(1) ulayini
Ngokuvamile, ububanzi be-Signal Line bubanzi bungu-0.3mm (12mil), ububanzi bamandla obubanzi bungu-0.77mm (30mil) noma i-1.27mm (50mil); Ibanga phakathi komugqa kanye nomugqa kanye ne-pad kukhulu kune- noma kulingana no-0.33mm (13mil)). Kuzinhlelo zokusebenza ezisebenzayo, kwandisa ibanga lapho izimo zivuma;
Lapho ubuningi be-wiring buphakeme, kungabhekwa imigqa emibili (kodwa kunganconywa) ukusebenzisa izikhonkwane ze-IC. Ububanzi bangempela bungu-0.254mm (10mil), kanye nokuhlukaniswa komugqa akuphansi kuka-0.254mm (10mil). Ngaphansi kwezimo ezikhethekile, lapho izikhonkwane zedivayisi ziminyene futhi ububanzi buncane, ububanzi bentambo kanye nokuhlukaniswa komugqa kungancishiswa ngokufanele.
(2) Pad (pad)
Izidingo eziyisisekelo zePads (Pad) nezimbobo zokuguqula (nge-Via) yilezi: ububanzi bediski bukhulu kunobubanzi bomgodi ngo-0.6mm; Isibonelo, abamelana ne-PIN enobugovu, ama-capacitors, kanye nemibuthano ehlanganisiwe, njll., Sebenzisa usayizi wediski / i-63mil / 32mil Kuhlelo lwangempela, kufanele lunqunywe ngokuya ngosayizi wengxenye yangempela. Uma izimo zivuma, usayizi we-pad unyuswe ngendlela efanele;
Ingxenye yokukhuphuka kwengxenye eyenzelwe kwi-PCB kufanele ibe ngu-0.2 ~ 0.4mm (8-16MIL) inkulu kunesayizi yangempela ye-PIN yePhiko.
(3) nge (nge-via)
Ngokuvamile i-1.27mm / 0.7mm (50mil / 28mil);
Lapho ubukhulu be-wiring buphezulu, usayizi we-via bungancishiswe ngokufanele, kepha akufanele kube mncane kakhulu. Cabanga ukusebenzisa i-1.0mm / 0.6mm (40mil / 24mil).

(4) Izidingo ze-Pitch zamaphilisi, imigqa, kanye ne-vias
Pad naku-via: ≥ 0.3mm (12mil)
Iphedi nePad: ≥ 0.3mm (12mil)
Pad and track: ≥ 0.3mm (12mil)
Landelela futhi ulandelele: ≥ 0.3mm (12mil)
Esikhathini esiphakeme:
Iphedi nange-Via: ≥ 0.254mm (10mil)
Iphedi nePad: ≥ 0.254mm (10mil)
Pad and Track: ≥ 0.254mm (10mil)
Landelela futhi ulandelele: ≥ 0.254mm (10mil)