Imibandela Nezincazelo Zemboni Ye-PCB– Ubuqotho Bamandla

Ubuqotho bamandla (PI)

Ukuqina Kwamandla, okubizwa ngokuthi i-PI, ukuqinisekisa ukuthi i-voltage kanye nendawo yamanje yomthombo wamandla nendawo okuyiwa kuyo kuyahlangabezana yini nezimfuneko. Ubuqotho bamandla buhlala bungenye yezinselelo ezinkulu ekwakhiweni kwe-PCB enesivinini esikhulu.

Izinga lobuqotho bamandla lihlanganisa izinga le-chip, izinga lokupakisha i-chip, izinga lebhodi lesifunda kanye nezinga lesistimu. Phakathi kwazo, ubuqotho bamandla ezingeni lebhodi lesifunda kufanele buhlangabezane nezidingo ezintathu ezilandelayo:

1. Yenza i-voltage ripple kuphini ye-chip ibe mncane kunencazelo (isibonelo, iphutha phakathi kwe-voltage no-1V lingaphansi kuka-+/ -50mv);

2. Lawula i-ground rebound (eyaziwa nangokuthi umsindo oshintshayo ovumelanayo we-SSN kanye nokuphumayo kokushintshashintsha kwe-SSO);

3, nciphisa ukuphazamiseka kuka-electromagnetic (EMI) futhi ugcine ukuhambisana kwe-electromagnetic (EMC) : inethiwekhi yokusabalalisa amandla (i-PDN) iyikhondakta enkulu kunazo zonke ebhodini lesekethe, ngakho futhi iyi-antenna elula kakhulu yokudlulisa nokwamukela umsindo.

 

 

Inkinga yobuqotho bamandla

Inkinga yobuqotho bokunikezwa kwamandla ibangelwa ngokuyinhloko ukuklama okungenangqondo kwe-decoupling capacitor, umthelela onzima wesekethe, ukuhlukaniswa okubi kokunikezwa kwamandla amaningi/indiza ephansi, ukwakheka okungenangqondo kokubunjwa kanye namandla angalingani. Ngokulingisa ubuqotho bamandla, lezi zinkinga zatholwa, bese izinkinga zobuqotho bamandla zaxazululwa ngezindlela ezilandelayo:

(1) ngokulungisa ububanzi bomugqa we-lamination we-PCB kanye nobukhulu bongqimba lwe-dielectric ukuze kuhlangatshezwane nezidingo ze-impedance yesici, ukulungisa isakhiwo se-lamination ukuze sihlangabezane nomgomo wokubuyela emuva okufushane komugqa wesiginali, ukulungisa ukuhlukaniswa kwamandla / indiza ephansi, ukugwema isenzakalo sokuhlukaniswa komugqa wesignali obalulekile;

(2) ukuhlaziywa kwe-impedance yamandla kwenzelwa ukunikezwa kwamandla okusetshenziselwa i-PCB, futhi i-capacitor yanezelwa ukulawula ukunikezwa kwamandla ngaphansi kwe-impedance ehlosiwe;

(3) engxenyeni enokuminyana okuphezulu kwamanje, lungisa indawo yocingo ukuze wenze umshini wamanje udlule endleleni ebanzi.

Ukuhlaziywa kobuqotho bamandla

Ekuhlaziyeni ubuqotho bamandla, izinhlobo zokulingisa eziyinhloko zifaka ukuhlaziywa kokwehla kwamandla kagesi e-dc, ukuhlaziywa kwe-decoupling nokuhlaziywa komsindo. Ukuhlaziywa kokwehla kwamandla kagesi e-Dc kufaka phakathi ukuhlaziywa kwezintambo eziyinkimbinkimbi kanye nokuma kwendiza ku-PCB futhi kungasetshenziswa ukunquma ukuthi mangakanani amandla ogesi azolahleka ngenxa yokumelana nethusi.

Ibonisa ukuminyana kwamanje kanye namagrafu wezinga lokushisa "wezindawo ezishisayo" ku-PI/ ukulingisa okuhlangene kwe-thermal

Ukuhlaziywa kwe-Decoupling ngokuvamile kuqhuba izinguquko kunani, uhlobo, kanye nenani lama-capacitor asetshenziswa ku-PDN. Ngakho-ke, kuyadingeka ukufaka i-parasitic inductance kanye nokumelana nemodeli ye-capacitor.

Uhlobo lokuhlaziya umsindo lungahluka. Angafaka umsindo ovela kumaphini wamandla e-IC asakazeka ebhodini lesekethe futhi angalawulwa ngama-decoupling capacitor. Ngokuhlaziywa komsindo, kungenzeka ukuphenya ukuthi umsindo uhlanganiswe kanjani usuka komunye umgodi uye kwenye, futhi kungenzeka ukuhlaziya umsindo wokushintsha okuvumelanisa.