Ukuthuthukiswa kwe-PCB akunakuhlukaniswa nokulangazelela kwabantu impilo engcono. Kusukela kumsakazo wokuqala kuya kumabhodi omama wekhompuyutha anamuhla kanye nesidingo samandla ekhompiyutha ye-AI, ukunemba kwe-PCB kuye kwathuthukiswa ngokuqhubekayo.
Ukuze sithuthukise i-PCB ngokushesha okukhulu, asikwazi ukwenza ngaphandle kokufunda nokuboleka. Ngakho-ke, ibhodi lokukopisha le-PCB lazalwa. Ukukopisha kwe-PCB, ukukopisha kwebhodi lesifunda, ukuhlanganisa ibhodi lesifunda, ukulingisa umkhiqizo we-elekthronikhi, ukuhlanganisa umkhiqizo we-elekthronikhi, njll., empeleni kuyinqubo yokuphindaphinda kwebhodi lesifunda. Ziningi izindlela zokukopisha i-PCB kanye nenani elikhulu lesofthiwe yebhodi lokukopisha le-PCB esheshayo.
Namuhla, ake sikhulume ngebhodi lokukopisha le-PCB futhi iyiphi isofthiwe yebhodi lekhophi etholakalayo?
Isofthiwe yebhodi lokukopisha le-PCB?
Isofthiwe yebhodi lokukopisha le-PCB 1: BMP2PCB. Isofthiwe yebhodi yokukopisha yokuqala empeleni iyisofthiwe nje yokuguqula i-BMP ibe yi-PCB futhi manje isisusiwe!
PCB ikhophi ibhodi software 2: QuickPcb2005. Kuyisofthiwe yebhodi lokukopisha elisekela izithombe ezinemibala futhi linenguqulo eqhekekile.
Isofthiwe yebhodi yokukopisha esheshayo ye-PCB 3: CBR
Isofthiwe yebhodi yokukopisha esheshayo ye-PCB 4: PMPCB
Ungakopisha kanjani i-PCB nenqubo enemininingwane?
Isinyathelo sokuqala, lapho uthola i-PCB, qala ngokuqopha amamodeli, amapharamitha, kanye nokuma kwazo zonke izingxenye ephepheni, ikakhulukazi izikhombisi-ndlela zama-diode, ama-transistors, namanotshi ama-IC. Kungcono ukuthatha izithombe ezimbili zezindawo zengxenye ngekhamera yedijithali.
Isinyathelo sesibili, susa zonke izingxenye bese ukhipha ithini emigodini ye-PAD. Hlanza i-PCB ngotshwala, bese uwufaka kusithwebuli. Lapho siskena, isithwebuli sidinga ukwandisa kancane amaphikseli askeniwe ukuze sithole isithombe esicacile. Qala i-POHTOSHOP, skena indawo yesikrini sikasilika ngemodi yombala, londoloza ifayela bese uliphrinte ukuze wenze ikhophi yasenqolobaneni.
Isinyathelo sesithathu, sebenzisa i-sandpaper yamanzi ukupholisha kancane I-TOP LAYER kanye ne-BOTTOM LAYER kuze kube yilapho ifilimu yethusi ikhanya. Yifake kusikena, qala i-PHOTOSHOP, bese uskena izendlalelo ezimbili ngokuhlukene kwimodi yombala. Qaphela ukuthi i-PCB kufanele ibekwe ngokuvundlile nangokuqondile kusikena, ngaphandle kwalokho isithombe esiskeniwe ngeke sisetshenziswe, bese ulondoloza ifayela.
Isinyathelo sesine, lungisa ukugqama nokukhanya kwekhanvasi ukuze wenze izingxenye ezinefilimu yethusi nezingxenye ezingenakho ifilimu yethusi zihluke kakhulu. Bese uguqula lesi sithombe sibe mnyama nokumhlophe, bese uhlola ukuthi imigqa icacile yini. Uma kungacacile, phinda lesi sinyathelo. Uma kucacile, gcina isithombe njengamafayela efomethi ye-BMP emnyama nokumhlophe TOP.BMP kanye ne-BOT.BMP. Uma kukhona izinkinga ngezithombe, zingaphinda zilungiswe futhi zilungiswe kusetshenziswa i-PHOTOSHOP.
Isinyathelo sesihlanu, guqula amafayela amabili efomethi ye-BMP abe amafayela efomethi ye-PROTEL ngokulandelanayo. Layisha izendlalelo ezimbili ku-PROTEL. Uma izikhundla ze-PAD ne-VIA zezendlalelo ezimbili ngokuyisisekelo zidlulana, kubonisa ukuthi izinyathelo zangaphambilini zenziwe kahle. Uma kukhona ukuchezuka, phinda isinyathelo sesithathu.
Isinyathelo sokuqala, lapho uthola i-PCB, qala ngokuqopha amamodeli, amapharamitha, kanye nokuma kwazo zonke izingxenye ephepheni, ikakhulukazi izikhombisi-ndlela zama-diode, ama-transistors, namanotshi ama-IC. Kungcono ukuthatha izithombe ezimbili zezindawo zengxenye ngekhamera yedijithali.
Isinyathelo sesibili, susa zonke izingxenye bese ukhipha ithini emigodini ye-PAD. Hlanza i-PCB ngotshwala, bese uwufaka kusithwebuli. Lapho siskena, isithwebuli sidinga ukwandisa kancane amaphikseli askeniwe ukuze sithole isithombe esicacile. Qala i-POHTOSHOP, skena indawo yesikrini sikasilika ngemodi yombala, londoloza ifayela bese uliphrinte ukuze wenze ikhophi yasenqolobaneni.
Isinyathelo sesithathu, sebenzisa i-sandpaper yamanzi ukupholisha kancane I-TOP LAYER kanye ne-BOTTOM LAYER kuze kube yilapho ifilimu yethusi ikhanya. Yifake kusikena, qala i-PHOTOSHOP, bese uskena izendlalelo ezimbili ngokuhlukene kwimodi yombala. Qaphela ukuthi i-PCB kufanele ibekwe ngokuvundlile nangokuqondile kusikena, ngaphandle kwalokho isithombe esiskeniwe ngeke sisetshenziswe, bese ulondoloza ifayela.
Isinyathelo sesine, lungisa ukugqama nokukhanya kwekhanvasi ukuze wenze izingxenye ezinefilimu yethusi nezingxenye ezingenakho ifilimu yethusi zihluke kakhulu. Bese uguqula lesi sithombe sibe mnyama nokumhlophe, bese uhlola ukuthi imigqa icacile yini. Uma kungacacile, phinda lesi sinyathelo. Uma kucacile, gcina isithombe njengamafayela efomethi ye-BMP emnyama nokumhlophe TOP.BMP kanye ne-BOT.BMP. Uma kukhona izinkinga ngezithombe, zingaphinda zilungiswe futhi zilungiswe kusetshenziswa i-PHOTOSHOP.
Isinyathelo sesihlanu, guqula amafayela amabili efomethi ye-BMP abe amafayela efomethi ye-PROTEL ngokulandelanayo. Layisha izendlalelo ezimbili ku-PROTEL. Uma izikhundla ze-PAD ne-VIA zezendlalelo ezimbili ngokuyisisekelo zidlulana, kubonisa ukuthi izinyathelo zangaphambilini zenziwe kahle. Uma kukhona ukuchezuka, phinda isinyathelo sesithathu.
Isinyathelo sesithupha, guqula i-BMP ye-TOP layer ibe TOP.PCB. Qaphela ukuthi idinga ukuguqulelwa kusendlalelo se-SILK, okuyisendlalelo esiphuzi. Bese udweba imigqa ku-TOP bese ubeka izingxenye ngokomdwebo esinyathelweni sesibili. Ngemva kokudweba, susa isendlalelo se-SILK.
Isinyathelo sesithupha, guqula i-BMP ye-TOP layer ibe TOP.PCB. Qaphela ukuthi idinga ukuguqulelwa kusendlalelo se-SILK, okuyisendlalelo esiphuzi. Bese udweba imigqa ku-TOP bese ubeka izingxenye ngokomdwebo esinyathelweni sesibili. Ngemva kokudweba, susa isendlalelo se-SILK.
Isinyathelo sesikhombisa, guqula i-BMP yesendlalelo se-BOT ibe yi-BOT.PCB. Qaphela ukuthi idinga ukuguqulelwa kusendlalelo se-SILK, okuyisendlalelo esiphuzi. Bese udweba imigqa kusendlalelo se-BOT. Ngemva kokudweba, susa isendlalelo se-SILK.
Isinyathelo sesishiyagalombili, layisha i-TOP.PCB ne-BOT.PCB ku-PROTEL futhi uzihlanganise zibe idayagramu eyodwa, futhi yilokho.
Isinyathelo sesishiyagalolunye, phrinta I-TOP LAYER kanye NE-BOTTOM LAYER efilimini ebonisa ngale ngephrinta ye-laser (isilinganiso esingu-1:1), beka ifilimu kuleyo PCB, qhathanisa ukuze ubone ukuthi akhona yini amaphutha. Uma kungekho amaphutha, uphumelele.