Ukulwa nokuphazanyiswa kuyisixhumanisi esibaluleke kakhulu ekwakhiweni kwesifunda sanamuhla, okubonisa ngqo ukusebenza nokwethenjwa kwalo lonke uhlelo. Ngonjiniyela be-PCB, umklamo wokulwa nokuphazanyiswa uyisihluthulelo kanye nephuzu elinzima lokuthi wonke umuntu kufanele aze kahle.
Ukuba khona kokuphazanyiswa ebhodini le-PCB
Ngokucwaninga kwangempela, kutholakala ukuthi kunokuphazamiseka okunezinkulu e-PCB Design: Umsindo Wokunikezela Amandla, Ukuphazanyiswa Komugqa wokuhambisa, ukuhlangana nokuphazanyiswa kwe-electromagnetic (EMI).
1. Umsindo wokuphakela amandla
Esisekelweni semvamisa ephezulu, umsindo wokuphakelwa kwamandla unethonya elisobala elisobala esignalini esivame kakhulu. Ngakho-ke, imfuneko yokuqala yokuhlinzekwa kwamandla umsindo ophansi. Lapha, umhlaba ohlanzekile ubaluleke njengomthombo wamandla ohlanzekile.
2. Umugqa wokuhambisa
Kunezinhlobo ezimbili kuphela zemigqa yokuhambisa okungenzeka kwi-PCB: Umugqa we-Strip nomugqa we-microwave. Inkinga enkulu ngemigqa yokuhambisa iyisibonakaliso. Ukucabanga kuzodala izinkinga eziningi. Isibonelo, isiginali yomthwalo izoba yinto enhle yesiginali yokuqala kanye nesiginali ye-echo, ezothuthukisa ubunzima bokuhlaziywa kwesiginali; Ukuzindla kuzodala ukulahlekelwa ukubuya (ukulahlekelwa kabusha), okuzothinta isiginali. Umthelela ubaluleke kakhulu njengalokho okubangelwa ukuphazamiseka komsindo okungeziwe.
3. Ukuhlangana
Isiginali yokuphazanyiswa eyenziwe ngumthombo wokuphazanyiswa ibangela ukuphazanyiswa kwe-electromagnetic ohlelweni lokulawula ngogesi ngesiteshi esithile sokuhlanganisa. Indlela yokuhlangana yokuphazanyiswa ayilutho nje ukwedlula uhlelo lokulawula ngogesi ngokusebenzisa izintambo, izikhala, imigqa ejwayelekile, ukuhlangana okujwayelekile, ukuhlangana kwe-capacial, ukuhlanganisa i-electromagnetic, ukuhlangana kwe-electroint, njll.
4. Ukuphazanyiswa kwe-Electromagnetic (EMI)
Ukuphazanyiswa kwe-electromagnetic EMI kunezinhlobo ezimbili: kwenziwa ukuphazamiseka nokuphazanyiswa okubanzi. Ukuphazamiseka kubhekisele ekuhlanganiseni (ukuphazamiseka) kwamasiginali kunethiwekhi eyodwa kagesi kwenye inethiwekhi kagesi ngokusebenzisa i-medium ephathekayo. Ukuphazanyiswa okubanzi kubhekisa ekuhlanganiseni komthombo wokuphazanyiswa (Ukuphazanyiswa) Isiginali yayo kwenye inethiwekhi kagesi ngokusebenzisa isikhala. Kwi-PCB enesivinini esikhulu, imigqa yesiginali ye-high-frequency, izikhonkwane ezihlanganisiwe, izixhumi ezahlukahlukene, njll. Zingaba yimithombo yokuphazamiseka kwemisebe enezimpawu ze-antenna, ezingathinta ezinye izinhlelo noma ezinye izinto ezihle ohlelweni. umsebenzi ojwayelekile.
I-PCB kanye nezindlela zokulwa nokuphazanyiswa
Umklamo we-anti-jamming webhodi yesekethe ephrintiwe uhlobene eduze nesifunda esithile. Okulandelayo, sizokwenza izincazelo ezithile kuphela ngezindlela ezimbalwa ezivamile ze-PCB anti-jamming design.
1. Design Cord Design
Ngokwamazwe webhodi yesekethe ephrintiwe yamanje, zama ukwandisa ububanzi bomugqa wamandla ukuze unciphise ukumelana kwe-loop. Ngasikhathi sinye, yenza ukuqondiswa komugqa wamandla nomugqa womhlabathi uhambisana nokuqondisa kokudluliswa kwedatha, okusiza ukuthuthukisa amandla okulwa nomsindo.
2. I-Ground Wire Design
Hlukanisa umhlabathi wedijithali kusuka emhlabathini we-analog. Uma kunemibuthano ye-logic kanye nemibuthano eqondile ebhodini lesekethe, kufanele ihlukaniswe ngangokunokwenzeka. Umjikelezo we-litter-frequency frequency kufanele asuswe ngokufana ngephuzu elilodwa ngangokunokwenzeka. Lapho i-wiring yangempela inzima, ingaxhumeka ngokwengxenye ngochungechunge bese isekele ukufana. Isifunda esivame kakhulu kufanele sifakwe kumaphoyinti amaningi ochungechungeni, ucingo lomhlabathi kufanele lube mfushane futhi lube mfushane, futhi i-foil ephakeme ye-grid-efana negridi enjenge-grid-afana ne-foil enkulu yegridi kufanele isetshenziswe ezungeze isakhi esijwayelekile.
Intambo yomhlabathi kufanele ibe yinqwaba ngangokunokwenzeka. Uma umugqa omncane omnene usetshenziselwa i-wire enesisekelo, izinguquko ezingaba khona ezihlabayo ngesamanje, enciphisa ukumelana nomsindo. Ngakho-ke, ucingo lomhlabathi kufanele lube lugqinsi ukuze ludlule amahlandla amathathu avumelekile ebhodini eliphrintiwe. Uma kungenzeka, ucingo lomhlabathi kufanele lube ngaphezulu kwe-2 ~ 3mm.
I-Ground Wire yakha i-loop evaliwe. Amabhodi aphrintiwe ahlanganiswe kuphela amasekethe edijithali kuphela, iningi lemifundazo yalo enesisekelo ihlelwe kuma-loops ukwenza ngcono ukumelana nomsindo.
3. Ukuqunjelwa kwe-capacitor capacitor
Enye yezindlela ezijwayelekile zokwakhiwa kwe-PCB ukumisa ama-capacitors afanelekile engxenyeni ngayinye ebalulekile yebhodi ephrintiwe.
Izimiso zokucushwa okujwayelekile zama-capacitors ahlaziye yilezi:
① Xhuma i-CapacItor eyi-10 ~ ye-100Uf electrolytic ye-100. Uma kungenzeka, kungcono ukuxhuma ku-100UF noma ngaphezulu.
Isimiso se-②In, i-chip ngayinye ehlanganisiwe yokujikeleza kufanele ifakwe nge-0.01pf Ceramic Capacitor. Uma igebe lebhodi ephrintiwe alanele, i-capacitor eyi-1-10pf ingahlelwa ngawo wonke ama-4 ~ 8 ama-chip.
③formays Amadivayisi anekhono elinobuthakathaka lokulwa nomsindo kanye nezinguquko ezinkulu zamandla lapho zivaliwe, njengezinkomo namadivayisi okugcina ama-ROM, i-capacitor ye-RAM, i-cocacitor kufanele ixhumeke ngqo phakathi komugqa wamandla nomugqa womhlaba we-chip.
④Ukuhola kweCapacitor akufanele kube yinde kakhulu, ikakhulukazi i-capacitor ephezulu ye-suppass akufanele ibe nokuhola.
4. Izindlela zokuqeda ukuphazamiseka kwe-electromagnetic ku-PCB Design
Ama-loops angenayo: I-loop ngayinye ilingana ne-antenna, ngakho-ke sidinga ukunciphisa inani lama-loops, indawo ye-loop kanye nomphumela we-antenna we-loop. Qinisekisa ukuthi isiginali inendlela eyodwa kuphela ye-loop kunoma yimaphi amaphuzu amabili, gwema izihibe zokufakelwa, bese uzama ukusebenzisa ungqimba lwamandla.
Ukuqedwa: Ukuhlunga kungasetshenziselwa ukunciphisa i-EMI yomugqa wamandla nakulayini wesiginali. Kunezindlela ezintathu: ama-capacitors wokukhohlisa, izihlungi ze-EMI, nezingxenye ze-Magnetic.
③Shield.
④ Zama ukunciphisa ijubane lamadivayisi afudumele kakhulu.
⑤ Ukukhuphula i-dielectric njalo yebhodi le-PCB kungavimbela izingxenye zemvamisa ephezulu njengokuhambisa umugqa wokuhambisa eduze nebhodi kusuka ku-radiating ngaphandle; Ukwandisa ubukhulu bebhodi le-PCB futhi unciphise ubukhulu bomugqa we-microstrip kungavimbela ucingo lwe-electromagnetic kusuka ekuchitheni futhi kuvikele nemisebe.