Ekwakhiweni kwe-pcb, sivame ukuzibuza ukuthi ngabe ubuso be-pcb kufanele bumbozwe ngethusi? Lokhu empeleni kuncike esimweni, okokuqala sidinga ukuqonda izinzuzo nezingozi zethusi elingaphezulu.

Okokuqala ake sibheke izinzuzo ze-copper coating:

1. Indawo yethusi inganikeza ukuvikeleka okwengeziwe kokuvikela kanye nokucindezelwa komsindo kwesignali yangaphakathi;
2. Ingathuthukisa amandla okukhipha ukushisa kwe-pcb
3. Enqubweni yokukhiqiza ye-PCB, yonga inani le-ejenti egqwalayo;
4. Gwema i-PCB warping deformation ebangelwa i-PCB phezu kwengcindezi yokugeleza kabusha okubangelwa ukungalingani kwe-copper foil

I-surface copper ehambisanayo nayo inobubi obuhambisanayo:

I-1, indiza yangaphandle embozwe ngethusi izohlukaniswa izingxenye ezingaphezulu kanye nemigqa yesignali ihlukaniseke, uma kukhona ucwecwe lwethusi olungasekelwe kahle (ikakhulukazi lelo thusi elincanyana ende eliphukile), lizoba i-antenna, okuholela ezinkingeni ze-EMI;

Ngalolu hlobo lwesikhumba sethusi singakwazi futhi ukumba ngomsebenzi wesofthiwe

2.Uma iphinikhodi yengxenye imbozwe ngethusi futhi ixhunywe ngokugcwele, izobangela ukulahlekelwa ukushisa ngokushesha kakhulu, okuholela ebunzimeni ekushiseni nasekulungiseni i-welding, ngakho-ke ngokuvamile sisebenzisa indlela yokubeka ithusi yokuxhumanisa izingxenye ze-patch.

Ngakho-ke, ukuhlaziya ukuthi ingabe ingaphezulu limbozwe ngethusi lineziphetho ezilandelayo:

1, PCB design for the izingqimba ezimbili ibhodi, enamathela zethusi kuyadingeka kakhulu, ngokuvamile phansi phansi, ungqimba phezulu idivayisi main futhi uhambe ulayini wamandla kanye signal line.
I-2, yesifunda se-impedance ephezulu, isifunda se-analog (isifunda sokuguqulwa kwe-analog-to-digital, ukushintsha imodi yokuguqula amandla okuhambisa amandla), ukumboza ithusi kuwumkhuba omuhle.
3.Kumasekhethi edijithali anezingqimba eziningi anesivinini esiphezulu esinamandla aphelele kanye nendiza yaphansi, phawula ukuthi lokhu kubhekisela kumasekhethi edijithali anesivinini esikhulu, futhi ukumbozwa kwethusi kungqimba lwangaphandle ngeke kulethe izinzuzo ezinkulu.
I-4.Ngokusetshenziswa kwe-multi-layer board circuit digital, ungqimba lwangaphakathi lunogesi ophelele, indiza yomhlabathi, i-copper coating ebusweni ayikwazi ukunciphisa kakhulu i-crosstalk, kodwa eduze kakhulu nethusi kuzoshintsha ukuvinjelwa komugqa wokudlulisa we-microstrip, ithusi elingapheli lizophinde libangele umthelela omubi ekunqanyulweni komugqa wokudlulisela.
5.Kumabhodi amaningi, lapho ibanga phakathi komugqa we-microstrip kanye nendiza yereferensi ingu-<10mil, indlela yokubuya yesiginali ikhethwa ngokuqondile endizeni yereferensi etholakala ngaphansi komugqa wesignali, kuneshidi lethusi elizungezile, ngenxa ye-impedance yayo ephansi. Kumapuleti anezingqimba ezimbili anebanga elingu-60mil phakathi komugqa wesignali kanye nendiza eyireferensi, isembozo sethusi esiphelele kuwo wonke umzila wesignali singanciphisa kakhulu umsindo.
6.Kumabhodi anezingqimba eziningi, uma kukhona amadivaysi angaphezulu kanye nezintambo, ungasebenzisi ithusi ukuze ugweme ithusi eliphukile ngokweqile. Uma izingxenye ezingaphezulu kanye nezimpawu zejubane eliphezulu zincane, ibhodi alinalutho, ukuze ufeze izidingo zokucubungula i-PCB, ungakhetha ukubeka ithusi phezulu, kodwa unake umklamo we-PCB phakathi komugqa wesiginali yethusi nesivinini esiphezulu okungenani i-4W noma ngaphezulu, ukugwema ukushintsha isici somugqa wesignali.