Ukuqalisa
Imboni yebhodi le-ceramic circuity board iqhubeka nesigaba esiguqukayo, esiqhutshwa ngentuthuko kumasu wokukhiqiza kanye nezinto ezibonakalayo ezintsha. Njengoba isidingo se-elekthronikhi yokusebenza kahle kwe-elekthronikhi sikhula, amabhodi wesifunda se-ceramic aqhamuke njengengxenye ebucayi ekusetshenzisweni kwezicelo ezivela ekuxhumaneni kwe-5G ezimotweni zikagesi. Lo mbhalo uhlola izindlela zakamuva zezobuchwepheshe, izitayela zemakethe namathemba esikhathi esizayo emkhakheni webhodi le-ceramic.
1. Intuthuko yezobuchwepheshe ekukhiqizweni kwebhodi le-Ceramic Circuit board
1.1 Amabhodi Ezezimali Aphezulu E-Multilayer Ceramic Ceramic
UHefeng Shengda Electronics usanda kuthola i-Novel indlela yokukhiqiza amabhodi wesifunda aphezulu we-multilayer ceramic ceramic. Le ndlela isebenzisa inhlanganisela yokuphonsa kweteyiphu, ukuphrinta kwesikrini esiminyene, kanye ne-laser micro-etching ukufezekisa ububanzi bomugqa nezindawo zokuphumula zikuhle njenge-20-50μm. Inqubo inciphisa kakhulu izindleko zokukhiqiza ngenkathi ithuthukisa ukusebenza kahle, ikwenza ilungele imvamisa ephezulu kanye nezinhlelo zokusebenza zejubane eliphezulu1.
1.2 Ubuchwepheshe bokumba okuqhubekayo
Ubuchwepheshe be-Hangzhou Huaici bethule idivaysi yokumba okuqhubekayo kwamabhodi wesifunda se-ceramic, athuthukisa ukusebenza kahle kokukhiqiza nokusebenza okusebenzayo. Idivayisi isebenzisa uhlelo lwe-hydraulic kanye namabhande okuhambisa ukuze aguqule inqubo yokumba, aqinisekise ukunemba nokunciphisa ukungenelela kwencwajana. Lokhu okusha kulindeleke ukuthi kuhambisane nokukhiqizwa kwamabhodi wesifunda se-ceramic, ikakhulukazi umkhiqizo wevolumu ephezulu.
1.3 Amasu wokusika athuthukile
Izindlela zendabuko zokusika zendabuko zamabhodi wesifunda se-Ceramic ahambisana nokusika kwamanzi, okunikeza izinzuzo eziningana. Ukusika kwamanzi kuyinqubo yokusika ebandayo esusa ukucindezelwa okushisayo futhi kukhiqize imiphetho ehlanzekile ngaphandle kwesidingo sokucubungula kwesibili. Le ndlela isebenza ngokukhethekile ngokusika bobunjwa abayinkimbinkimbi nezinto zokwakha eziyinselele ukusikwa kwe-laser, njenge-metal sheets9 obukhulu.
2. Izinto ezibonakalayo ezintsha: Ukuthuthukisa ukusebenza kanye nokwethenjwa
2.1 Aluminium nitride (ALN) Rumbemic Subrestrates
I-TechCreate Electronics ithuthukise ibhodi yesekethe ye-aluminium nitride ceramic ceramic egxishwe ngama-cores ethusi. Lo mklamo uthuthuka kakhulu ukuvumelanisa okushisayo, okwenza kube lulungele izinhlelo zokusebenza ezinamandla amakhulu. Ama-cores ashumekiwe ashumeki akhulisa ukuhlukaniswa kokushisa, anciphise ubungozi bokuwohloka kokusebenza kanye nokwelula isikhathi sokuphila kwamadivayisi we-elekthronikhi5.
2.2 Amb ne-DPC Technologies
I-Active Metal Brazing (AMB) kanye ne-Technologies ye-Ceramic (DPC) eqondile yenguquko ekhiqizwayo yeBhodi ye-Ceramic Circuit Board. I-AMB inikeza amandla aphezulu wensimbi kanye nokusebenza ngokuhamba ngebhayisikile, kuyilapho i-DPC inika ukunemba okuphezulu ekunwebayo. Lezi zithuthuka zishayela ukwamukelwa kwamabhodi wesifunda se-ceramic ezisetshenziselwa izicelo ezifana nama-elekthronikhi wezimoto kanye ne-aerospace9.
3. Izitayela Zemakethe kanye Nezicelo
3.1 Ukukhula Okufunwa Kwezimboni Eziphezulu Zobuchwepheshe
Imakethe ye-Ceramic Circuity Board ibhekana nokukhula okusheshayo, idonswa ukunwetshwa kwamanethiwekhi we-5G, izimoto zikagesi, nezinhlelo zamandla avuselelekayo. Emkhakheni wezimoto, ama-reamalic substrates abalulekile kumamojula we-semiconductor ezimotweni zikagesi, lapho aqinisekisa ukuphathwa kokushisa okusebenzayo kanye nokwethenjwa ngaphansi kwezimo eziphakeme ze-voltage7.
3.2 Dynamics Yezimakethe Zesifunda
I-Asia, ikakhulukazi iChina, sekuyilungiselelo lomhlaba wonke lokukhiqizwa kwebhodi le-Ceramic Circuit Board. Izinzuzo zesifunda ezindlekweni zabasebenzi, ukwesekwa kwenqubomgomo, kanye nokuqunjelwa kwezimboni kukhange imali ebalulekile. Abakhiqizi abaholayo abanjengeShenzhen Jinruixin kanye ne-Techcreate Electronics bayikushayela okusha futhi bathwebula isabelo esikhulayo se-Global Market610.
4. Amathemba wesikhathi esizayo nezinselelo
Ukuhlanganiswa kwe-AI ne-IOT
Ukuhlanganiswa kwamabhodi wesifunda se-ceramic nge-AI ne-IOT Technologies kulungele ukuvula amathuba amasha. Isibonelo, amasistimu wokuphathwa kwe-Thermal aqhutshwa yi-AI angaguqula ngamandla amasu okupholisa asuselwa kwidatha yesikhathi sangempela, athuthukise ukusebenza kanye nokusebenza kwamandla kwamadivayisi we-elekthronikhi5.
4.2 Ukusimama kanye nokucatshangelwa kwemvelo
Njengoba imboni ikhula, kuba nengcindezi eyandayo yokuthola imikhuba yokukhiqiza esimeme. Ukusungulwa okufana nokusika kwamanzi kanye nokusetshenziswa kwezinto ezinobungane be-eco-friendly kuyizinyathelo endaweni efanele. Kodwa-ke, kudingeka ucwaningo olwengeziwe ukunciphisa umthelela wezemvelo we-Ceramic Circuit board board9.
Ukugcina
Umkhakha we-Ceramic Circuity Board usemntwini wobuchwepheshe obusha, ngentuthuko kumasu wokukhiqiza kanye nezinto zokwakha ezishayela ukukhula kwazo. Ukusuka kumabhodi aphezulu we-multilayer anengqondo kuya kuzinhlelo zokuphathwa kwe-Thermal ezihlanganisiwe ze-AI ezihlanganisiwe, lokhu kwenziwa kabusha kwezwe le-elekthronikhi. Njengoba isidingo sokusebenza okuphezulu kanye nezinto ezithembekile ze-elekthronikhi ziqhubeka zikhuphuka, amabhodi wesifunda se-ceramic azodlala indima ebaluleke kakhulu ekusebenziseni ubuchwepheshe bakusasa.
