Iphakheji e-Dual In-Line (DIP)
Iphakethe le-Dual-In-Line (Iphakethe le-DIP-mail-in-line), uhlobo lwephakheji lezakhi. Imigqa emibili ye-lead yathuthuka kusuka ohlangothini lwedivayisi futhi isema-engeli angakwesokudla kuya endizeni ehamba phambili emzimbeni wengxenye.
I-chip ekwamukela le ndlela yokufaka inemigqa emibili yezikhonkwane, engathengiswa ngqo kwisokhethi le-chip ngesakhiwo se-dip noma esisesimweni esifanayo senombolo efanayo ye-solder izimbobo ze-solder. Isici salo ukuthi singakuthola kalula i-Welding ye-Welding ye-PCB, futhi inokuhambisana okuhle nebhodi enkulu. Kodwa-ke, ngoba indawo yephakheji nobukhulu kukhulu, futhi izikhonkwane zilinyazwa kalula ngesikhathi senqubo ye-plug-in, ukuthembeka kumpofu. Ngasikhathi sinye, le ndlela yokupakisha ngokuvamile ayingeqi izikhonkwane eziyi-100 ngenxa yethonya lenqubo.
Amafomu we-DIP Package Adfords yile: I-Multilayer Ceramic Curamic Digh in-line dip, dip eyodwa ye-ceramic ceramic kabili umugqa, i-leadfrac yofreyimu ye-ceramic yokubopha, uhlobo lwesakhiwo sepulasitiki, uhlobo lwe-ceramic eliphansi lokuhlanganisa ingilazi).
Iphakheji elilodwa le-inthanethi (SIP)
Iphakethe elilodwa-in-line (iphakethe le-SIP-lingle-inline), indlela yephakheji yezakhi. Umugqa wokuhola okuqondile noma izikhonkwane ziphuma ohlangothini lwedivayisi.
Iphakethe elilodwa le-In-Line (SIP) liholela ohlangothini olulodwa lwephakheji futhi lihlele ngomugqa oqondile. Imvamisa, zingohlobo lwe-pay, kanti izikhonkwane zifakwa ezimbozweni zensimbi zebhodi yesekethe ephrintiwe. Lapho sihlangene ebhodini lesekethe ephrintiwe, iphakethe lime eceleni. Ukwehluka kwaleli fomu kuwukupha kwephakethe le-zigzag lingle-in-line (zip), izikhonkwane zalo zisaphuma kolunye uhlangothi lwephakeji, kepha zihlelwe ngephethini ye-zigzag. Ngale ndlela, ngaphakathi kobubanzi obude, ubuningi be-PIN kuyathuthuka. Ibanga lesikhungo sePIN livame ukuba ngu-2.54mm, futhi inani lezikhonkwane lisukela ku-2 kuye ku-23. Iningi lazo liyimikhiqizo eyenziwe ngezifiso. Ukwakheka kwephakeji kuyahluka. Amanye amaphakheji anesimo esifanayo ne-zip ebizwa nge-SIP.
Mayelana nokupakishwa
Ukupakisha kubhekisa ukuxhuma izikhonkwane zesekethe eSilicon chip kumalunga angaphandle anezintambo ezizoxhumana namanye amadivaysi. Ifomu lephakheji lisho izindlu zokubeka ama-semiconductor ahlanganisiwe ama-chip wesekethe. Akugcini nje ngokudlala indima yokubeka, ukulungisa, ukubekwa uphawu, ukuvikela ukusebenza kwe-chip kanye nokwenza ngcono izikhonkwane zegoboloji lephakethe ngezintambo ngoxhumana nabo kwi-chip, futhi lezi zinhlamvu zidlula izintambo ebhodini lesekethe ephrintiwe. Xhuma namanye amadivaysi ukubona ukuxhumana phakathi kwe-chip yangaphakathi kanye nomjikelezo wangaphandle. Ngoba i-chip kumele ihlukaniswe nomhlaba wangaphandle ukuvikela ukungcola emoyeni kusuka ekunciphiseni umjikelezo we-chip futhi kubangele ukonakala kukagesi.
Ngakolunye uhlangothi, i-chip ehlanganisiwe nayo kulula ukuyifaka nokuhambisa. Njengoba ikhwalithi yobuchwepheshe bokupakisha ithinta ngqo ukusebenza kwe-chip uqobo kanye nokwakhiwa kwe-PCB (i-PCPUIT BODE) exhunywe kuyo, kubaluleke kakhulu.
Njengamanje, ukupakisha kuhlukaniswe ikakhulukazi ukucwilisa amaphakheji we-Chip we-SMD.