Kufanele ngabe uxhuma i-vivis ye-PCB, lolu lwazi luhlobo luni lolo lwazi?

Umgodi ophethe ngomgodi waziwa nangokuthi nge-hole. Ukuze uhlangabezane nezidingo zamakhasimende, ibhodi yesekethe ngombala kufanele ixhunywe. Ngemuva kokuzijwayeza okuningi, inqubo yendabuko ye-aluminium pluving iguquliwe, futhi i-mask yesekethe ye-salder ye-porgity ye-plug iphothulwa nge-mesh emhlophe. hole. Ukukhiqizwa okuzinzile nekhwalithi ethembekile.

Nge-Via Hole idlala indima yokuxhumana nokuhlangana kwemigqa. Ukuthuthukiswa komkhakha we-elekthronikhi nakho kukhuthaza ukuthuthukiswa kwe-PCB, futhi kubeka nezidingo eziphakeme phambili kwinqubo yokukhiqiza yeBhodi ephrintiwe kanye nobuchwepheshe be-Surface Mount. Ngobuchwepheshe be-Phole Plugging bangene, futhi kufanele bahlangabezane nezidingo ezilandelayo:

(1) Kukhona ithusi emgodini we-via, futhi imaskhi yesitshel ingaxhunyiwe noma ingaxhunyiwe;
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Ngokuthuthukiswa kwemikhiqizo ye-elekthronikhi ekuqondeni "kokukhanya, mncane, amafushane futhi amancane", ama-PCB nawo athuthukiswe ekubuthakathaka okuphezulu nobunzima obuphezulu. Ngakho-ke, inani elikhulu le-SMT ne-BGA PCBS avele, futhi amakhasimende adinga ukugiliswa lapho kukhuphuka izinto, ikakhulukazi kufaka phakathi imisebenzi emihlanu:

. Ikakhulu lapho sibeka umgodi we-via kwi-BGA Pad, kufanele siqale ngenze umgodi we-plug bese uthwebula igolide ukuze wenze lula i-BGA Soldering.
(2) Gwema izinsalela ze-Flux ezigodini ze-Via;
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Ukuqaphela inqubo yokuhambisa umgodi evuthayo

Kwamapulangwe e-Surface Mount, ikakhulukazi ukubekwa kwe-BGA ne-IC, i-Via Hole plug kumele ibe isicaba, i-convex kanye ne-concave plus noma i-an cursil, futhi akumelwe kube ne-tin ebomvu emaphethelweni omgodi we-via; Umgodi we-Via ufihla ibhola le-tin, ukuze ufinyelele kumakhasimende ngokuya ngezidingo, inqubo ye-via hole plug ingachazwa njengembumbulu, inqubo inzima ukuyilawula, futhi inqubo inzima ukuyilawula, futhi inqubo ivame ukwehliswa ngesikhathi sokuvuselelwa komoya oshisayo; Izinkinga ezinjengokuqhuma kawoyela ngemuva kokuphulukisa. Ngokwemibandela yangempela yokukhiqiza, izinqubo ezahlukahlukene zokuxhuma ze-PCB zifingqiwe, futhi ukuqhathanisa kanye nezincazelo zenziwa kwinqubo nezinzuzo nokubi:

Qaphela: Umgomo osebenzayo wokulinganisa umoya oshisayo ukusebenzisa umoya oshisayo ukuze ususe umthengisi ngokweqile kusuka ebusweni nasezimbozweni zebhodi yesekethe ephrintiwe. Umthengisi osele ngokulinganayo ahlanganiswe emaphaketheni, imigqa ye-solder engamelana nokungamelana nalokhu, okuyindlela yokwelashwa engaphezulu yebhodi yesekethe ephrintiwe.

1. Inqubo yokufaka phakathi ngemuva kokushisa komoya okushisayo

Ukugeleza kwenqubo yile: Board Surder Soler Mask → Hal → I-Plug Hole → Ukwelapha. Inqubo engaxhunyiwe ku-pluving yamukelwa ukukhiqizwa. Ngemuva kokuthi umoya oshisayo udedelwe, isikrini se-aluminium sheet noma isikrini sokuvinjwa kwe-ink sisetshenziselwa ukuqedela i-via hole plug edingwa yikhasimende kuzo zonke izinqaba. I-ink yokufaka i-ink ingaba yinki noma i-ink ye-thermosetting. Ngaphansi kwesimo sokuthi umbala wefilimu omanzi awuguquki, i-plugging ink ingcono ukusebenzisa i-inki efanayo ne-board. Le nqubo ingaqinisekisa ukuthi izimbobo ngeke zilahlekelwe uwoyela ngemuva kokuthi umoya oshisayo ukhungathekile, kepha kulula ukudala i-ink ye-plug ink ukungcolisa indawo yebhodi futhi ongalingani. Amakhasimende athambekele ekuthengisweni kwamanga (ikakhulukazi ku-BGA) ngesikhathi sokukhwela. Amakhasimende amaningi kangaka awamukeli le ndlela.

2. I-Hot Air Leveling and Plug Hole Technology

2.1 Sebenzisa i-Aluminium Sheet ukuze uxhume umgodi, uqinise, futhi uPolish ibhodi lokudluliswa kwezithombe

Le nqubo isebenzisa umshini wokulawula wokulawula izinombolo ukuze ukhiphe ishidi le-aluminium elidinga ukuxhufalwa ukuze wenze isikrini, bese ukuxhuma umgodi ukuze uqinisekise ukuthi umgodi we-via ugcwele. I-plug hole uyinki nayo ingasetshenziswa nge-thermosetting ink, futhi izici zayo kumele ziqine. , I-shrinkage ye-resin incane, futhi amandla obugqila ngodonga lomgodi muhle. Ukugeleza kwenqubo yile: Ukwelashwa kwangaphambi kokwelashwa → ipulaki ipulaki → Plate Plate

Le ndlela ingaqinisekisa ukuthi umgodi we-plug we-via hole uyisicaba, futhi ngeke kube khona izinkinga zekhwalithi ezinjengokuqhuma kwamafutha kanye nowoyela onqenqemeni onqenqemeni olushisayo. Kodwa-ke, le nqubo idinga ukuqina kwesikhashana kwethusi ukwenza ukuqina kwethusi kodonga lomgodi kuhlangabezane nezinga lekhasimende. Ngakho-ke, izidingo zokuthwebula ipuleti kulo lonke ipuleti ziphezulu kakhulu, futhi ukusebenza komshini wokugaya ipuleti nakho kuphakeme kakhulu, ukuqinisekisa ukuthi i-resin ebusweni bethusi isuswe ngokuphelele, futhi indawo yethusi ihlanzekile futhi ayingcolisiwe. Amafektri amaningi we-PCB awanayo inqubo yokuqina ye-Copper yesikhathi esisodwa, futhi ukusebenza kwemishini akuhlangabezani nezidingo, okuholela ekusetshenzisweni kwale nqubo kumafektri e-PCB.

1. Inqubo yokufaka phakathi ngemuva kokushisa komoya okushisayo

2. I-Hot Air Leveling and Plug Hole Technology

2.1 Sebenzisa i-Aluminium Sheet ukuze uxhume umgodi, uqinise, futhi uPolish ibhodi lokudluliswa kwezithombe

Le nqubo isebenzisa umshini wokulawula wokulawula izinombolo ukuze ukhiphe ishidi le-aluminium elidinga ukuxhufalwa ukuze wenze isikrini, bese ukuxhuma umgodi ukuze uqinisekise ukuthi umgodi we-via ugcwele. I-plug hole uyinki nayo ingasetshenziswa nge-ink ye-thermosetting, futhi izici zayo kumele ziqine. Ukugeleza kwenqubo yile: Ukwelashwa kwangaphambi kokwelashwa → ipulaki ipulaki → Plate Plate

2.2 Ngemuva kokuxhuma umgodi nge-aluminium sheet, phrinta ngqo isikrini sebhodi lomthengisi

Le nqubo isebenzisa umshini wokushayela i-CNC ukumba ishidi le-aluminium elidinga ukuxhunywa ukuze kwenziwe isikrini, likufake emshinini wokuphrinta wesikrini ukuwuqhuba ngaphezu kwemizuzu engama-30 ngemuva kokuqeda ukufakwa kwebhodi. Ukugeleza kwenqubo yile: PlTRETHENTCHERY-PLUL HOOL-SILK Screen-Ukuvezwa Kokuvezwa - Ukuthuthukiswa Kwentuthuko

Le nqubo ingaqinisekisa ukuthi i-Via Hole imbozwe kahle ngamafutha, umgodi we-plug uyisicaba, kanti umbala wefilimu omanzi awuguquki. Ngemuva kokuthi umoya oshisayo uthambekele, ungaqinisekisa ukuthi umgodi we-via awukhonjiswanga futhi ubuhlalu be-tin abufihlekile emgodini, kepha kulula ukudala uyinki emgodini ngemuva kokuqhuma amaphakethe abangele ukuzungeza okumpofu; Ngemuva kokuthi umoya oshisayo udwetshwe, imiphetho ye-vias bubbles kanye namafutha kuyasuswa. Kunzima ukulawula ukukhiqizwa ngale ndlela yenqubo, futhi onjiniyela benqubo kumele basebenzise izinqubo ezikhethekile namapharamitha ukuqinisekisa ikhwalithi yezimbobo ze-plua.

2.2 Ngemuva kokuxhuma umgodi nge-aluminium sheet, phrinta ngqo isikrini sebhodi lomthengisi

Le nqubo ingaqinisekisa ukuthi i-Via Hole imbozwe kahle ngamafutha, umgodi we-plug uyisicaba, kanti umbala wefilimu omanzi awuguquki. Ngemuva kokuthi umoya oshisayo uthambile, kungaqinisekisa ukuthi umgodi we-via awukhonjiswanga futhi ubuhlalu be-tin abufihlekile emgodini, kodwa kulula ukudala uyinki emgodini ngemuva kokuphulukisa amaphakethe abangela amandla ampofu kakhulu; Ngemuva kokuthi umoya oshisayo udwetshwe, imiphetho ye-vias bubbles kanye namafutha kuyasuswa. Kunzima ukulawula ukukhiqizwa ngale ndlela yenqubo, futhi onjiniyela benqubo kumele basebenzise izinqubo ezikhethekile namapharamitha ukuqinisekisa ikhwalithi yezimbobo ze-plua.