Inqubo yokuqonda kwezobuchwepheshe ye-PCB Copy Board imane nje ukuskena ibhodi yokujikeleza okumele ikopishwe, bese ususa izakhi zokwenza imali ye-software yebhodi, bese uhlela ifayela lokudweba le-PCB, bese ifayela le-PCB lithunyelwa efektri ukwenza i-Factory. Ngemuva kokuthi iBhodi lenziwe, izakhi ezithengiwe zithengiselwa ebhodini le-PCB elenziwe, bese iBhodi yesekethe ihlolwe futhi ilungisa iphutha.
Izinyathelo ezithile ze-PCB Copy Board:
Isinyathelo sokuqala ukuthola i-PCB. Okokuqala, qopha imodeli, amapharamitha, nezikhundla zazo zonke izingxenye ezibalulekile ephepheni, ikakhulukazi ukuqondiswa kwe-dide, ishubhu le-Tertiary, kanye nokuqondisa kwegebe le-IC. Kungcono ukusebenzisa ikhamera yedijithali ukuthatha izithombe ezimbili zendawo yezingxenye ezibalulekile. Amabhodi wesifunda we-PCB wamanje aya ngokuya ethuthuka. Ezinye zokudluliswa kwe-diode azibonwa nhlobo.
Isinyathelo sesibili ukususa wonke amabhodi ahlukahlukene ahlukahlukene bese ukopisha amabhodi, bese ususa i-tin emgodini we-pad. Hlanza i-PCB ngotshwala bese uyibeka esikrinini. Lapho isithwebuli siskena, udinga ukukhulisa amaphikseli askena kancane ukuthola isithombe esicacile. Bese kukhanyiswa kancane izingqimba eziphezulu nezingaphansi nge-Water Gauze Phepha Qaphela ukuthi i-PCB kumele ibekwe ngokuvundlile nangokuqondile kusithwebuli, ngaphandle kwalokho isithombe esiskeziwe asikwazi ukusetshenziswa.
Isinyathelo sesithathu ukulungisa umehluko nokukhanya kwe-canvas ukuze ingxenye yefilimu yethusi kanye nengxenye ngaphandle kwefilimu yethusi ibe nomnyama futhi ibe mhlophe, bese ubheka ukuthi imigqa icace yini. Uma kungenjalo, phinda lesi sinyathelo. Uma kucace, gcina isithombe njengefayela elimnyama nelimhlophe le-BMP FOFFECE POP.BMP kanye ne-Bot.bmp. Uma uthola noma yiziphi izinkinga ngehluzo, ungasebenzisa futhi i-Photoshop ukuyilungisa futhi uyilungise.
Isinyathelo sesine ukuguqula amafayela wefomethi amabili we-BMP abe ngamafayela wefomethi yeprotel, bese udlulisa izingqimba ezimbili ku-protel. Isibonelo, izikhundla ze-pad ne-via ezidlulile ezingxenyeni ezimbili zihlangana ngokuyisisekelo, okukhombisa ukuthi izinyathelo zangaphambili zenziwe kahle. Uma uma kunokuphambuka, phinda isinyathelo sesithathu. Ngakho-ke, ukukopisha i-PCB kuwumsebenzi odinga ukubekezela, ngoba inkinga encane izothinta ikhwalithi kanye nezinga lokufana ngemuva kokuqonda.
Isinyathelo sesihlanu ukuguqula i-BMP yesendlalelo esiphezulu ku-Top.PCB, naka ukuguqulwa ku-Silk ungqimba, bese ulandela umugqa ongezansi phezulu, bese ubeka ucingo ngokusho komdwebo esinyathelweni sesibili. Susa ungqimba we-silk ngemuva kokudweba. Qhubeka uphinda kuze kube yilapho zonke izingqimba zidonswa.
Isinyathelo sesithupha ukungenisa i-Top.PCB ne-bot.pcb ku-protel, futhi kulungile ukuwahlanganisa esithombeni esisodwa.
Isinyathelo sesikhombisa, sebenzisa iphrinta ye-laser ukuphrinta ungqimba oluphezulu kanye nongqimba olungaphansi kwifilimu esobala (1: 1 isilinganiso), faka ifilimu kwi-PCB, bese uqhathanisa noma ngabe kukhona yini iphutha. Uma kulungile, wenziwa. .
Ibhodi lokukopisha elifana nebhodi lasekuqaleni lazalwa, kepha lokhu kwenziwa kuphela. Kuyadingeka futhi ukuvivinya ukuthi ngabe ukusebenza kwezobuchwepheshe kwe-elekthronikhi yeBhodi yekhophi kuyafana neBhodi Yangempela. Uma kunjalo, kwenziwa ngempela.
QAPHELA: Uma kuyibhodi elihlukene le-multi, udinga ukuPheka ngokucophelela ungqimba lwangaphakathi, bese uphinda izinyathelo zokukopisha kusuka kwesithathu kuya kwesithathu esinyathelweni sesihlanu. Vele, ukuqanjwa kwemidwebo kuhlukile. Kuya ngenani lezendlalelo. Ngokuvamile, ukukopisha okuhlangene kabili kudinga ukuthi kulula kakhulu kunebhodi elinemigwaqo eminingi, futhi ibhodi lokukhophi elinhlobonhlobo lithambekele ekuziphatheni kabi, ngakho-ke ibhodi lekholi lebhodi le-multi-lias kumele liqaphele kakhulu futhi linakekele (lapho ama-vias angaphakathi futhi angewona ama-vias athambekele ezinkingeni).
Indlela ephethwe kabili yeBhodi yeKhophi:
1. Skena izingqimba ezingenhla nengaphansi zebhodi yesekethe bese ugcine izithombe ezimbili ze-BMP.
2. Vula i-software yebhodi le-copy Sebenzisa ikhasi ukusondeza esikrinini, bheka iPad, cindezela i-PP ukubeka pad, bheka umugqa bese ulandela umugqa we-PT, uchofoze "Gcina" ukukhiqiza ifayela le-B2P.
3. Chofoza u- "FILE" kanye "Nesisekelo Esivulekele Isisekelo" ukuvula elinye ungqimba lwesithombe sombala esiskena;
4. Chofoza u- "FILE" bese "Vula" futhi ukuvula ifayela le-B2P eligciniwe ngaphambili. Sibona ibhodi elisanda kukopishwa, egcinwe ngaphezulu kwalesi sithombe - ibhodi efanayo ye-PCB, izimbobo zisesimweni esifanayo, kepha ukuxhumana okufanayo kuhlukile. Ngakho-ke sicindezela "Izinketho" - "Izilungiselelo Zesendlalelo", cisha umugqa wezinga eliphezulu kanye nesilika lapha, kushiya kuphela i-vias ehlukahlukene.
I-5. I-vias kungqimba ephezulu isesimweni esifanayo ne-vias esithombeni esingezansi. Manje singakwazi ukulandelela imigqa engxenyeni engezansi njengoba senze ebuntwaneni. Chofoza u- "Gcina" futhi-ifayela le-B2P manje linezendlalelo ezimbili zolwazi phezulu nangaphansi.
6. Chofoza u- "FILE" kanye "nokuthekelisa njengefayela le-PCB", futhi ungathola ifayela le-PCB elinezingqimba ezimbili zedatha. Ungashintsha ibhodi noma ukhiphe umdwebo we-schematic noma uyithumele ngqo efektri yepuleti ye-PCB ukuze ukhiqize
Indlela ye-Multilayer Board Copy:
Eqinisweni, iBhodi leBhoko leBhodi le-Laner-Laler Cockod ukukopisha kaninginingi, futhi ungqimba lwesithupha ukukopisha amabhodi amathathu ahlangene ... isizathu esenza ukuthi ibhodi le-multi-ungqimba liyamangala yingoba asikwazi ukubona i-wiring yangaphakathi. Sizibona kanjani izingqimba zangaphakathi zebhodi le-multilayer elinembile? -Izifiso.
Kunezindlela eziningi zokulandela, njengokugqwayiza kwe-poor, ukuhluza kwethuluzi, njll., Kepha kulula ukuhlukanisa izingqimba bese ulahlekelwa yidatha. Isipiliyoni sisitshela ukuthi iSanding iyona enembile kunazo zonke.
Lapho siqeda ukukopisha izingqimba eziphezulu nezingaphansi ze-PCB, sivame ukusebenzisa i-sandpaper ukupenda ungqimba olungaphezulu ukukhombisa ungqimba lwangaphakathi; I-sandpaper i-sandpaper evamile ethengiswa ezitolo ze-Hardware, imvamisa i-PCB eyisicaba, bese ibamba i-sandpaper bese ihlikihla ngokulinganayo kwi-PCB (uma ibhodi lincane, ucindezele i-PCPER, cindezela i-PCB ngomunwe owodwa. Iphuzu eliyinhloko liwukubeka phansi lifulethi ukuze libe yinhlabathi ngokulinganayo.
Isikrini se-silk namafutha aluhlaza ngokuvamile asulwa, futhi ucingo lwethusi kanye nesikhumba sethusi kufanele kusulwe amahlandla ambalwa. Ngokuvamile, ibhodi le-Bluetooth lingasulwa emizuzwini embalwa, futhi induku yememori izothatha imizuzu eyishumi; Vele, uma unamandla amaningi, kuzothatha isikhathi esincane; Uma unamandla amancane, kuzothatha isikhathi esithe xaxa.
Ibhodi yokugaya okwamanje isixazululo esivame kakhulu esisetshenziselwa ukubekwa, futhi futhi kungokomnotho kakhulu. Singathola i-PCB elahliwe bese sizama. Eqinisweni, ukugaya iBhodi akunzima ubuchwepheshe. Kuyamangaza nje. Kudinga umzamo omncane futhi asikho isidingo sokukhathazeka ngokugaya iBhodi eminweni.
I-PCB Umdwebo Offect Ukubuyekezwa
Ngesikhathi senqubo yesakhiwo se-PCB, ngemuva kokuqedwa kwesakhiwo sesistimu, umdwebo we-PCB kufanele abukezwe ukuze abone ukuthi ngabe ukwahlukaniswa kohlelo kunengqondo nokuthi umphumela ofanele ungatholakala yini. Ngokuvamile kungaphenywa ngezinto ezilandelayo:
1. Ukuthi ngabe i-System Layit iqinisekisa i-wiring enengqondo noma efanelekile, ngabe i-wiring ingenziwa ngokuthembekile, nokuthi ukuthembeka komjikelezo kungaqinisekiswa. Esandleni, kuyadingeka ukuthi ube nokuqonda okuphelele nokuhlelwa kokuqondisa kwesiginali kanye nenethiwekhi ye-Ground Wire.
2. Ukuthi usayizi webhodi ephrintiwe uhambisana nosayizi womdwebo wokucubungula, noma ngabe kungahlangabezana nezidingo zenqubo yokukhiqiza ye-PCB, nokuthi ngabe kukhona umaki wokuziphatha. Leli phuzu lidinga ukunakwa okukhethekile. Ukuhlelwa kwe-circuit kanye ne-wiring yamabhodi amaningi we-PCB aklanywe kahle kakhulu futhi ngokunengqondo, kepha ukuma okunembile kwesixhumi sokuma kunganakwa, okuholela ekuklameni komjikelezo akunakudonswa neminye imibuthano.
3. Ukuthi izakhi zingqubuzana esikhaleni esinezici ezimbili nesithathu. Naka usayizi wangempela wedivayisi, ikakhulukazi ukuphakama kwensiza. Lapho izingxenye ze-welding ngaphandle kwesakhiwo, ukuphakama akufanele kudlule i-3mm.
4. Ukuthi ngabe ukwakheka kwezakhi kuyaminyene futhi kuhlelekile, kuhlelwe kahle, nokuthi konke kukhishwe. Esakhiweni sezakhi, hhayi kuphela ukuqondiswa kwesiginali, uhlobo lwesiginali, kanye nezindawo ezidinga ukunakwa noma ukuvikelwa kufanele kubhekwe, kepha ukubonwa okuphelele kwesakhiwo sedivayisi kumele kubhekwe ukuze kufezeke ubuningi bomfaniswano.
5. Ukuthi izakhi ezidinga ukushintshwa kaningi zingashintshwa kalula, nokuthi i-plug-in board ingafakwa kalula kwimishini. Ukusebenziseka lula kanye nokwethenjwa kokubuyiselwa kwemali nokuxhumana kwezinto ezivame ukushintshwa kwezinto kufanele zibekwe.