Imbobo yokuqhuba i-Via hole yaziwa nangokuthi ngembobo. Ukuze kuhlangatshezwane nezidingo zamakhasimende, ibhodi lesekhethi ngembobo kufanele lixhunywe. Ngemva kokuzijwayeza okuningi, inqubo yokuxhuma i-aluminium yendabuko iyashintshwa, futhi imaski ye-solder yebhodi lesifunda kanye nokuxhuma kuqedwa nge-mesh emhlophe. umgodi. Ukukhiqizwa okuzinzile kanye nekhwalithi ethembekile.
I-Via hole idlala indima yokuxhuma kanye nokuqhutshwa kwemigqa. Ukuthuthukiswa kwemboni ye-elekthronikhi kuphinde kugqugquzele ukuthuthukiswa kwe-PCB, futhi kubeka phambili izidingo eziphakeme enqubweni yokukhiqiza ibhodi ephrintiwe kanye nobuchwepheshe bokukhweza phezulu. Ubuchwepheshe bokuxhuma imbobo baba khona, futhi kufanele buhlangabezane nezidingo ezilandelayo:
(1) Kukhona ithusi embotsheni ye-via, futhi imaski ye-solder ingaxhunywa noma ingaxhunywa;
(2) Kumelwe kube ne-tin-lead emgodini odlulayo, onesidingo esithile sokujiya (ama-microns ama-4), futhi kungabikho uyinki we-solder mask okufanele ungene embobeni, okubangela ukuthi ubuhlalu bethayela bufihlwe embobeni;
(3) Izimbobo zokuphumela ngaphandle kufanele zibe nezimbobo zepulaki yepulaki yemaski ye-solder, i-opaque, futhi akumele zibe namasongo kathayela, ubuhlalu bethayela, kanye nezidingo zokuthi flat.
Ngokuthuthukiswa kwemikhiqizo ye-elekthronikhi ekuqondeni "okulula, okuncane, okufushane nokuncane", ama-PCB nawo athuthuke ekuminyana okuphezulu kanye nobunzima obukhulu. Ngakho-ke, inani elikhulu lama-PCB e-SMT kanye ne-BGA avele, futhi amakhasimende adinga ukuxhunywa lapho efaka izingxenye, ikakhulukazi okuhlanganisa imisebenzi emihlanu:
(1) Vimbela isifunda esifushane esibangelwa ithini elidlula endaweni esuka embotsheni lapho i-PCB ithengiswa ngamagagasi; ikakhulukazi uma sibeka i-via hole kuphedi ye-BGA, kufanele siqale senze imbobo yepulaki bese sinamathisela igolide ukuze kube lula ukuhlanganisa i-BGA.
(2) Gwema izinsalela ezigelezayo emigodini;
(3) Ngemuva kokuthi ukunyuswa komhlaba kanye nokuhlanganisa ingxenye yefekthri kagesi sekuqediwe, i-PCB kufanele ikhishwe i-vacuum ukuze yenze ingcindezi engalungile emshinini wokuhlola ukuze iqedele:
(4) Vimbela ukunamathisela kwe-solder okungaphezulu ukuthi kungagelezi embobeni, kubangele ukusoda okungamanga futhi kuthinte nokubekwa;
(5) Vimbela amabhola kathayela ukuthi angaphumi ngesikhathi sokusongezwa kwamagagasi, okubangela amasekhethi amafushane.
Ukugcwaliseka kwenqubo yokuxhuma imbobo ye-conductive
Kumabhodi okukhweza angaphezulu, ikakhulukazi ukukhwezwa kwe-BGA ne-IC, ipulaki yembobo kufanele ibe isicaba, ibe yi-convex futhi ibe yi-concave futhi ihlanganise noma isuse u-1mil, futhi akumele kube nethayela elibomvu onqenqemeni lwembobo; i-via hole ifihla ibhola likathayela, ukuze kufinyelelwe amakhasimende Ngokwezidingo, inqubo yokuxhuma nge-hole ingachazwa njengehlukahlukene, inqubo yinde ikakhulukazi, inqubo inzima ukuyilawula, futhi uwoyela uvame ukwehla ngesikhathi izinga lokushisa lomoya oshisayo kanye nokuhlolwa kokumelana ne-solder kawoyela oluhlaza; izinkinga ezifana nokuqhuma kwamafutha ngemva kokwelapha. Ngokwezimo zangempela zokukhiqiza, izinqubo ezihlukahlukene zokuxhuma ze-PCB ziyafingqwa, futhi ezinye iziqhathaniso nezincazelo zenziwa kule nqubo kanye nezinzuzo kanye nokubi:
Qaphela: Umgomo wokusebenza wokulinganisa komoya oshisayo ukusebenzisa umoya oshisayo ukuze ususe i-solder eyeqile phezulu kanye nezimbobo zebhodi lesifunda eliphrintiwe. I-solder esele ihlanganiswe ngokulinganayo kuma-pads, imigqa ye-solder engavimbeli kanye namaphuzu okupakisha angaphezulu, okuyindlela yokwelapha engaphezulu yebhodi lesifunda eliphrintiwe.
1. Inqubo yokuxhuma ngemva kokulinganisa komoya oshisayo
Ukugeleza kwenqubo yilokhu: imaski ye-solder yebhodi→HAL→umgodi wepulaki→ukwelapha. Inqubo yokungaxhumi yamukelwa ukukhiqizwa. Ngemuva kokuthi umoya oshisayo ulinganisiwe, isikrini seshidi le-aluminium noma isikrini sokuvimba uyinki sisetshenziselwa ukuqedela ukuxhuma ngembobo okudingeka ikhasimende kuzo zonke izinqaba. Uyinki wokuxhuma ungaba uyinki we-photosensitive noma uyinki we-thermosetting. Ngaphansi kwesimo sokuthi umbala wefilimu emanzi uhambisana, i-inki yokuxhuma ingcono kakhulu ukusebenzisa inki efanayo nebhodi lebhodi. Le nqubo ingaqinisekisa ukuthi izimbobo ezidlulayo ngeke zilahlekelwe uwoyela ngemva kokuba umoya oshisayo ulinganisiwe, kodwa kulula ukubangela ukuthi uyinki wembobo yepulaki ungcolise ingaphezulu lebhodi futhi ungalingani. Amakhasimende athambekele ekuthengiseni okungamanga (ikakhulukazi ku-BGA) ngesikhathi sokunyuswa. Ngakho amakhasimende amaningi awayamukeli le ndlela.
2. Ukulinganisa komoya oshisayo kanye nobuchwepheshe bomgodi wokuxhuma
2.1 Sebenzisa ishidi le-aluminium ukuze uxhume imbobo, uqinise, futhi upholishe ibhodi ukuze udlulise isithombe
Le nqubo isebenzisa umshini wokumba olawula izinombolo ukuze kukhishwe ishidi le-aluminium elidinga ukuxhunywa ukuze kwenziwe isikrini, futhi ixhume imbobo ukuze kuqinisekiswe ukuthi imbobo ye-via igcwele. Uyinki wembobo yepulaki ungasetshenziswa noyinki we-thermosetting, futhi izici zawo kufanele zibe namandla. , Ukuncipha kwe-resin kuncane, futhi amandla okubopha ngodonga lwembobo kuhle. Ukugeleza kwenqubo ithi: ukwelashwa kwangaphambili → imbobo yokuxhuma → ipuleti lokugaya → ukudluliswa kwephethini → i-etching → imaski ye-solder
Le ndlela ingaqinisekisa ukuthi imbobo yepulaki ye-via hole iyisicaba, futhi ngeke kube nezinkinga zekhwalithi njengokuqhuma kukawoyela kanye nokwehla kwamafutha onqenqemeni lwembobo lapho ilingana nomoya oshisayo. Kodwa-ke, le nqubo idinga ukujiya kwethusi okwesikhathi esisodwa ukuze ugqinsi lwethusi lodonga lwembobo luhlangabezane nezinga lekhasimende. Ngakho-ke, izidingo ze-copper plating kulo lonke ipuleti ziphakeme kakhulu, futhi ukusebenza komshini wokugaya ipuleti nakho kuphakeme kakhulu, ukuqinisekisa ukuthi i-resin ebusweni bethusi isuswe ngokuphelele, futhi indawo yethusi ihlanzekile futhi ayingcolisiwe. . Amafekthri amaningi e-PCB awanayo inqubo yethusi ejiya ngesikhathi esisodwa, futhi ukusebenza kwemishini akuhlangabezani nezidingo, okuholela ekusetshenzisweni okuningi kwale nqubo kumafekthri e-PCB.
1. Inqubo yokuxhuma ngemva kokulinganisa komoya oshisayo
Ukugeleza kwenqubo yilokhu: imaski ye-solder yebhodi→HAL→umgodi wepulaki→ukwelapha. Inqubo yokungaxhumi yamukelwa ukukhiqizwa. Ngemuva kokuthi umoya oshisayo ulinganisiwe, isikrini seshidi le-aluminium noma isikrini sokuvimba uyinki sisetshenziselwa ukuqedela ukuxhuma ngembobo okudingeka ikhasimende kuzo zonke izinqaba. Uyinki wokuxhuma ungaba uyinki we-photosensitive noma uyinki we-thermosetting. Ngaphansi kwesimo sokuthi umbala wefilimu emanzi uhambisana, i-inki yokuxhuma ingcono kakhulu ukusebenzisa inki efanayo nebhodi lebhodi. Le nqubo ingaqinisekisa ukuthi izimbobo ezidlulayo ngeke zilahlekelwe uwoyela ngemva kokuba umoya oshisayo ulinganisiwe, kodwa kulula ukubangela ukuthi uyinki wembobo yepulaki ungcolise ingaphezulu lebhodi futhi ungalingani. Amakhasimende athambekele ekuthengiseni okungamanga (ikakhulukazi ku-BGA) ngesikhathi sokunyuswa. Ngakho amakhasimende amaningi awayamukeli le ndlela.
2. Ukulinganisa komoya oshisayo kanye nobuchwepheshe bomgodi wokuxhuma
2.1 Sebenzisa ishidi le-aluminium ukuze uxhume imbobo, uqinise, futhi upholishe ibhodi ukuze udlulise isithombe
Le nqubo isebenzisa umshini wokumba olawula izinombolo ukuze kukhishwe ishidi le-aluminium elidinga ukuxhunywa ukuze kwenziwe isikrini, futhi ixhume imbobo ukuze kuqinisekiswe ukuthi imbobo ye-via igcwele. Uyinki wembobo yepulaki ungasetshenziswa noyinki we-thermosetting, futhi izici zayo kufanele zibe namandla., Ukushwabana kwe-resin kuncane, futhi amandla okubopha ngodonga lwembobo mahle. Ukugeleza kwenqubo ithi: ukwelashwa kwangaphambili → imbobo yokuxhuma → ipuleti lokugaya → ukudluliswa kwephethini → i-etching → imaski ye-solder
Le ndlela ingaqinisekisa ukuthi imbobo yepulaki ye-via hole iyisicaba, futhi ngeke kube nezinkinga zekhwalithi njengokuqhuma kukawoyela kanye nokwehla kwamafutha onqenqemeni lwembobo lapho ilingana nomoya oshisayo. Kodwa-ke, le nqubo idinga ukujiya kwethusi okwesikhathi esisodwa ukuze ugqinsi lwethusi lodonga lwembobo luhlangabezane nezinga lekhasimende. Ngakho-ke, izidingo ze-copper plating kulo lonke ipuleti ziphakeme kakhulu, futhi ukusebenza komshini wokugaya ipuleti nakho kuphakeme kakhulu, ukuqinisekisa ukuthi i-resin ebusweni bethusi isuswe ngokuphelele, futhi indawo yethusi ihlanzekile futhi ayingcolisiwe. . Amafekthri amaningi e-PCB awanayo inqubo yethusi ejiya ngesikhathi esisodwa, futhi ukusebenza kwemishini akuhlangabezani nezidingo, okuholela ekusetshenzisweni okuningi kwale nqubo kumafekthri e-PCB.
2.2 Ngemva kokuxhuma imbobo ngeshidi le-aluminium, phrinta ngokuqondile imaski ye-solder engaphezulu kwebhodi
Le nqubo isebenzisa umshini wokumba we-CNC ukukhipha ishidi le-aluminium elidinga ukuxhunywa ukwenza isikrini, ukulifaka emshinini wokuphrinta wesikrini ukuze uvale imbobo, futhi ulipake imizuzu engaba ngu-30 ngemva kokuqeda ukuxhuma, futhi sebenzisa isikrini se-36T ukuze uhlole ngokuqondile ingaphezulu lebhodi. Ukugeleza kwenqubo yilokhu: i-pretreatment-plug hole-silk screen-pre-baking-exposure-development-curing
Le nqubo ingaqinisekisa ukuthi i-via hole imbozwe kahle ngamafutha, imbobo yepulaki isicaba, nombala wefilimu omanzi uyahambisana. Ngemuva kokuthi umoya oshisayo ubekwe isicaba, ungaqinisekisa ukuthi i-via hole ayifakwanga futhi ubuhlalu bethayela abufihlwa emgodini, kodwa kulula ukubangela uyinki emgodini ngemva kokuphulukisa Amaphedi abangela ukungahambi kahle kwe-solderability; ngemva kokuba umoya oshisayo ulinganisiwe, imiphetho ye-vias bubbling namafutha ayasuswa. Kunzima ukulawula ukukhiqizwa ngale ndlela yenqubo, futhi onjiniyela bezinqubo kumele basebenzise izinqubo ezikhethekile nemingcele ukuqinisekisa ikhwalithi yezimbobo zepulaki.
2.2 Ngemva kokuxhuma imbobo ngeshidi le-aluminium, phrinta ngokuqondile imaski ye-solder engaphezulu kwebhodi
Le nqubo isebenzisa umshini wokumba we-CNC ukukhipha ishidi le-aluminium elidinga ukuxhunywa ukwenza isikrini, ukulifaka emshinini wokuphrinta wesikrini ukuze uvale imbobo, futhi ulipake imizuzu engaba ngu-30 ngemva kokuqeda ukuxhuma, futhi sebenzisa isikrini se-36T ukuze uhlole ngokuqondile ingaphezulu lebhodi. Ukugeleza kwenqubo yilokhu: i-pretreatment-plug hole-silk screen-pre-baking-exposure-development-curing
Le nqubo ingaqinisekisa ukuthi i-via hole imbozwe kahle ngamafutha, imbobo yepulaki isicaba, nombala wefilimu omanzi uyahambisana. Ngemuva kokuthi umoya oshisayo ubekwe isicaba, ungaqinisekisa ukuthi i-via hole ayifakwanga futhi ubuhlalu bukathini abufihlwa emgodini, kodwa kulula ukubangela uyinki emgodini ngemva kokuphulukisa Amaphedi abangela ikhono eliphansi le-solder; ngemva kokuba umoya oshisayo ulinganisiwe, imiphetho ye-vias bubbling namafutha ayasuswa. Kunzima ukulawula ukukhiqizwa ngale ndlela yenqubo, futhi onjiniyela bezinqubo kumele basebenzise izinqubo ezikhethekile nemingcele ukuqinisekisa ikhwalithi yezimbobo zepulaki.