I-PCB (I-Printred Circuity Board), igama lesiShayina libizwa ngokuthi i-Printiwed Circuit Board, eyaziwa nangokuthi ibhodi yesekethe ephrintiwe, iyingxenye ebalulekile ye-elekthronikhi, ingumzimba wokusekela wezakhi ze-elekthronikhi. Ngoba kukhiqizwa ukuphrinta nge-elekthronikhi, kubizwa ngokuthi i-Prience Morcuit Board.
Ngaphambi kwama-PCB, amasekethe enziwe nge-point-to-point wiring. Ukwethenjwa kwale ndlela kuphansi kakhulu, ngoba njengeminyaka yesekethe, ukuqhekeka komugqa kuzodala ukuthi umugqa welayini uphule noma umfushane. Ubuchwepheshe be-Wire Winding busekuqaleni kwezesekethe ubuchwepheshe, obuthuthukisa ukuqina kanye nekhono elingenakushintshwa komugqa ngokufaka ucingo oluncane oluzungeze isigxobo esiseduze nesigxobo.
Njengoba imboni ye-elekthronikhi yavela kumashubhu we-vacuum futhi idlulisela kuma-wemicon semiconductors kanye nemibuthano ehlanganisiwe, usayizi kanye nentengo yezinto ze-elekthronikhi nazo zenqabile. Imikhiqizo ye-elekthronikhi iya ngokuya ivela emkhakheni wabathengi, idonsa abakhiqizi ukuthi babheke izixazululo ezincane nezingabizi kakhulu. Ngakho-ke, i-PCB yazalwa.
Inqubo yokukhiqiza ye-PCB
Ukukhiqizwa kwe-PCB kuyinkimbinkimbi kakhulu, kuthatha ibhodi eliphrintiwe ezine, inqubo yalo yokukhiqiza ikakhulukazi ifaka i-PCB Layout, Ukufakwa kwe-PCB ye-PCB, ukudonsa, ukumba, ukumba, ukumba kwe-PCB Layout, i-PCB etching nezinye izinyathelo.
1, I-PCB Layout
Isinyathelo sokuqala ekukhiqizeni i-PCB ukuhlela nokuhlola ukwakheka kwe-PCB. Ifektri yokukhiqiza i-PCB ithola amafayela we-CAD kwinkampani ye-PCB Design, futhi njengoba isoftware ngayinye ye-CAD inefomethi yayo eyingqayizivele yefayela, ifektri ye-PCB ihumusha ngefomethi ehlanganisiwe - I-Gerber RS-274XX noma i-Gerber X2. Lapho-ke unjiniyela wefektri uzobheka ukuthi ngabe ukwakheka kwe-PCB kuvumelana yini nenqubo yokukhiqiza nokuthi ngabe kukhona iziphambeko nezinye izinkinga.
2, ukukhiqizwa kwepuleti emgogodleni
Hlanza ipuleti le-clad lethusi, uma kukhona uthuli, kungahle kuholele esisekelweni sokugcina esifushane noma ikhefu.
I-PCB enobungqingili: empeleni yenziwe ngamapuleti amathathu ahlanganiswe yi-copep Ukulandelana kokukhiqizwa kuqala kusuka epuletini eliphakathi eliphakathi (4 noma ama-5 wezendlalelo zemigqa), futhi kuhlanganiswa njalo ndawonye bese kulungiswa. Ukukhiqizwa kwe-PCB enobungqingili kuyafana, kepha kusetshenziswa kuphela i-1 Core Board namafilimu amabili ethusi.
3, ukuhanjiswa kwe-pcb ye-pcb yangaphakathi
Okokuqala, izingqimba ezimbili ze-Core Core Core Board (Core) zenziwe. Ngemuva kokuhlanza, ipuleti le-Copper-clad limbozwe ngefilimu ebabazekayo. Ifilimu iqina lapho ivezwa ukukhanya, yakha ifilimu evikelayo phezu kwe-foil yethuli yeplanethi yethusi.
Ifilimu elingezansi le-PCB Layer Pecb kanye neplate yeCopper Copper Comper ekugcineni ifakwa kwifilimu ephakeme ye-PCB Layout ukuqinisekisa ukuthi izingqimba eziphezulu nezingaphansi zefilimu ye-PCB Layout zihlanganiswe kahle.
I-Sensitizer iyalela ifilimu ebucayi kwi-foil yethusi ngesibani se-UV. Ngaphansi kwefilimu esobala, ifilimu ebucayi yelashwa, futhi ngaphansi kwefilimu ye-opaque, akukho filimu ebucayi enombala. I-Fopper Foil embozwe ngaphansi kwefilimu evuthiwe ye-PhotoShinative film iyindlela edingekayo ye-PCB Layout Line, elingana neqhaza le-Ink yephrinta ye-Laser ye-PCB.
Lapho-ke ifilimu elingenakuphikiswa le-photosessan lihlanzwa nge-LY, kanti umugqa we-foil we-foil odingekayo uzombozwa yifilimu ye-PhotoShine ephulukile.
I-Foil ye-Copper engafuneki yabe isitholakala nge-alkali eqinile, efana naoh.
Sula ifilimu elivuthiwe le-PhotoShinative file ukuze iveze i-foil ye-Copper edingekayo kwimigqa yesakhiwo se-PCB.
4, ukushayela kwepuleti komgogodla nokuhlolwa
Ipuleti eliyisisekelo lenziwe ngempumelelo. Bese ushaya umgodi ohambelana epuletini eliyisisekelo ukwenza lula ukuqondanisa nezinye izinto ezingavuthiwe ngokulandelayo
Lapho iBhodi leCore licindezelwa ndawonye nezinye izingqimba ze-PCB, alikwazi ukuguqulwa, ngakho-ke kuhlolwa kubaluleke kakhulu. Umshini uzoqhathanisa ngokuzenzakalelayo nemidwebo ye-PCB Layout ukuze uhlole amaphutha.
5. I-laminate
Lapha izinto ezintsha ezivuthiwe ezibizwa ngeshidi le-semi-curring ziyadingeka, okukhona okunamathelayo phakathi kwebhodi eliyisisekelo nenombolo ye-PCB (Inombolo ye-PCB >>, kanye ne-foil ye-copper yangaphandle, futhi nayo idlala indima yokufakelwa.
I-foil ephansi ye-Fopper kanye nezendlalelo ezimbili zeshidi elaphethwe yi-alignment kanye neplate ephansi yensimbi kusengaphambili, bese kuthi ipuleti le-aluminum elisezingeni eliphansi, bese ungqimba le-foil elivuthiwe, ungqimba lwepuleti ye-aluminised ecindezelwe
Amabhodi we-PCB ahlanganiswe ngamapuleti e-Iron abekwe kubakaki, bese athumela ku-vacuum hot Press ukuze abulawe. Izinga lokushisa eliphakeme le-vacuum anyatheli kuncibilika i-epoxy resin ekhasini eliphethwe yi-semi-curged, libambe amapuleti asemqoka kanye ne-foil yethusi ndawonye ngaphansi kwengcindezi.
Ngemuva kokuthi i-laight iphelele, susa ipuleti eliphezulu lensimbi elicindezela i-PCB. Ngemuva kwalokho ipuleti ye-aluminium ecindezelwe iyasuswa, futhi ipuleti le-aluminium libuye lidlale umthwalo wemfanelo wokuhlukanisa ama-PCB ahlukene futhi aqinisekise ukuthi i-foil ye-Copper engxenyeni yangaphandle ye-PCB ibushelelezi. Ngalesi sikhathi, zombili izinhlangothi ze-PCB ezithathiwe zizombozwa ngongqimba lwe-foil ye-foil ebushelelezi.
6. Ukumba
Ukuxhuma izingqimba ezine ze-foil ye-Copper engaxhumana naye e-PCB ndawonye, okokuqala shayela i-gerovation ngokusebenzisa phezulu nangaphansi ukuvula i-PCB, bese ubeka udonga lomgodi ukuze uhambise ugesi.
Umshini wokushayela we-X-ray usetshenziselwa ukuthola i-Inist Core Board, futhi umshini uzothola ngokuzenzakalelayo futhi uthole umgodi ebhodini eliyisisekelo, bese ushaya umgodi wokubeka endaweni kwi-PCB ukuqinisekisa ukuthi ukumba okulandelayo kudlula maphakathi nomgodi.
Beka ungqimba wephepha le-aluminium emshinini we-punch bese ubeka i-PCB kuyo. Ukuze uthuthukise ukusebenza kahle, amabhodi we-PCB angu-1 kuya kwa-3 azofakwa ndawonye ukuze afezeke ngokwezinombolo zezendlalelo ze-PCB. Ekugcineni, ungqimba wepuleti ye-aluminium embozwe kwi-PCB ephezulu, futhi izingqimba ezingenhla ze-aluminium zizokwenza lapho umtshali ushaya futhi eshayela, i-foil ye-PCB ngeke ivele.
Enqubweni yokuqalwa kwangaphambilini, i-epoxy resin encibilikisiwe yancishiswa ngaphandle kwe-PCB, ngakho-ke kwakudinga ukususwa. Umshini wokugaya iphrofayili usika i-periphery ye-PCB ngokuya ngezixhumanisi ezifanele ze-XY.
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Kusukela cishe yonke imiklamo ye-PCB isebenzisa ama-perforations ukuxhuma izingqimba ezahlukene ze-wiring, ukuxhumana okuhle kudinga ifilimu elingu-25 lethusi le-micron odongeni lomgodi. Lokhu kushuba kwefilimu yethusi kudinga ukufezekiswa nge-electroplating, kepha udonga lomgodi luyakhiwa nge-resin ye-epoxy engaqhutshwanga ne-fiberglass Board.
Ngakho-ke, igxathu lokuqala ukuqongelela ungqimba lwezinto ezisebenzayo odongeni lomgodi, bese wenza ifilimu elingu-1 le-micron yethusi kulo lonke i-PCB engaphezulu, kufaka phakathi udonga lwamakhemikhali. Inqubo yonke, njengokulashwa kwamakhemikhali nokuhlanza, kulawulwa ngumshini.
I-PCB elungisiwe
I-PCB ehlanzekile
Ukuthumela PCB
8, ukuhanjiswa kwe-PCB ye-PCB
Okulandelayo, ukwakheka kwe-PCB yangaphandle kuzodluliselwa ku-foil ye-Copper, futhi inqubo ifana ne-Insimu ye-PCB ye-CORE ye-Core Consout, okuwukusetshenziswa kwefilimu okubucayi ukudlulisa ukwakheka kwe-PCB ku-foil ye-Copper, okuwukuphela kwefilimu elinempilo elizosetshenziswa njengebhodi.
Ukudluliswa kwe-PCB ye-PCB Yamukela indlela yokususa, futhi ifilimu elibi lisetshenziswa njengebhodi. I-PCB imbozwe ifilimu eliqinile lokuthwebula izithombe, hlanza ifilimu elingenalwazi le-poplic, i-foil eveziwe ye-poil ivaliwe, umugqa we-PCB Layout uvikelwe yifilimu eqinile yezithombe nakwesobunxele.
Ukudluliselwa kwesakhiwo se-PCB yangaphandle kwamukela indlela ejwayelekile, futhi ifilimu elinembile lisetshenziswa njengebhodi. I-PCB imbozwe yifilimu ye-Photossen Photossen ye-non-line. Ngemuva kokuhlanza ifilimu yezithombe engaqinisekisiwe, kwenziwa i-electroplating. Lapho kunefilimu khona, ayikwazi ukukhiqizwa, futhi lapho kungekho filimu, ifakwe ngethusi bese i-tin. Ngemuva kokuthi ifilimu isusiwe, kufakwa i-alkaline etching, ekugcineni kususwe i-tin. Iphethini yomugqa ishiywe ebhodini ngoba ivikelwe yi-tin.
Bopha i-PCB ne-electroplate yethusi kukho. Njengoba kushiwo ngaphambili, ukuze i-Hole inokuphamba okuhle okwenele, ifilimu yethusi eligcwele odongeni lweHole kufanele libe nobukhulu bamagciwane angama-25, ngakho-ke lonke uhlelo luzolawulwa ngokuzenzakalelayo yikhompyutha ukuqinisekisa ukunemba kwayo.
9, Outer PCB Etching
Inqubo ye-etching iseqediwe ngepayipi elizenzakalelayo elizenzakalelayo. Okokuqala, ifilimu evuthiwe ye-PhotoShinative ebhodini le-PCB lihlanzwa. Kugezwa nge-alkali eqinile ukususa i-foil ye-topper engafuneki embozwe yiyo. Bese ususa i-tin coating ku-PCB Ladiout Fost Foil ngesisombululo esinqunyelwe. Ngemuva kokuhlanza, ukwakheka kwe-PCB ye-PCB ephelele.