(1) Umugqa
Ngokuvamile, ububanzi bomugqa wesignali bungu-0.3mm (12mil), ububanzi bomugqa wamandla bungu-0.77mm (30mil) noma 1.27mm (50mil); ibanga phakathi komugqa nomugqa kanye nephedi likhulu noma lilingana no-0.33mm (13mil) ). Ezicelweni ezingokoqobo, khulisa ibanga lapho izimo zivuma;
Uma ukuminyana kwezintambo kuphezulu, imigqa emibili ingacatshangelwa (kodwa ayinconyiwe) ukuze kusetshenziswe izikhonkwane ze-IC. Ububanzi bomugqa bungu-0.254mm (10mil), futhi isikhala solayini asikho ngaphansi kuka-0.254mm (10mil). Ngaphansi kwezimo ezikhethekile, lapho izikhonkwane zedivayisi ziminyene futhi ububanzi buncane, ububanzi bomugqa kanye nesikhala somugqa kungancishiswa ngokufanelekile.
(2) Iphedi (PAD)
Izidingo eziyisisekelo zamaphedi (PAD) kanye nezimbobo zokuguqula (VIA) yilezi: ububanzi bediski bukhulu kunobubanzi bomgodi ngo-0.6mm; isibonelo, amaphini okuphikiswa enhloso ejwayelekile, ama-capacitor, namasekhethi ahlanganisiwe, njll., sebenzisa usayizi wediski/imbobo ongu-1.6mm/0.8 mm (63mil/32mil), amasokhethi, izikhonkwane nama-diode 1N4007, njll., asebenzisa u-1.8mm/ 1.0mm (71mil/39mil). Kuzinhlelo zokusebenza zangempela, kufanele kunqunywe ngokuya ngosayizi wengxenye yangempela. Uma izimo zivuma, usayizi wephedi ungandiswa ngokufanelekile;
Imbobo yokufaka ingxenye eklanywe ku-PCB kufanele ibe ngu-0.2～0.4mm (8-16mil) ibe mkhulu kunosayizi wangempela wephinikhodi yengxenye.
(3) Nge-(VIA)
Ngokuvamile 1.27mm/0.7mm (50mil/28mil);
Uma ukuminyana kwezintambo kuphezulu, usayizi we- via bungancishiswa ngokufanelekile, kodwa akumele ube mncane kakhulu. Cabangela ukusebenzisa 1.0mm/0.6mm (40mil/24mil).

(4) Izidingo ze-pitch zamaphedi, imigqa, kanye nama-vias
I-PAD ne-VIA: ≥ 0.3mm (12mil)
I-PAD ne-PAD: ≥ 0.3mm (12mil)
I-PAD ne-TRACK: ≥ 0.3mm (12mil)
I-TRACK NE-TRACK: ≥ 0.3mm (12mil)
Ekumineni okuphezulu:
I-PAD ne-VIA: ≥ 0.254mm (10mil)
I-PAD ne-PAD: ≥ 0.254mm (10mil)
I-PAD ne-TRACK: ≥ 0.254mm (10mil)
I-TRACK NE-TRACK: ≥ 0.254mm (10mil)