Iphakeji elikulayini elikabili (DIP)

Iphakheji ye-Dual-in-line (i-DIP—iphakheji ye-dual-in-line), ifomu lephakheji lezingxenye. Imigqa emibili yokuhola isuka ohlangothini lwedivayisi futhi ikuma-engeli angakwesokudla ukuya endizeni ehambisana nomzimba wengxenye.

I-chip ethatha le ndlela yokupakisha inemigqa emibili yezikhonkwane, ezingathengiswa ngokuqondile kusokhethi se-chip ngesakhiwo se-DIP noma sidayiswe endaweni ye-solder enenombolo efanayo yezimbobo ze-solder. Isici sayo ukuthi ingabona kalula ukushiswa kwe-perforation yebhodi le-PCB, futhi inokuhambisana okuhle nebhodi elikhulu. Kodwa-ke, ngenxa yokuthi indawo yephakheji nokuqina kukhulu, futhi izikhonkwane zonakaliswa kalula phakathi nenqubo ye-plug-in, ukwethembeka akulungile. Ngesikhathi esifanayo, le ndlela yokupakisha ngokuvamile ayidluli izikhonkwane eziyi-100 ngenxa yethonya lenqubo.
Amafomu esakhiwo sephakeji ye-DIP yilawa: i-multilayer ceramic ephindwe kabili emgqeni we-DIP, i-ceramic yongqimba olulodwa ephindwe kabili emgqeni we-DIP, i-DIP yohlaka oluholayo (okuhlanganisa uhlobo lokuvala uphawu lwengilazi yobumba, uhlobo lwesakhiwo se-plastic encapsulation, uhlobo lwe-ceramic encibilika kancane lwamaphakheji).

Iphakheji yomugqa owodwa (SIP)

Iphakheji yomugqa owodwa (i-SIP—iphakheji yomugqa owodwa), uhlobo lwephakheji lezingxenye. Umugqa womkhondo oqondile noma izikhonkwane ziphuma ohlangothini lwedivayisi.

I-single in-line package (SIP) iphuma ohlangothini olulodwa lwephakheji futhi iwahlele ngendlela eqondile. Ngokuvamile, ziwuhlobo lwe- through-hole, futhi izikhonkwane zifakwa emigodini yensimbi yebhodi lesifunda eliphrintiwe. Uma ihlanganiswe ebhodini lesifunda eliphrintiwe, iphakheji i-side-standing. Ukwehluka kwaleli fomu uhlobo olumazombezombe lwephakheji yomugqa owodwa (i-ZIP), izikhonkwane zazo ezisaphumela ohlangothini olulodwa lwephakheji, kodwa zihlelwe ngephethini egosozi. Ngale ndlela, phakathi kwebanga lobude obunikeziwe, ukuminyana kwephini kuyathuthukiswa. Ibanga lesikhungo sephini livamise ukuba ngu-2.54mm, kanti inani lamaphini lisuka ku-2 liye ku-23. Iningi lawo yimikhiqizo eyenziwe ngokwezifiso. Umumo wephakheji uyahlukahluka. Amanye amaphakheji anomumo ofanayo ne-ZIP abizwa nge-SIP.

Mayelana nokupakisha

Ukupakisha kubhekisela ekuxhumaniseni izikhonkwane zesekethe ku-silicon chip emajoyini angaphandle ngezintambo ukuze zixhumane namanye amadivaysi. Ifomu lephakheji libhekisela endlini yokufaka ama-chips esekethe ahlanganisiwe we-semiconductor. Ayidlali nje indima yokufaka, ukulungisa, ukuvala, ukuvikela i-chip nokuthuthukisa ukusebenza kwe-electrothermal, kodwa futhi ixhuma nezikhonkwane zegobolondo lephakheji ngezintambo ngokusebenzisa othintana nabo ku-chip, futhi lezi zikhonkwane zidlulisa izintambo kokuphrintiwe. ibhodi lesifunda. Xhuma namanye amadivaysi ukuze ubone ukuxhumana phakathi kwe-chip yangaphakathi nesekethe yangaphandle. Ngoba i-chip kufanele ihlukaniswe nezwe langaphandle ukuze kuvinjelwe ukungcola okusemoyeni ukuthi kungagqwali isekethe ye-chip futhi kubangele ukuwohloka kokusebenza kukagesi.
Ngakolunye uhlangothi, i-chip ehlanganisiwe kulula futhi ukuyifaka nokuthutha. Njengoba ikhwalithi yobuchwepheshe bokupakisha nayo ithinta ngokuqondile ukusebenza kwe-chip ngokwayo kanye nokuklama nokukhiqizwa kwe-PCB (ibhodi lesifunda eliphrintiwe) elixhunywe kuyo, kubaluleke kakhulu.

Njengamanje, ukupakishwa kuhlukaniswe kakhulu nge-DIP dual in-line kanye ne-SMD chip package.