Inqubo yokugcwaliseka kobuchwepheshe yebhodi lokukopisha le-PCB iwukuskena ibhodi lesifunda ukuze likopishwe, ukurekhoda indawo enemininingwane yendawo, bese ususa izingxenye zokwenza incwadi yezinto zokwakha (BOM) futhi uhlele ukuthengwa kwezinto ezibonakalayo, ibhodi elingenalutho Isithombe esiskeniwe kusetshenzwe isofthiwe yebhodi lokukopisha futhi ibuyiselwe kufayela lomdwebo webhodi le-pcb, bese ifayela le-PCB lithunyelwa embonini yokwenza amapuleti ukwenza ibhodi. Ngemuva kokuthi ibhodi lenziwe, izingxenye ezithengiwe zidayiswa ebhodini le-PCB elenziwe, bese ibhodi lesifunda lihlolwa Futhi lilungiswa.
Izinyathelo ezithile zebhodi lokukopisha le-PCB:
Isinyathelo sokuqala ukuthola i-PCB. Okokuqala, rekhoda imodeli, imingcele, kanye nezindawo zazo zonke izingxenye ezibalulekile ephepheni, ikakhulukazi isiqondiso se-diode, ishubhu lemfundo ephakeme, kanye nesiqondiso segebe le-IC. Kungcono ukusebenzisa ikhamera yedijithali ukuthatha izithombe ezimbili zendawo yezingxenye ezibalulekile. Amabhodi wesifunda we-pcb wamanje aya ngokuya ethuthuke kakhulu. Amanye ama-transistors e-diode awabonwa nhlobo.
Isinyathelo sesibili ukukhipha wonke amabhodi anezingqimba eziningi bese ukopisha amabhodi, futhi ukhiphe ithini emgodini we-PAD. Hlanza i-PCB ngotshwala bese uyifaka kusithwebuli. Lapho iskena siskena, udinga ukuphakamisa amaphikseli askeniwe kancane ukuze uthole isithombe esicacile. Bese ufaka isihlabathi kancane izendlalelo ezingaphezulu nezingaphansi ngephepha le-gauze lamanzi kuze kube yilapho ifilimu yethusi icwebezela, uyifake kusithwebuli, qala i-PHOTOSHOP, bese uskena izendlalelo ezimbili ngokwehlukana ngombala. Qaphela ukuthi i-PCB kufanele ibekwe ngokuvundlile nangokuqondile kusikena, ngaphandle kwalokho isithombe esiskeniwe ngeke sisetshenziswe.
Isinyathelo sesithathu ukulungisa umehluko nokukhanya kwendwangu ukuze ingxenye enefilimu yethusi kanye nengxenye ngaphandle kwefilimu yethusi ibe nokuphambene okuqinile, bese uphendulela isithombe sesibili sibe mnyama nokumhlophe, bese uhlola ukuthi imigqa icacile yini. Uma kungenjalo, phinda lesi sinyathelo. Uma kucacile, gcina isithombe njengamafayela efomethi ye-BMP emnyama nokumhlophe TOP.BMP kanye ne-BOT.BMP. Uma uthola noma yiziphi izinkinga ngezithombe, ungasebenzisa i-PHOTOSHOP ukuze uzilungise futhi uzilungise.
Isinyathelo sesine ukuguqula amafayela amabili efomethi ye-BMP abe amafayela efomethi ye-PROTEL, nokudlulisa izendlalelo ezimbili ku-PROTEL. Isibonelo, izikhundla ze-PAD ne-VIA ezidlule izendlalelo ezimbili ngokuyisisekelo zihambisana, okubonisa ukuthi izinyathelo zangaphambilini zenziwe kahle. Uma kukhona ukuchezuka, phinda isinyathelo sesithathu. Ngakho-ke, ukukopisha kwe-PCB kuwumsebenzi odinga isineke, ngoba inkinga encane izothinta ikhwalithi kanye nezinga lokufanisa ngemva kokukopisha.
Isinyathelo sesihlanu ukuguqula i-BMP ye-TOP layer ibe yi-TOP.PCB, unake ukuguqulwa kungqimba lwe-SILK, okuwungqimba oluphuzi, bese ungakwazi ukulandelela umugqa ku-TOP layer, bese ubeka idivayisi ngokuvumelana. emdwebeni esinyathelweni sesibili. Susa isendlalelo se-SILK ngemva kokudweba. Qhubeka uphinda kuze kube yilapho zonke izendlalelo zidwetshiwe.
Isinyathelo sesithupha ukungenisa i-TOP.PCB ne-BOT.PCB ku-PROTEL, futhi KULUNGILE ukuzihlanganisa zibe isithombe esisodwa.
Isinyathelo sesikhombisa, sebenzisa iphrinta ye-laser ukuze uphrinte I-TOP LAYER kanye NE-BOTTOM LAYER kufilimu ekhanyelayo (isilinganiso esingu-1:1), beka ifilimu ku-PCB, bese uqhathanisa ukuthi ingabe likhona yini iphutha. Uma ilungile, usuqedile. .
Ibhodi lokukopisha elifana nebhodi lokuqala lazalwa, kodwa lokhu kuyingxenye eyodwa kuphela. Kuyadingeka futhi ukuhlola ukuthi ukusebenza kobuchwepheshe be-elekthronikhi kwebhodi lokukopisha kuyafana yini nebhodi lokuqala. Uma kuyafana, kwenziwa ngempela.
Qaphela: Uma kuyibhodi elinezingqimba eziningi, udinga ukupholisha ngokucophelela isendlalelo sangaphakathi, bese uphinda izinyathelo zokukopisha kusukela kwesesithathu kuya kwesesihlanu. Yebo, ukuqanjwa kwezithombe nakho kuhlukile. Kuya enanini lezendlalelo. Ngokuvamile, ukukopisha okunezinhlangothi ezimbili kudinga Kulula kakhulu kunebhodi elinezingqimba eziningi, futhi ibhodi lokukopisha elinezingqimba eziningi lijwayele ukungahambi kahle, ngakho-ke ibhodi lokukopisha lebhodi elinezingqimba eziningi kufanele licophelele futhi licophelele (lapho i-vias yangaphakathi kanye nebhodi lokukopisha). ama-non-vias avame ukuba nezinkinga).
Indlela yebhodi yokukopisha enezinhlangothi ezimbili:
1. Skena izingqimba ezingenhla nezingezansi zebhodi lesekhethi bese ugcina izithombe ezimbili ze-BMP.
2. Vula isofthiwe yebhodi lokukopisha i-Quickpcb2005, chofoza “Ifayela” “Vula Imephu Eyisisekelo” ukuze uvule isithombe esiskeniwe. Sebenzisa i-PAGEUP ukuze usondeze isithombe esikrinini, ubone iphedi, cindezela u-PP ukuze ubeke iphedi, bona umugqa bese ulandela umugqa we-PT...njengomdwebo wengane, uwudwebe kule softhiwe, chofoza u-“Londoloza” ukuze ukhiqize ifayela le-B2P. .
3. Chofoza “Ifayela” kanye “Nesithombe Esiyisisekelo Esivuliwe” ukuze uvule esinye isendlalelo sesithombe esiskeniwe sombala;
4. Chofoza “Ifayela” kanye “Vula” futhi ukuze uvule ifayela le-B2P elondolozwe ngaphambili. Sibona ibhodi esanda kukopishwa, enqwabelene phezu kwalesi sithombe-ibhodi le-PCB elifanayo, izimbobo zisendaweni efanayo, kodwa ukuxhumana kwezintambo kuhlukile. Ngakho sicindezela "Izinketho"-"Izilungiselelo Zesendlalelo", vala umugqa wezinga eliphezulu nesikrini sikasilika lapha, ushiye kuphela ama-vias anezendlalelo eziningi.
5. Ama-vias asongqimbeni olungaphezulu asesimweni esifanayo nesesithombeni esingezansi. Manje sesingakwazi ukulandelela imigqa esendlalelo esingezansi njengoba senza ebuntwaneni. Chofoza okuthi “Londoloza” futhi-ifayela le-B2P manje selinezigaba ezimbili zolwazi phezulu nangaphansi.
6. Chofoza "Ifayela" kanye "Thekelisa Njengefayela Le-PCB", futhi ungathola ifayela le-PCB elinezendlalelo ezimbili zedatha. Ungashintsha ibhodi noma ukhiphe umdwebo wohlelo noma uwuthumele ngokuqondile efekthri yamapuleti e-PCB ukuze ukhiqize
Indlela yokukopisha yebhodi ye-Multilayer:
Eqinisweni, ibhodi lokukopisha lebhodi elinezingqimba ezine liwukukopisha amabhodi amabili anezinhlangothi ezimbili ngokuphindaphindiwe, futhi ungqimba lwesithupha ukukopisha ngokuphindaphindiwe amabhodi amathathu anezinhlangothi ezimbili... izintambo zangaphakathi. Sizibona kanjani izendlalelo zangaphakathi zebhodi lezendlalelo eziningi ezinembayo? -Stratification.
Ziningi izindlela zokubeka izingqimba, njengokugqwala kwe-potion, ukukhumula amathuluzi, njll., kodwa kulula ukuhlukanisa izendlalelo nokulahlekelwa idatha. Isipiliyoni sisitshela ukuthi ukwenza isihlabathi kunembe kakhulu.
Uma siqeda ukukopisha izendlalelo ezingaphezulu neziphansi ze-PCB, ngokuvamile sisebenzisa i-sandpaper ukupholisha ungqimba olungaphezulu ukuze sibonise ungqimba lwangaphakathi; I-sandpaper iyi-sandpaper evamile ethengiswa ezitolo ze-hardware, ngokuvamile i-PCB eyisicaba, bese ubamba i-sandpaper bese uyihlikihla ngokulinganayo ku-PCB (Uma ibhodi lincane, ungakwazi futhi ukubeka i-sandpaper flat, cindezela i-PCB ngomunwe owodwa bese uhlikihla ku-sandpaper. ). Iphuzu eliyinhloko ukulivula libe isicaba ukuze likwazi ukugaywa ngokulinganayo.
Isikrini sikasilika namafutha aluhlaza ngokuvamile kuyasulwa, futhi ucingo lwethusi nesikhumba sethusi kufanele kwesulwe izikhathi ezimbalwa. Ngokuvamile, ibhodi le-Bluetooth lingasulwa emaminithini ambalwa, futhi i-memory stick izothatha cishe imizuzu eyishumi; Yebo, uma unamandla amaningi, kuzothatha isikhathi esincane; uma unamandla amancane, kuzothatha isikhathi esiningi.
Ibhodi lokugaya okwamanje liyisixazululo esivame ukusetshenziswa kakhulu ekubekeni izingqimba, futhi futhi iyonga kakhulu. Singathola i-PCB elahliwe bese siyizama. Eqinisweni, ukugaya ibhodi akunzima ngokobuchwepheshe. Kuyadina nje. Kuthatha umzamo omncane futhi asikho isidingo sokukhathazeka ngokugaya ibhodi eminwe.
Ukubuyekezwa komphumela womdwebo we-PCB
Ngesikhathi senqubo yesakhiwo se-PCB, ngemva kokuqedwa kwesakhiwo sesistimu, umdwebo we-PCB kufanele ubuyekezwe ukuze kubonakale ukuthi ingabe ukwakheka kwesistimu kunengqondo kanye nokuthi umphumela olungile ungafinyelelwa yini. Ngokuvamile kungaphenywa ngezici ezilandelayo:
1. Ukuthi ukuhlelwa kwesistimu kuqinisekisa izintambo ezifanele noma ezifanele, noma ngabe i-wiring ingenziwa ngendlela enokwethenjelwa, nokuthi ukwethembeka komsebenzi wesekethe kungaqinisekiswa yini. Ekuhleleni, kuyadingeka ukuba nokuqonda okuphelele nokuhlela kwesiqondiso sesignali kanye nenethiwekhi yocingo lwamandla kanye nomhlabathi.
2. Ukuthi usayizi webhodi eliphrintiwe uyahambisana nosayizi womdwebo ocutshungulwayo, noma ngabe ungahlangabezana nezidingo zenqubo yokukhiqiza ye-PCB, kanye nokuthi lukhona yini uphawu lokuziphatha. Leli phuzu lidinga ukunakwa okukhethekile. Isakhiwo sesifunda kanye nezintambo zamabhodi amaningi e-PCB aklanywe kahle kakhulu futhi ngokunengqondo, kodwa ukuma okunembile kwesixhumi sokumisa akunakwa, okuholela ekwakhiweni kwesekethe akukwazi ukudotshwa namanye amasekethe.
3. Ukuthi ingabe izingxenye ziyangqubuzana yini endaweni enezinhlangothi ezimbili nezintathu. Naka usayizi wangempela wedivayisi, ikakhulukazi ubude bedivayisi. Lapho izingxenye ze-welding ngaphandle kwesakhiwo, ukuphakama akufanele kudlule u-3mm.
4. Ukuthi ukwakheka kwezingxenye kuminyene futhi kuhlelekile, kuhlelwe kahle, nokuthi zonke zibekwe obala. Ekuhlelweni kwezingxenye, hhayi kuphela isiqondiso sesignali, uhlobo lwesignali, nezindawo ezidinga ukunakwa noma ukuvikelwa kufanele kucatshangelwe, kodwa ukuminyana okuphelele kwesakhiwo sedivayisi kufanele futhi kucatshangelwe ukuze kuzuzwe ukuminyana okufanayo.
5. Ukuthi izakhi ezidinga ukushintshwa njalo zingashintshwa kalula, kanye nokuthi i-plug-in board ingafakwa kalula yini emishinini. Ukufaneleka nokuthembeka kokushintshwa nokuxhunywa kwezingxenye ezishintshwa njalo kufanele kuqinisekiswe.