I-PCB (Ibhodi Lesifunda Eliphrintiwe), igama lesiShayina libizwa ngokuthi ibhodi lesifunda eliphrintiwe, elaziwa nangokuthi ibhodi lesifunda eliphrintiwe, liyingxenye ebalulekile ye-elekthronikhi, iyindikimba yokusekela yezingxenye ze-elekthronikhi. Ngenxa yokuthi ikhiqizwa ngokuphrinta nge-elekthronikhi, ibizwa ngokuthi ibhodi lesifunda "eliphrintiwe".
Ngaphambi kwe-PCBS, amasekhethi ayenziwe nge-point-to-point wiring. Ukuthembeka kwale ndlela kuphansi kakhulu, ngoba njengoba iminyaka yesifunda, ukuphuka komugqa kuzobangela ukuthi i-node yomugqa iphule noma ibe mfushane. Ubuchwepheshe bokusonga izintambo bungukuthuthuka okukhulu kubuchwepheshe besekethe, okuthuthukisa ukuqina nekhono elithathela indawo lolayini ngokusonta intambo encane yobubanzi ezungeze isigxobo endaweni yokuxhuma.
Njengoba imboni yezogesi ithuthuka isuka kumashubhu evacuum kanye nokudluliselwa kwama-silicon semiconductors namasekethe ahlanganisiwe, usayizi nentengo yezingxenye ze-elekthronikhi nakho kwehlile. Imikhiqizo ye-elekthronikhi iya ngokuya ivela emkhakheni wabathengi, okwenza abakhiqizi bafune izixazululo ezincane nezingabizi kakhulu. Ngakho, i-PCB yazalwa.
Inqubo yokukhiqiza ye-PCB
Ukukhiqizwa kwe-PCB kuyinkimbinkimbi kakhulu, kuthatha ibhodi eliphrintiwe elinezingqimba ezine njengesibonelo, inqubo yalo yokukhiqiza ikakhulukazi ihlanganisa ukuhlelwa kwe-PCB, ukukhiqizwa kwebhodi eliwumgogodla, ukudluliswa kwesakhiwo se-PCB yangaphakathi, ukubhoboza ibhodi okuyisisekelo nokuhlola, ukucwiliswa kwebhodi, ukubhoboza, imbobo yodonga lwemvula yamakhemikhali yethusi. , ukudluliswa kwesakhiwo se-PCB yangaphandle, ukushumeka kwangaphandle kwe-PCB nezinye izinyathelo.
1, isakhiwo se-PCB
Isinyathelo sokuqala ekukhiqizweni kwe-PCB ukuhlela nokuhlola Isakhiwo se-PCB. Imboni yokukhiqiza ye-PCB ithola amafayela e-CAD enkampanini yokuklama ye-PCB, futhi njengoba isofthiwe ngayinye ye-CAD inefomethi yayo yefayela ehlukile, ifekthri ye-PCB iwahumushela kufomethi ehlanganisiwe - I-Extended Gerber RS-274X noma i-Gerber X2. Khona-ke unjiniyela wefekthri uzohlola ukuthi isakhiwo se-PCB siyahambisana yini nenqubo yokukhiqiza nokuthi ingabe kukhona ukukhubazeka nezinye izinkinga.
2, ukukhiqizwa kwepuleti eliwumgogodla
Hlanza ipuleti le-copper clad, uma kukhona uthuli, kungase kuholele kumjikelezo wokugcina wesifunda noma ikhefu.
I-PCB enezingqimba eziyisi-8: empeleni yenziwe ngamapuleti angu-3 ahlanganiswe ngethusi (amapuleti ayisisekelo) kanye namafilimu ethusi angu-2, bese ihlanganiswa namashidi enziwe kancane. Ukulandelana kokukhiqiza kuqala kusuka ku-core core plate (4 noma 5 izendlalelo zemigqa), futhi ihlale inqwabelene ndawonye bese iyalungiswa. Ukukhiqizwa kwe-PCB enezingqimba ezi-4 kuyafana, kodwa kusebenzisa kuphela ibhodi eliwumgogodla eli-1 namafilimu angu-2 ethusi.
3, ukudluliswa kwesakhiwo se-PCB sangaphakathi
Okokuqala, izingqimba ezimbili zebhodi eliphakathi kakhulu le-Core (Core) zenziwe. Ngemuva kokuhlanza, ipuleti ye-copper-clad imbozwe ifilimu ye-photosensitive. Ifilimu iyaqina lapho ivezwe ekukhanyeni, yenze ifilimu evikelayo phezu kwefoyili yethusi yepuleti eline-copper-clad.
Ifilimu ye-PCB enezingqimba ezimbili kanye ne-double-lad clad plate ekugcineni kufakwe kwifilimu yesakhiwo se-PCB esendlalelo esiphezulu ukuze kuqinisekiswe ukuthi izendlalelo ezingaphezulu nezingezansi zefilimu yesakhiwo se-PCB zistakwe ngokunembile.
Isensitizer ikhanyisa ifilimu ebucayi kucwecwe lethusi ngesibani se-UV. Ngaphansi kwefilimu esobala, ifilimu ebucayi iyelapheka, futhi ngaphansi kwefilimu e-opaque, akukabikho ifilimu ebucayi eselashiwe. Icwecwe lethusi elimbozwe ngaphansi kwefilimu eselashiwe ye-photosensitive umugqa wesakhiwo odingekayo we-PCB, olingana nendima kayinki wephrinta ye-laser ye-PCB eyenziwa ngesandla.
Khona-ke ifilimu ye-photosensitive enganakiwe ihlanzwa nge-lye, futhi umugqa we-foil yethusi odingekayo uzombozwa ifilimu ye-photosensitive eselashiwe.
I-foil yethusi engadingeki ibe isiqoshwa nge-alkali enamandla, njenge-NaOH.
Khipha ifilimu eselashiwe ye-photosensitive ukuze uveze ucwecwe lwethusi oludingekayo emigqeni yesakhiwo se-PCB.
4, core plate drilling kanye nokuhlolwa
I-core plate yenziwe ngempumelelo. Bese ubhoboza imbobo efanayo ku-core plate ukuze kube lula ukuqondanisa nezinye izinto zokusetshenziswa ngokulandelayo
Uma ibhodi eliwumgogodla selicindezelwe kanye nezinye izendlalelo ze-PCB, alikwazi ukuguqulwa, ngakho-ke ukuhlola kubaluleke kakhulu. Umshini uzoqhathanisa ngokuzenzakalela nemidwebo yesakhiwo se-PCB ukuze uhlole amaphutha.
5. Laminate
Lapha kudingeka impahla eluhlaza ebizwa ngokuthi i-semi-curing sheet, okuyi-adhesive phakathi kwebhodi eliwumgogodla kanye nebhodi eliwumgogodla (PCB layer number>4), kanye ne-core board ne-copper foil yangaphandle, futhi idlala indima. kwe-insulation.
Icwecwe lethusi elingaphansi kanye nezingqimba ezimbili zeshidi elapheliswe kancane kulungiswe ngembobo yokuqondisa kanye ne-iron plate engezansi kusengaphambili, bese i-core plate eyenziwe nayo ibekwe emgodini wokuqondanisa, futhi ekugcineni izingqimba ezimbili ze-semi-cured. ishidi, ungqimba lwe-foil yethusi kanye nongqimba lwepuleti le-aluminium elicindezelwe kumbozwa ku-core plate ngokulandelana.
Amabhodi e-PCB acindezelwa amapuleti ensimbi abekwa kubakaki, bese ethunyelwa emshinini wokunyathelisa oshisayo we-vacuum ukuze acwebezeliswe. Izinga lokushisa eliphezulu lomshini wokushisa we-vacuum lincibilikisa i-epoxy resin eshidini eliphulukisiwe kancane, libambe amapuleti ayisisekelo kanye ne-foil yethusi ndawonye ngaphansi kwengcindezi.
Ngemva kokuqedwa kwe-lamination, susa ipuleti lensimbi eliphezulu ucindezela i-PCB. Bese ipuleti le-aluminium elicindezelwe liyasuswa, bese ipuleti le-aluminium liphinde libe nesibopho sokuhlukanisa i-PCBS ehlukile nokuqinisekisa ukuthi ucwecwe lwethusi kungqimba lwangaphandle lwe-PCB lubushelelezi. Ngalesi sikhathi, izinhlangothi zombili ze-PCB ezikhishiwe zizombozwa ungqimba lwe-foil yethusi ebushelelezi.
6. Ukubhoboza
Ukuxhuma izingqimba ezine zefoyili yethusi engathinteki ku-PCB ndawonye, qala ubhoboze imbobo phezulu nangaphansi ukuze uvule i-PCB, bese ulungisa insimbi udonga lwembobo ukuze uhambise ugesi.
Umshini wokumba i-X-ray usetshenziselwa ukuthola ibhodi elingaphakathi elingaphakathi, futhi umshini uzothola ngokuzenzakalelayo futhi ubeke imbobo ebhodini eliwumgogodla, bese ubhoboza imbobo yokubeka ku-PCB ukuqinisekisa ukuthi ukubhola okulandelayo kudlula phakathi nendawo. umgodi.
Beka ungqimba lweshidi le-aluminium emshinini wokubhoboza bese ubeka i-PCB kuwo. Ukuze kuthuthukiswe ukusebenza kahle, amabhodi e-PCB angu-1 kuye kwangama-3 afanayo azobekwa ndawonye ukuze abhobozwe ngokwenani lezendlalelo ze-PCB. Ekugcineni, ungqimba lwepuleti le-aluminium limbozwa ku-PCB engaphezulu, futhi izendlalelo ezingaphezulu nezingaphansi zepuleti le-aluminium kwenzelwa ukuthi lapho i-drill bit ibhoboza futhi ibhoboza, ucwecwe lwethusi ku-PCB ngeke ludabuke.
Enqubweni yangaphambilini ye-lamination, i-epoxy resin encibilikisiwe yacindezelwa ngaphandle kwe-PCB, ngakho-ke yayidinga ukususwa. Umshini wokugaya iphrofayili usika i-periphery ye-PCB ngokuya ngezixhumanisi ezilungile ze-XY.
7. Imvula yamakhemikhali e-Copper odongeni lwama-pore
Njengoba cishe yonke imiklamo ye-PCB isebenzisa izimbobo ukuxhuma izingqimba ezihlukene zezintambo, ukuxhumana okuhle kudinga ifilimu yethusi engu-25 micron odongeni lwembobo. Lokhu ukushuba kwefilimu yethusi kudinga ukufezwa nge-electroplating, kodwa udonga lwembobo lwakhiwe nge-non-conductive epoxy resin kanye nebhodi le-fiberglass.
Ngakho-ke, isinyathelo sokuqala siwukuqongelela ungqimba lwezinto eziqhutshwayo odongeni lwembobo, bese wenza ifilimu yethusi engu-1 micron kuyo yonke indawo ye-PCB, kuhlanganise nodonga lwembobo, ngokufaka amakhemikhali. Yonke inqubo, njengokwelashwa kwamakhemikhali nokuhlanza, ilawulwa umshini.
I-PCB elungisiwe
Hlanza i-PCB
Ukuthumela i-PCB
8, ukudluliswa kwesakhiwo se-PCB sangaphandle
Okulandelayo, ukwakheka kwe-PCB yangaphandle kuzodluliselwa kucwecwe lwethusi, futhi inqubo iyafana nesimiso sangaphambilini sokudlulisa isakhiwo se-PCB esingaphakathi, okuwukusetshenziswa kwefilimu ekopishiwe nefilimu ebucayi ukuze kudluliselwe ukwakheka kwe-PCB kucwecwe lethusi, umehluko kuphela ukuthi ifilimu enhle izosetshenziswa njengebhodi.
Ukudluliswa kwesakhiwo se-PCB sangaphakathi kusebenzisa indlela yokukhipha, futhi ifilimu engalungile isetshenziswa njengebhodi. I-PCB imbozwe ifilimu yezithombe eqinile yomugqa, hlanza ifilimu yezithombe engaqinisekisiwe, ucwecwe lwethusi oluveziwe luyaqoshwa, umugqa wesakhiwo se-PCB uvikelwe ifilimu yezithombe eqinisiwe futhi kwesokunxele.
Ukudluliswa kwesakhiwo se-PCB sangaphandle kusebenzisa indlela evamile, futhi ifilimu enhle isetshenziswa njengebhodi. I-PCB imbozwe ifilimu eselashiwe ye-photosensitive yendawo engeyona yolayini. Ngemuva kokuhlanza ifilimu ye-photosensitive engaphulukisiwe, i-electroplating yenziwa. Lapho kukhona ifilimu, ayikwazi ukufakelwa i-electroplated, futhi lapho ingekho ifilimu, igcotshwa ngethusi bese kuba ithini. Ngemva kokuba ifilimu isusiwe, ukufakwa kwe-alkaline kwenziwa, futhi ekugcineni ithini liyasuswa. Iphethini yomugqa ishiywe ebhodini ngoba ivikelwe ithini.
Bamba i-PCB bese ufaka ithusi nge-electroplate kuyo. Njengoba kushiwo ngaphambili, ukuze kuqinisekiswe ukuthi imbobo ine-conductivity enhle ngokwanele, ifilimu yethusi efakwe odongeni lwembobo kufanele ibe nogqinsi lwama-microns angu-25, ngakho lonke uhlelo luzolawulwa ngokuzenzekelayo yikhompyutha ukuze kuqinisekiswe ukunemba kwalo.
9, ukushumeka kwangaphandle kwe-PCB
Inqubo yokufaka ibe isiqedwa ngepayipi elizenzakalelayo eliphelele. Okokuqala, ifilimu eselashiwe yezithombe ebhodini le-PCB iyahlanzwa. Bese igezwa nge-alkali eqinile ukuze kukhishwe ucwecwe lwethusi olungafuneki olumbozwe yilo. Bese ususa i-tin enamathela ku-PCB yesakhiwo se-copper foil enesixazululo se-detinning. Ngemva kokuhlanza, isakhiwo se-PCB enezingqimba ezi-4 siqedile.