Umklamo we-laminated ngokuyinhloko uhambisana nemithetho emibili:
1. Ungqimba ngalunye lwezintambo kufanele lube nongqimba lwereferensi oluseduze (ungqimba lwamandla noma lomhlabathi);
2. Ungqimba lwamandla amakhulu oluseduze kanye nongqimba lomhlabathi kufanele kugcinwe ebangeni elincane ukuze kunikeze amandla amakhulu okuhlanganisa;
Okulandelayo kuklelisa isitaki kusuka ebhodini elinezingqimba ezimbili kuya ebhodini elinezingqimba eziyisishiyagalombili njengesibonelo incazelo:
1. Ibhodi le-PCB elinohlangothi olulodwa kanye nesitaki sebhodi se-PCB esinezinhlangothi ezimbili
Emabhodini anezingqimba ezimbili, ngenxa yenani elincane lezendlalelo, ayisekho inkinga ye-lamination. Ukulawula imisebe ye-EMI kucatshangelwa ikakhulukazi kusuka kuzintambo kanye nesakhiwo;
Ukuhambisana kwe-electromagnetic kwamabhodi ongqimba olulodwa namabhodi anengqimba ekabili sekugqame kakhulu. Isizathu esiyinhloko salesi senzakalo ukuthi indawo ye-signal loop inkulu kakhulu, engakhiqizi nje imisebe ye-electromagnetic enamandla, kodwa futhi yenza isekethe ibe nomuzwa wokuphazanyiswa kwangaphandle. Ukuthuthukisa ukuhambisana kwe-electromagnetic kwesekhethi, indlela elula ukwehlisa indawo eyiluphu yesiginali yokhiye.
Isignali engukhiye: Ngokombono wokuhambisana kozibuthe, amasignali abalulekile abhekisela kumasignali akhiqiza imisebe enamandla namasignali azwelayo emhlabeni wangaphandle. Amasignali angakhiqiza imisebe enamandla ngokuvamile amasignali ezikhathi ezithile, njengamasiginali ane-oda eliphansi lamawashi noma amakheli. Amasignali azwelayo ekuphazamisekeni amasignali e-analog anamazinga aphansi.
Amabhodi anongqimba olulodwa nakabili ngokuvamile asetshenziswa kumiklamo ye-analog yefrikhwensi ephansi ngaphansi kuka-10KHz:
1) Amathrekhi wamandla kusendlalelo esifanayo ahanjiswa nge-radially, futhi ubude obuphelele bemigqa buncishisiwe;
I-2) Lapho usebenzisa izintambo zamandla nezaphansi, kufanele zisondelane; beka intambo yaphansi eduze kwentambo yesiginali yokhiye, futhi le ntambo yaphansi kufanele ibe seduze kakhulu nentambo yesiginali. Ngale ndlela, kwakhiwa indawo encane ye-loop futhi ukuzwela kwemisebe yemodi yokuhlukanisa kuya ekuphazamiseni kwangaphandle kuyancishiswa. Uma intambo yaphansi yengezwa eduze kwentambo yesignali, iluphu enendawo encane kakhulu iyakhiwa, futhi isignali yamanje izothatha le loop esikhundleni sezinye izintambo eziphansi.
I-3) Uma ibhodi lesifunda elinezingqimba ezimbili, ungabeka ucingo lomhlabathi eduze komugqa wesignali ngakolunye uhlangothi lwebhodi lesifunda, ngokushesha ngaphansi komugqa wesignali, futhi umugqa wokuqala kufanele ube ububanzi ngangokunokwenzeka. Indawo ye-loop eyenziwe ngale ndlela ilingana nobukhulu bebhodi lesifunda eliphindwe ngobude bomugqa wesignali.
Ama-laminates anezingqimba ezimbili nezine
1. SIG—GND(PWR)－PWR (GND)－SIG;
2. GND－SIG(PWR)－SIG(PWR)－GND;
Kule miklamo emibili enama-laminated engenhla, inkinga engaba khona iwugqinsi lwebhodi elingokwesiko elingu-1.6mm (62mil). Isikhala sesendlalelo sizoba sikhulu kakhulu, okungekona nje kuphela okungalungile ekulawuleni i-impedance, ukuhlangana kwe-interlayer nokuvikela; ikakhulukazi, isikhala esikhulu phakathi kwezindiza zamandla aphansi kunciphisa amandla ebhodi futhi asihambisani nokuhlunga umsindo.
Ngohlelo lokuqala, luvame ukusetshenziswa esimweni lapho kunama-chips amaningi ebhodini. Lolu hlobo lwesikimu lungathola ukusebenza okungcono kwe-SI, alulungele kakhulu ukusebenza kwe-EMI, ikakhulukazi ngokusebenzisa izintambo neminye imininingwane okufanele ilawulwe. Ukunakwa okuyinhloko: Ungqimba lomhlabathi lubekwe ongqimbeni oluxhumayo lwesendlalelo sesignali ngesignali eminyene kakhulu, enenzuzo ukumunca nokucindezela imisebe; ukwandisa indawo yebhodi ukukhombisa umthetho we-20H.
Ngokuqondene nesixazululo sesibili, ngokuvamile sisetshenziswa lapho ukuminyana kwe-chip ebhodini kuphansi ngokwanele futhi kunendawo eyanele ezungeze i-chip (beka ungqimba lwethusi wamandla adingekayo). Kulolu hlelo, ungqimba lwangaphandle lwe-PCB luwungqimba lomhlabathi, futhi izingqimba ezimbili ezimaphakathi ziyizingqimba zesignali/zamandla. Ukunikezwa kwamandla kwesendlalelo sesignali kuhanjiswa ngomugqa obanzi, ongenza ukuthi indlela yokuphamba kwamandla kagesi ibe phansi, futhi ukuvinjelwa kwendlela yesignali ye-microstrip nakho kuphansi, futhi imisebe yesignali yongqimba yangaphakathi nayo ingavikelwa ungqimba lwangaphandle. Ngokombono wokulawula kwe-EMI, lesi yisakhiwo se-PCB esendlalelo esingcono kakhulu esingu-4 esitholakalayo.
Ukunakwa okuyinhloko: Ibanga phakathi kwezingqimba ezimbili ezimaphakathi zesignali kanye nezendlalelo zokuxuba amandla kufanele zinwetshwe, futhi isiqondiso sezintambo kufanele sime mpo ukuze kugwenywe i-crosstalk; indawo yebhodi kufanele ilawulwe ngokufanelekile ukuze ibonise umthetho we-20H; uma ufuna ukulawula i-wiring impedance, isixazululo esingenhla kufanele siqaphele kakhulu umzila wezintambo Ihlelwe ngaphansi kwesiqhingi sethusi ukuze inikeze amandla kanye nomhlabathi. Ngaphezu kwalokho, ithusi ekunikezeni amandla noma ungqimba lomhlabathi kufanele lixhunywe ngangokunokwenzeka ukuze kuqinisekiswe i-DC kanye nokuxhumeka kwe-low-frequency.
I-laminate emithathu, enezingqimba eziyisithupha
Ngemiklamo ene-chip density ephezulu kanye nemvamisa yewashi ephakeme, kufanele kucatshangelwe idizayini yebhodi enezingqimba ezi-6, futhi kunconywe indlela yokunqwabelanisa:
1. SIG—GND－SIG－PWR－GND－SIG;
Kulolu hlobo lwesikimu, lolu hlobo lwesikimu se-laminated lungathola ubuqotho besignali engcono, ungqimba lwesignali luseduze nongqimba lomhlabathi, ungqimba lwamandla kanye nongqimba lomhlabathi kubhanqiwe, ukuvinjelwa kwesendlalelo sezintambo ngasinye kungalawulwa kangcono, futhi ezimbili. I-stratum ingakwazi ukumunca kahle imigqa yamagnetic field. Futhi lapho ukunikezwa kwamandla kanye nongqimba lomhlabathi sekuqediwe, kunganikeza indlela engcono yokubuyisela isendlalelo ngasinye sesignali.
2. GND－SIG－GND－PWR－SIG－GND;
Kulolu hlobo lwesikimu, lolu hlobo lwesikimu lufaneleka kuphela esimweni sokuthi ukuminyana kwedivayisi akuphakeme kakhulu, lolu hlobo lwe-lamination lunazo zonke izinzuzo ze-lamination engenhla, futhi indiza yomhlabathi yezingqimba ezingaphezulu nezingaphansi zilinganiselwe. ephelele, engasetshenziswa njengesendlalelo esingcono sokuvikela Ukuze usisebenzise. Kumele kuqashelwe ukuthi ungqimba lwamandla kufanele lusondele kungqimba olungeyona ingxenye eyinhloko yengxenye, ngoba indiza yengqimba engezansi izobe iphelele kakhulu. Ngakho-ke, ukusebenza kwe-EMI kungcono kunesixazululo sokuqala.
Isifinyezo: Ohlelweni lwebhodi lezendlalelo eziyisithupha, ibanga phakathi kwesendlalelo samandla nesendlalelo esingaphansi kufanele lincishiswe ukuze kutholwe amandla amahle nokuhlangana komhlabathi. Kodwa-ke, nakuba ubukhulu bebhodi bungu-62mil futhi ukuhlukaniswa kwezingqimba kuncishisiwe, akulula ukulawula isikhala phakathi kwamandla amakhulu kanye nongqimba lomhlabathi ukuba lube luncane. Uma kuqhathaniswa uhlelo lokuqala nolwesibili, izindleko zohlelo lwesibili zizokhula kakhulu. Ngakho-ke, sivame ukukhetha inketho yokuqala lapho sihlanganisa. Lapho uklama, landela umthetho we-20H kanye nomklamo womthetho wesendlalelo sesibuko.
Ama-laminates anezingqimba ezine neziyisishiyagalombili
1. Lena akuyona indlela enhle yokunqwabelanisa ngenxa yokumunca kahle kazibuthe kagesi kanye nokuphazamiseka kokuphakelwa kwamandla okukhulu. Isakhiwo sawo simi kanje:
1.Isiginali engu-1 yengxenye engaphezulu, isendlalelo sezintambo ze-microstrip
2. Isendlalelo sezintambo ezisiginali 2 sangaphakathi se-microstrip, isendlalelo sezintambo esingcono (isiqondiso esingu-X)
3.Indawo
4. Isendlalelo se-Signal 3 somugqa we-strip, isendlalelo esingcono somzila (inkomba engu-Y)
5.Signal 4 stripline routing layer
6.Amandla
7. Isiginali ye-5 yangaphakathi ye-microstrip wiring layer
8.Signal 6 microstrip trace layer
2. Iwuhlobo lwendlela yesithathu yokunqwabelanisa. Ngenxa yokwengezwa kwesendlalelo sereferensi, inokusebenza okungcono kwe-EMI, futhi ukuvinjelwa kwesici kwesendlalelo ngasinye sesiginali kungalawulwa kahle.
1.Signal 1 component surface, microstrip wiring layer, good wiring layer
2. I-Ground stratum, ikhono elihle lokumunca igagasi kagesi
3. Isendlalelo somzila we-Signal 2, ungqimba oluhle lomzila
4. Isendlalelo samandla samandla, sakha ukumuncwa kwe-electromagnetic okuhle kakhulu ngesendlalelo esingaphansi kuka-5. Ungqimba oluphansi
6.Signal 3 stripline routing layer, isendlalelo esihle somzila
7. I-stratum yamandla, ene-impedance enkulu yokunikezwa kwamandla
8.Signal 4 microstrip wiring layer, ungqimba oluhle lwezintambo
3. Indlela engcono kakhulu yokunqwabelanisa, ngenxa yokusetshenziswa kwezindiza zenkomba yezendlalelo eziningi zomhlaba, inomthamo omuhle kakhulu wokumuncwa we-geomagnetic.
1.Signal 1 component surface, microstrip wiring layer, good wiring layer
2. I-Ground stratum, ikhono elingcono lokumunca igagasi kagesi
3. Isendlalelo somzila we-Signal 2, ungqimba oluhle lomzila
4.Isendlalelo samandla samandla, sakhe ukumuncwa kwe-electromagnetic okuhle kakhulu ngesendlalelo esingaphansi kuka-5.Ground ground layer
6.Signal 3 stripline routing layer, isendlalelo esihle somzila
7. I-Ground stratum, ikhono elingcono lokumunca igagasi kagesi
8.Signal 4 microstrip wiring layer, ungqimba oluhle lwezintambo
Indlela yokukhetha ukuthi zingaki izendlalelo zamabhodi ezisetshenziswa ekwakhiweni nokuthi zibekwa kanjani kuncike ezintweni eziningi njengenani lamanethiwekhi esignali ebhodini, ukuminyana kwedivayisi, ukuminyana kwephinikhodi, imvamisa yesignali, usayizi webhodi nokunye. Kufanele sicabangele lezi zici ngendlela ebanzi. Ukuze uthole amanethiwekhi amaningi esignali, ukuphakama kwedivayisi kuphakeme, ukuphakama kwephinikhodi ephakeme kanye nemvamisa yesignali ephakeme, idizayini yebhodi lezendlalelo eziningi kufanele yamukelwe ngangokunokwenzeka. Ukuze uthole ukusebenza okuhle kwe-EMI, kungcono kakhulu ukuqinisekisa ukuthi isendlalelo ngasinye sesignali sinesendlalelo saso sereferensi.