Ngo-2023, inani lemboni ye-PCB yomhlaba wonke ngamadola aseMelika lehla ngo-15.0% unyaka nonyaka.
Esikhathini esimaphakathi nesikhathi eside, imboni izogcina ukukhula okuzinzile.Izinga lokukhula elilinganiselwe lonyaka lokuphuma kwe-PCB emhlabeni wonke kusukela ngo-2023 kuya ku-2028 lingama-5.4%.Ngokombono wesifunda, imboni ye-#PCB kuzo zonke izifunda zomhlaba ibonise ukukhula okuqhubekayo.Ngokombono wesakhiwo somkhiqizo, i-substrate yokupakisha, ibhodi elinezingqimba eziningi eziphezulu elinezendlalelo ezingu-18 nangaphezulu, kanye nebhodi le-HDI lizogcina izinga lokukhula eliphakeme uma kuqhathaniswa, futhi izinga lokukhula okuyinhlanganisela eminyakeni emihlanu ezayo lizoba ngu-8.8%, 7.8% , kanye no-6.2%, ngokulandelana.
Okokufaka imikhiqizo ye-substrate, ngakolunye uhlangothi, ubuhlakani bokwenziwa, ikhompuyutha yamafu, ukushayela okuhlakaniphile, i-inthanethi yakho konke kanye neminye imikhiqizo ukuthuthukiswa kobuchwepheshe kanye nokunwetshwa kwesimo sohlelo lokusebenza, ukushayela imboni ye-elekthronikhi kuma-chips aphezulu kanye nokukhula kwesidingo sokupakisha okuthuthukisiwe, ngaleyo ndlela kushayela imboni yomhlaba wonke ye-substrate yokupakisha ukugcina ukukhula kwesikhathi eside.Ikakhulukazi, ikhuthaze izinga eliphezulu lemikhiqizo ye-substrate yokupakisha esetshenziswa emandleni aphezulu ekhompiyutha, ukuhlanganiswa nezinye izimo ukukhombisa ukuthambekela kokukhula okuphezulu.Ngakolunye uhlangothi, ukwenyuka kwasekhaya ekusekelweni kokuthuthukiswa kwemboni ye-semiconductor, kanye nokwenyuka kokutshalwa kwezimali okuhlobene kuzoqhubekisela phambili ukusheshisa ukuthuthukiswa kwemboni yasekhaya ye-substrate yokupakisha.Esikhathini esifushane, njengoba uhlu lwabakhiqizi abagcina besebenzisa isemiconductor kancane kancane lubuyela emazingeni ajwayelekile, iWorld Semiconductor Trade Statistics Organisation (kamuva ebizwa ngokuthi “WSTS”) ilindele ukuthi imakethe yomhlaba wonke ye-semiconductor izokhula ngo-13.1% ngo-2024.
Emikhiqizweni ye-PCB, izimakethe ezifana neseva nokugcinwa kwedatha, ukuxhumana, amandla amasha nokushayela okukhaliphile, kanye nogesi wabathengi kuzoqhubeka nokuba yizisusa ezibalulekile zokukhula kwembonini.Ngokombono wamafu, ngokuthuthuka okusheshayo kobuhlakani bokwenziwa, isidingo semboni ye-ICT samandla ekhompyutha aphezulu kanye namanethiwekhi anesivinini esikhulu siya ngokuya siphuthuma, okuqhubeza ukukhula okusheshayo kwesidingo sosayizi omkhulu, izinga eliphezulu, imvamisa ephezulu kanye enesivinini esikhulu, izinga eliphezulu le-HDI, kanye nemikhiqizo ye-PCB eshisa kakhulu.Kusukela endaweni yokubuka, nge-AI kumakhalekhukhwini, i-PCS, i-smart wear, i-IOT nokunye ukukhiqiza
Ngokuqhubeka nokujula kokusetshenziswa kwemikhiqizo, isidingo samakhono ekhompuyutha asemaphethelweni kanye nokushintshisana kwedatha okunesivinini esikhulu nokudluliswa kwezinhlelo zokusebenza ezihlukene zamatheminali kuye kwaletha ukukhula okukhulu.Iqhutshwa yilo mkhuba ongenhla, isidingo semvamisa ephezulu, isivinini esikhulu, ukuhlanganiswa, ukwenza okuncane, okuncanyana nokukhanya, ukuchithwa kokushisa okuphezulu neminye imikhiqizo ye-PCB ehlobene yemishini ye-elekthronikhi esibulalayo siyaqhubeka sikhula.