Abadlali abakhulu emakethe yebhodi lesifunda ephrintiwe yiTTM Technologies, Nippon Mektron Ltd., Samsung Electro-Mechanics, Unimicron Technology Corporation, Advanced Circuits, Tripod Technology Corporation, DAEDUCK ELECTRONICS Co.Ltd., Flex Ltd., Eltek Ltd, kanye neSumitomo Electric Industries. .
Umhlaba jikeleleibhodi lesifunda eliphrintiweImakethe kulindeleke ukuthi ikhule isuka ku-$54.30 billion ngo-2021 iye ku-$58.87 billion ngo-2022 ngenani lokukhula elihlanganisiwe lonyaka (CAGR) lika-8.4%. Ukukhula kungenxa yokuthi izinkampani ziqale kabusha ukusebenza kwazo futhi zizijwayelanisa nokujwayelekile okusha ngenkathi zilulama emthelela we-COVID-19, obekuholele ezindleleni zokuthibela ezibandakanya ukuqhelelana komphakathi, ukusebenza kude, nokuvalwa kwemisebenzi yezohwebo okuholele ekutheni. izinselele zokusebenza. Imakethe kulindeleke ukuthi ifinyelele ku- $71.58 billion ngo-2026 ku-CAGR ka-5%.
Imakethe yebhodi lesifunda ephrintiwe iqukethe ukuthengiswa kwamabhodi esekethe aphrintiwe yizinhlangano (izinhlangano, abadayisi bodwa, kanye nobambiswano) asetshenziselwa ukuxhuma izingxenye zikagesi nezikagesi ngaphandle kokusebenzisa izintambo. Amabhodi esekethe aphrintiwe amabhodi kagesi, asiza izintambo ezibekwe phezulu nezinezisekelo eziqukethwe ngaphakathi kwesakhiwo semishini kuma-electronics amaningi.
Umsebenzi wabo oyinhloko uwukusekela ngokomzimba nokunamathisela izinto zikagesi ngogesi ngokuphrinta izindlela eziqhutshwayo, amathrekhi, noma ukulandelelwa kwesignali kumashidi ethusi anamathiselwe ku-substrate engasebenzisi.
Izinhlobo eziyinhloko zamabhodi wesifunda eziphrintiwe ziyiohlangothini olulodwa, emaceleni amabili,enezendlalelo eziningi, high-density interconnect (HDI) nokunye. Ama-PCB anohlangothi olulodwa akhiwe ngesendlalelo esisodwa sezinto eziyisisekelo lapho ithusi eliqhutshwayo kanye nezingxenye zifakwe ngakolunye uhlangothi lwebhodi futhi i-wiring conductive ixhunywe ngakolunye uhlangothi.
Ama-substrates ahlukene ahlanganisa okuqinile, okuguquguqukayo, okuguquguqukayo okuguquguqukayo futhi ahlanganisa izinhlobo ezihlukahlukene ze-laminate njengephepha, i-FR-4, i-polyimide, nezinye. Amabhodi esekethe aphrintiwe asetshenziswa yizimboni ezahlukahlukene ezisetshenziswa ekugcineni ezifana ne-elekthronikhi yezimboni, ukunakekelwa kwezempilo, i-aerospace nokuzivikela, izimoto, i-IT kanye ne-telecom, i-electronics yabathengi, nezinye.
I-Asia Pacific ibiyisifunda esikhulu kunazo zonke emakethe yebhodi lesifunda ephrintiwe ngo-2021.I-Asia Pacific kulindeleke ukuthi ibe yisifunda esikhula ngokushesha ngesikhathi sokubikezela.
Izifunda ezimbozwe kulo mbiko yi-Asia-Pacific, Western Europe, Eastern Europe, North America, South America, Middle East kanye ne-Afrika.
Ukuthengiswa kwezimoto zikagesi okwandayo kulindeleke ukuthi kukhuthaze ukukhula kwemakethe yebhodi lesifunda ephrintiwe esikhathini sokubikezela. Izimoto zikagesi (EVs) yilezo ezinikwa amandla kagesi ngokuphelele noma ingxenye.
Amabhodi esekethe aphrintiwe (ama-PCB) asetshenziselwa ukuxhuma izingxenye zikagesi ezimotweni zikagesi, njengezinhlelo ezilula zomsindo nezibonisi. Ama-PCB aphinde asetshenziswe ekukhiqizeni iziteshi zokushaja, ezivumela abasebenzisi bezimoto zikagesi ukuthi bashaje izimoto zabo.a
Isibonelo, ngokusho kwe-Bloomberg New Energy Finance (BNEF), inkampani ezinze e-UK ehlinzeka ngokuhlaziywa, izibalo, kanye nezindaba mayelana noguquko lomkhakha wezamandla, ama-EVs kubikezelwa ukuthi azoba ngu-10% wokudayiswa kwezimoto zabagibeli emhlabeni wonke ngo-2025, ezikhulela kuye. Ama-28% ngo-2030 kanye nama-58% ngo-2040
Ukusetshenziswa kwezinto ezingabolikala kumabhodi esekethe aphrintiwe (ama-PCB) kubumba imakethe yebhodi lesifunda ephrintiwe. Abakhiqizi bagxile ekwehliseni imfucuza ye-elekthronikhi ngokushintshanisa ama-substrates ajwayelekile ngezinye izindlela ezivumelana nemvelo, okungasiza ekwehliseni umthelela ophelele womkhakha wezobunjiniyela bemvelo ngenkathi futhi behlisa izindleko zokuhlanganisa nezokukhiqiza.