1. Ukulinganisa komoya oshisayo kusetshenziswa phezu kwe-PCB encibilikisiwe ye-tin lead solder kanye nenqubo yokulinganisa komoya ocindezelwe oshisayo (i-flat flat). Ukulenza libe i-oxidation resistant coating kunganikeza ukushisela okuhle. I-solder yomoya oshisayo kanye nethusi zakha inhlanganisela yethusi-sikkim lapho kuhlangana khona indawo, enogqinsi olucishe lube ngu-1 kuya ku-2mil.
2. I-Organic Solderability Preservative (OSP) ngokukhulisa ngamakhemikhali i-organic coating phezu kwethusi elingenalutho elihlanzekile. Le filimu ye-PCB ye-multilayer inamandla okumelana ne-oxidation, ukushaqeka kokushisa, kanye nomswakama ukuvikela indawo yethusi ekugqwaleni (i-oxidation noma i-sulfurization, njll.) ngaphansi kwezimo ezijwayelekile. Ngesikhathi esifanayo, ekushiseni kwe-welding okulandelayo, i-welding flux isuswa kalula ngokushesha.

3. Indawo yethusi enamakhemikhali e-Ni-au enezinto zikagesi eziwugqinsi, ezinhle ze-ni-au ingxubevange ukuvikela ibhodi le-PCB lezendlalelo eziningi. Isikhathi eside, ngokungafani ne-OSP, esetshenziswa kuphela njengesendlalelo esingagqwali, ingasetshenziselwa ukusetshenziswa isikhathi eside kwe-PCB futhi ithole amandla amahle. Ngaphezu kwalokho, inokubekezelela imvelo ukuthi ezinye izinqubo zokwelashwa ezingaphezulu azikho.

4. I-electroless silver deposition phakathi kwe-OSP ne-electroless nickel/gold plating, inqubo ye-PCB ye-multilayer ilula futhi iyashesha.

Ukuchayeka endaweni eshisayo, enomswakama kanye nengcolile kusahlinzeka ngokusebenza okuhle kukagesi nokushisela okuhle, kodwa kubi. Ngenxa yokuthi ayikho i-nickel ngaphansi kongqimba lwesiliva, isiliva elivuzayo alinawo wonke amandla angokomzimba e-electroless nickel plating/ukucwiliswa kwegolide.

5.I-conductor ebusweni be-PCB multilayer board ifakwe ngegolide le-nickel, okokuqala ngongqimba lwe-nickel bese kuba ungqimba lwegolide. Inhloso eyinhloko ye-nickel plating ukuvimbela ukusabalala phakathi kwegolide nethusi. Kunezinhlobo ezimbili zegolide elifakwe nge-nickel: igolide elithambile (igolide elihlanzekile, okusho ukuthi alibukeki ligqamile) negolide eliqinile (elibushelelezi, eliqinile, elingagugi, i-cobalt nezinye izakhi ezibukeka zikhanya). Igolide elithambile lisetshenziselwa ikakhulukazi umugqa wegolide wokupakisha ama-chip; Igolide eliqinile lisetshenziswa kakhulu ekuxhumaniseni ugesi ongashiselwe.

6. Ubuchwepheshe bokwelapha obuxubile be-PCB bukhetha izindlela ezimbili noma ngaphezulu zokwelashwa kwendawo, izindlela ezivamile yilezi: i-nickel gold anti-oxidation, i-nickel plating yegolide yemvula ye-nickel igolide, i-nickel plateing yegolide yokulinganisa umoya oshisayo, i-nickel esindayo kanye nokulingana komoya oshisayo wegolide. Nakuba ukuguqulwa kwenqubo yokwelashwa kwe-PCB ye-multilayer surface kungabalulekile futhi kubonakala kukude, kufanele kuqashelwe ukuthi isikhathi eside sokushintsha kancane kuzoholela ekushintsheni okukhulu. Ngokukhula kwesidingo sokuvikelwa kwemvelo, ubuchwepheshe bokwelashwa okungaphezulu kwe-PCB kufanele bushintshe kakhulu esikhathini esizayo.