekthronikhi ephathekayo (efana nomakhalekhukhwini), ubuso bebhodi lesifunda bushiya kuphela i-SMT soldering pad noma imigqa embalwa, kanye nokuxhumana kwemigqa eminyene engxenyeni yangaphakathi, i-interlayer nayo inzima. ekuphakameni kwezimayini kukhona imbobo eyimpumputhe ephukile noma imbobo eyimpumputhe "ikhava" (I-Pads-On-Hole), njenge-interconnect ukuze kuncishiswe imbobo yonke nge-voltage umonakalo omkhulu wethusi, ipuleti le-SMT liphinde libe yi-Pads Kuphela Ibhodi
22. Ifilimu yePolymer Thick (PTF)
Yinsimbi eyigugu yokuphrinta yokunamathisela esetshenziswa ekwenziweni kwamasekhethi, noma ukunamathisela okuphrintayo kwakha ifilimu ephikisayo ephrintiwe, endaweni engaphansi ye-ceramic, ephrinta isikrini kanye nokushiswa kwezinga lokushisa okuphezulu okulandelayo. Lapho isithwali se-organic sishiswa, kwakheka uhlelo lwamasekethe anamathiselwe ngokuqinile. Amapuleti anjalo ngokuvamile abizwa ngokuthi ama-circuit hybrid.
23. I-Semi-Additive Process
Kuwukukhomba on the material base of ukwahlukanisa, ukhule isekethe edinga kuqala ngqo ngethusi amakhemikhali, shintsha futhi electroplate zethusi kusho ukuqhubeka ukujiya ngokulandelayo, shayela "Semi-Additive" inqubo.
Uma indlela yekhemikhali yethusi isetshenziswa kukho konke ukushuba komugqa, inqubo ibizwa ngokuthi "ukwengeza okuphelele". Qaphela ukuthi incazelo engenhla isuka ku-* specication ipc-t-50e eyanyatheliswa ngo-July 1992, ehlukile kweyokuqala ipc-t-50d (November 1988). “Inguqulo ka-D” yasekuqaleni, njengoba yaziwa kakhulu embonini, isho i-substrate engenalutho, engaconsi, noma encane ye-copper foil (efana no-1/4oz noma 1/8oz). Ukudluliswa kwesithombe se-ejenti yokumelana ne-negative kulungiswa futhi isifunda esidingekayo siqiniswa ngamakhemikhali ethusi noma i-copper plating. I-50E entsha ayikhulumi ngegama elithi "ithusi elincanyana". Igebe phakathi kwalezi zitatimende ezimbili likhulu, futhi imibono yabafundi ibonakala iguquke neThe Times.
24.Inqubo yokususa
Ingaphezulu le-substrate yokususwa kwe-foil yethusi engenamsebenzi yendawo, indlela yebhodi lesifunda eyaziwa ngokuthi "indlela yokunciphisa", iyona ehamba phambili yebhodi lesifunda iminyaka eminingi. Lokhu kuphambene nendlela "yokwengeza" yokwengeza imigqa yekhondatha yethusi ngokuqondile ku-substrate engenakhopha.
25. Isekethe Yefilimu Eminyene
I-PTF (I-Polymer Thick Film Paste), equkethe izinsimbi eziyigugu, iphrintwa ku-substrate ye-ceramic (njenge-aluminium trioxide) bese ixoshwa ekushiseni okuphezulu ukuze kwenziwe isistimu yesifunda nge-conductor yensimbi, ebizwa ngokuthi "i-thick film circuit". Iwuhlobo lwe-Hybrid Circuit encane. I-Silver Paste Jumper ku-PCBS enohlangothi olulodwa nayo iphrinta ifilimu kodwa ayidingi ukushiswa emazingeni okushisa aphezulu. Imigqa ephrintiwe ebusweni bama-substrates ahlukahlukene ibizwa ngokuthi imigqa "yefilimu ewugqinsi" kuphela lapho ukujiya kungaphezu kuka-0.1mm[4mil], futhi ubuchwepheshe bokukhiqiza "uhlelo lwesifunda" olunjalo lubizwa ngokuthi "ubuchwepheshe befilimu obukhulu".
26. I-Thin Film Technology
Kuyi-conductor kanye nesekethe exhumayo enamathiselwe ku-substrate, lapho ukujiya kungaphansi kuka-0.1mm[4mil], okwenziwe yi-Vacuum Evaporation, Pyrolytic Coating, Cathodic Sputtering, Chemical Vapor Deposition, electroplating, anodizing, njll., okubizwa ngokuthi “mncane ubuchwepheshe befilimu”. Imikhiqizo esebenzayo ineThin Film Hybrid Circuit kanye neThin Film Integrated Circuit, njll.
27. Dlulisa Isekethe eneLaminatied
Indlela entsha yokukhiqiza ibhodi lesifunda, kusetshenziswa ugqinsi ongu-93mil kucutshungulwe ipuleti lensimbi engenasici elibushelelezi, okokuqala kwenziwa ukudlulisa okungekuhle kwezithombe zefilimu eyomile, bese kuba ulayini we-copper plating onesivinini esikhulu. Ngemva kokuhlubula ifilimu eyomile, ingaphezulu lepuleti lensimbi engagqwali lingacindezelwa ekushiseni okuphezulu kufilimu eqiniswe kancane. Bese ususa ipuleti lensimbi engagqwali, ungathola ingaphezulu lebhodi lesifunda eliyisicaba elishumekiwe. Ingalandelwa ukubhoboza kanye nezimbobo zokucwenga ukuze kutholwe ukuxhumana kwe-interlayer.
I-CC - 4 i-coppercomplexer4; I-photoresist ye-Edelectro-deposited iyindlela yokwengeza ingqikithi eyenziwe yinkampani yaseMelika PCK ku-substrate ekhethekile engenakhothusi (bheka isihloko esikhethekile mayelana nomagazini wama-47 wolwazi lwebhodi lesifunda ukuze uthole imininingwane).Ukumelana nokukhanya kagesi IVH (I-Interstitial Via Hole); I-MLC (I-Multilayer Ceramic) (i-inter laminar yendawo ngembobo);I-PID yepuleti elincane (Isithombe esibonakalayo I-Dielectric) amabhodi esekethe e-ceramic multilayer; I-PTF (imidiya yezithombe ezizwelayo) Isekethe yefilimu ewugqinsi yePolymer (eneshidi lokunamathisela lefilimu eliwugqinsi lebhodi lesifunda eliphrintiwe) SLC (Iziyingi Ze-Surface Laminar); I-surface coating line ubuchwepheshe obusha obushicilelwe ilabhorethri ye-IBM Yasu, e-Japan ngo-June 1993. Iwumugqa ohlanganisa izingqimba eziningi nopende oluhlaza we-Curtain Coating kanye nethusi elenziwe nge-electroplating ngaphandle kwepuleti elinamacala amabili, oqeda isidingo ukubhoboza nokufaka izimbobo epuletini.