Ezinye izimiso ezincane zenqubo yokukopisha ye-PCB

1: Isisekelo sokukhetha ububanzi bocingo oluphrintiwe: ububanzi obuncane bocingo oluphrintiwe buhlobene namanje ogeleza ngocingo: ububanzi bomugqa buncane kakhulu, ukumelana kocingo oluphrintiwe kukhulu, kanye nokwehla kwamandla kagesi. emgqeni mkhulu, othinta ukusebenza kwesifunda. Ububanzi bomugqa bubanzi kakhulu, ukuminyana kwezintambo akuphakeme, indawo yebhodi iyanda, ngaphezu kwezindleko ezikhulayo, ayihambisani ne-miniaturization. Uma umthwalo wamanje ubalwa njengo-20A / mm2, lapho ubukhulu becwecwe lensimbi yethusi bungu-0.5 MM, (imvamisa eminingi kakhulu), umthwalo wamanje we-1MM (cishe 40 MIL) ububanzi bomugqa ngu-1 A, ngakho ububanzi bomugqa kuthathwa njengo-1-2.54 MM (40-100 MIL) angahlangabezana nezidingo ezijwayelekile zohlelo lokusebenza. Intambo yaphansi kanye nokunikezwa kwamandla ebhodini lezinto ezisebenza ngamandla aphezulu kungakhuliswa ngokufanelekile ngokuya ngosayizi wamandla. Kumasekhethi edijithali anamandla aphansi, ukuze kuthuthukiswe ukuminyana kwezintambo, ububanzi obuncane bomugqa bunganeliswa ngokuthatha u-0.254-1.27MM (10-15MIL). Ebhodini lesifunda elifanayo, intambo yamandla. Intambo yaphansi ijiyile kunentambo yesignali.

2: Isikhala somugqa: Uma singu-1.5MM (cishe u-60 MIL), ukumelana nokufakwa phakathi kwemigqa kukhulu kuno-20 M ohms, futhi amandla kagesi aphezulu phakathi kwemigqa angafinyelela ku-300 V. Uma isikhala somugqa singu-1MM (40 MIL ), i-voltage enkulu phakathi kwemigqa ingu-200V Ngakho-ke, ebhodini lesifunda lamandla kagesi aphakathi nendawo (i-voltage phakathi kwemigqa ayingaphezu kuka-200V), ukuhlukaniswa komugqa kuthathwa njenge-1.0-1.5 MM (40-60 MIL) . Emasekhethini kagesi aphansi, njengezinhlelo zesekethe yedijithali, akudingekile ukucabangela i-voltage yokuwohloka, njengoba inqubo ende yokukhiqiza ivumela, ingaba yincane kakhulu.

3: Iphedi: Kokumelana ne-1 / 8W, ububanzi bokuhola kwephedi bungama-28MIL kwanele, futhi ku-1/2 W, ububanzi bungama-32 MIL, imbobo yokuhola inkulu kakhulu, futhi ububanzi bendandatho yethusi yephedi buncishisiwe. Okuholela ekunciphiseni kokunamathela kwephedi. Kulula ukuwa, imbobo yokuhola incane kakhulu, futhi ukubekwa kwengxenye kunzima.

4: Dweba umngcele wesifunda: Ibanga elifushane kakhulu phakathi komugqa womngcele kanye nephinikhodi yengxenye alikwazi ukuba ngaphansi kuka-2MM, (ngokuvamile u-5MM unengqondo kakhulu) ngaphandle kwalokho, kunzima ukusika impahla.

5: Isimiso sesakhiwo sengxenye: A: Isimiso esivamile: Ekwakhiweni kwe-PCB, uma kukhona kokubili amasekhethi edijithali namasekhethi e-analog ohlelweni lwesekethe. Kanye namasekhethi asezingeni eliphezulu, kumele abekwe ngokwehlukana ukuze kuncishiswe ukuhlangana phakathi kwamasistimu. Ohlotsheni olufanayo lwesekethe, izingxenye zibekwe kumabhulokhi kanye nokuhlukaniswa ngokuya kwesiqondiso sokugeleza kwesignali kanye nomsebenzi.

I-6: Iyunithi yokucubungula isignali yokufaka, isici sedrayivu yesignali ephumayo kufanele ibe seduze nohlangothi lwebhodi lesifunda, yenza umugqa wesiginali wokufaka nowokukhipha ube mfushane ngangokunokwenzeka, ukuze unciphise ukuphazamiseka kokufaka nokuphumayo.

7: Isiqondiso sokubekwa kwengxenye: Izingxenye zingahlelwa kuphela ngezinkomba ezimbili, ezivundlile neziqondile. Uma kungenjalo, ama-plug-in awavunyelwe.

8: Isikhala se-elementi. Kumabhodi aphakathi nendawo, isikhala phakathi kwezingxenye ezincane ezifana nezimbangi zamandla aphansi, ama-capacitor, ama-diode, nezinye izingxenye ezihlukene zihlobene nenqubo ye-plug-in ne-welding. Ngesikhathi se-wave soldering, isikhala sengxenye singaba ngu-50-100MIL (1.27-2.54MM). Okukhudlwana, njengokuthatha i-100MIL, i-chip yesekethe ehlanganisiwe, isikhala sengxenye ngokuvamile singu-100-150MIL.

9: Uma umehluko ongaba khona phakathi kwezingxenye mkhulu, isikhala phakathi kwezingxenye kufanele sibe sikhulu ngokwanele ukuvimbela ukukhishwa.

10: Ku-IC, i-decoupling capacitor kufanele ibe seduze nephinikhodi yaphansi ye-chip. Uma kungenjalo, umphumela wokuhlunga uzoba mubi kakhulu. Kumasekhethi edijithali, ukuze kuqinisekiswe ukusebenza okuthembekile kwezinhlelo zesekethe yedijithali, ama-capacitor e-IC decoupling afakwa phakathi kokunikezwa kwamandla kanye nomhlabathi we-chip ngayinye yesekethe ehlanganisiwe yedijithali. Ama-Decoupling capacitor ngokuvamile asebenzisa ama-ceramic chip capacitor anomthamo ongu-0.01 ~ 0.1 UF. Ukukhethwa komthamo we-decoupling capacitor ngokuvamile kusekelwe ku-reciprocal of system operating frequency F. Ngaphezu kwalokho, i-capacitor engu-10UF kanye ne-ceramic capacitor engu-0.01 UF nazo ziyadingeka phakathi kolayini wamandla nomhlabathi emnyango wokunikezwa kwamandla wesekethe.

11: Ingxenye yesekhethi yesandla sehora kufanele ibe seduze ngangokunokwenzeka nephinikhodi yesignali yewashi ye-chip ye-microcomputer chip eyodwa ukuze kuncishiswe ubude bokuxhuma besekhethi yewashi. Futhi kungcono ukuthi ungagijimi ucingo olungezansi.