Ukuze sithuthukise i-PCB ngokushesha okukhulu, asikwazi ukwenza ngaphandle kokufunda nokudweba izifundo, ngakho-ke ibhodi lokukopisha le-PCB lazalwa. Ukulingisa umkhiqizo we-elekthronikhi kanye nokwenza i-cloning kuyinqubo yokukopisha amabhodi esekethe.
1.Uma sithola i-pcb edinga ukukopishwa, qala ngokuqopha imodeli, amapharamitha, nendawo yazo zonke izingxenye ephepheni. Ukunakwa okukhethekile kufanele kukhokhwe ekuqondeni kwe-diode, i-transistor, kanye nesiqondiso se-IC trap. Kungcono ukurekhoda indawo yezingxenye ezibalulekile ngezithombe.
2. Susa zonke izingxenye bese ukhipha ithini emgodini we-PAD. Hlanza i-PCB ngotshwala bese uyifaka kusithwebuli. Lapho siskena, isithwebuli sidinga ukuphakamisa amaphikseli okuskena kancane ukuze sithole isithombe esicacile. Qala i-POHTOSHOP, shanela isikrini ngombala, londoloza ifayela bese uliphrinta ukuze ulisebenzise kamuva.
3. Gcoba kancane uLEYA ESIPHEZULU KANYE NOWENKO OSEZANSI ngephepha lentambo kwifilimu yethusi Ecwebezelayo. Ngena kusikena, vula i-PHOTOSHOP, bese ushanela isendlalelo ngasinye ngombala.
4.Lungisa umehluko nokukhanya kwekhanvasi ukuze izingxenye ezinefilimu yethusi nezingxenye ezingenayo ifilimu yethusi zihluke kakhulu. Bese uvula i-subgraph emnyama nokumhlophe ukuze uhlole ukuthi imigqa icacile. Londoloza imephu njengamafayela efomethi ye-BMP emnyama nokumhlophe TOP.BMP kanye ne-BOT.BMP.
5.Guqula amafayela amabili e-BMP abe amafayela angu-PROTEL ngokulandelana, bese ungenisa izendlalelo ezimbili ku-PROTEL. Uma izikhundla zezingqimba ezimbili ze-PAD ne-VIA zihambisana ngokuyisisekelo, kubonisa ukuthi izinyathelo zangaphambilini zenziwe kahle, uma kukhona ukuphambuka, phinda isinyathelo sesithathu.
6.Guqula i-BMP ye-TOP layer ibe phezulu.PCB, qaphela ukuguqulwa kwesendlalelo se-SILK, landelela umugqa ku-TOP layer, bese ubeka idivayisi ngokusho komdwebo wesinyathelo sesibili. Susa isendlalelo se-SILK uma usuqedile.
7.Ku-PROTEL, i-TOP.PCB ne-BOT.PCB zingenisiwe futhi zihlanganiswe zibe idayagramu eyodwa.
8.Sebenzisa iphrinta ye-laser ukuze uphrinte I-TOP LAYER kanye ne-BOTTOM LAYER ngokulandelanayo kwifilimu ebonisa ngale (isilinganiso esingu-1:1), beka ifilimu ku-PCB, qhathanisa ukuthi ayilungile yini, uma ilungile, iphelile.