Isizathu Plating, sibonisa ukuthi ifilimu eyomile futhi zethusi ucwecwe ipuleti bonding akuqinile, ukuze isixazululo Plating ejulile, okuphumela "isigaba negative" ingxenye enamathela ukuqina, iningi abakhiqizi PCB kubangelwa izizathu ezilandelayo. :

1. Amandla okuchayeka aphezulu noma aphansi

Ngaphansi kokukhanya kwe-ultraviolet, i-photoinitiator, emunca amandla okukhanya, ihlehla ibe ama-radicals mahhala ukuze iqalise i-photopolymerization yama-monomers, yakhe ama-molecule omzimba angancibiliki kusixazululo se-alkali esincibilikayo.
Ngaphansi kokuchayeka, ngenxa ye-polymerization engaphelele, ngesikhathi senqubo yokuthuthukiswa, ukuvuvukala kwefilimu nokuthambisa, okuholela emigqeni engacacile ngisho nongqimba lwefilimu, okuholela ekuhlanganiseni okubi kwefilimu nethusi;
Uma ukuchayeka kuningi, kuzodala ubunzima bentuthuko, kodwa futhi ohlelweni lwe-electroplating kuzokhiqiza ikhasi elisontekile, ukwakheka kwe-plating.
Ngakho-ke kubalulekile ukulawula amandla okuchayeka.

2. Ukucindezela kwefilimu okuphezulu noma okuphansi

Uma ingcindezi yefilimu iphansi kakhulu, indawo yefilimu ingase ingalingani noma igebe phakathi kwefilimu eyomile nepuleti yethusi lingase lingahlangabezani nezidingo zamandla okubopha;
Uma ingcindezi yefilimu iphezulu kakhulu, izingxenye ezincibilikayo neziguquguqukayo zongqimba lokumelana nokugqwala zishintshashintsha kakhulu, okuholela ekutheni ifilimu eyomile ibe brittle, ukushaqeka kwe-electroplating kuzoba ukuxebuka.

3. Ukushisa kwefilimu ephezulu noma ephansi

Uma izinga lokushisa lefilimu liphansi kakhulu, ngoba ifilimu yokumelana nokugqwala ayikwazi ukuthambisa ngokugcwele futhi ukugeleza okufanele, okuholela ekutheni ifilimu eyomile kanye nokunamathela kwe-laminate ebusweni be-copper-clad kumpofu;
Uma izinga lokushisa liphezulu kakhulu ngenxa yokuhwamuka okusheshayo kwe-solvent nezinye izinto eziguquguqukayo kubhamuza lokumelana nokugqwala, futhi ifilimu eyomile iba brittle, ekwakhekeni kokushaqeka kwe-electroplating kwekhasi le-warping, okuholela ekuqhekekeni.