Ukuhlukaniswa kwe-PCB, uyazi ukuthi zingaki izinhlobo

Ngokusho kwesakhiwo somkhiqizo, ingahlukaniswa ibhodi eliqinile (ibhodi eliqinile), ibhodi eliguquguqukayo (ibhodi elithambile), ibhodi elihlangene eliqinile elihlangene, ibhodi le-HDI kanye ne-substrate yephakheji.Ngokuya ngenani lokuhlukaniswa kwezingqimba zomugqa, i-PCB ingahlukaniswa ibe iphaneli eyodwa, iphaneli ephindwe kabili kanye nebhodi lezendlalelo eziningi.

Ipuleti eliqinile

Izici zomkhiqizo: Yenziwe nge-substrate eqinile okungelula ukugoba futhi inamandla athile.Inokumelana nokugoba futhi inganikeza ukusekelwa okuthile kwezingxenye ze-elekthronikhi ezinamathiselwe kuyo.I-substrate eqinile ihlanganisa i-glass fiber cloth substrate, i-substrate yephepha, i-composite substrate, i-ceramic substrate, i-substrate yensimbi, i-thermoplastic substrate, njll.

Izicelo: Ikhompuyutha kanye nemishini yenethiwekhi, okokusebenza kwezokuxhumana, ukulawulwa kwezimboni kanye nezokwelapha, ugesi wabathengi kanye nogesi wezimoto.

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Ipuleti eliguquguqukayo

Izici zomkhiqizo: Kubhekiselwa ebhodini lesifunda eliphrintiwe elenziwe nge-flexible insulating substrate.Ingagotshwa ngokukhululekile, ilimele, igoqwe, ihlelwe ngokunganaki ngokuvumelana nezidingo zesakhiwo sendawo, futhi ihanjiswe ngokungafanele futhi yandiswe endaweni enezinhlangothi ezintathu.Ngakho-ke, ukuhlanganiswa kwengxenye nokuxhumeka kwentambo kungahlanganiswa.

Izicelo: amafoni ahlakaniphile, amakhompyutha aphathekayo, amaphilisi nezinye izinto zikagesi eziphathwayo.

I-Rigid torsion bonding plate

Izici zomkhiqizo: ibhekisela ebhodini lesifunda eliphrintiwe eliqukethe indawo eyodwa noma ngaphezulu eqinile kanye nezindawo eziguquguqukayo, ungqimba oluncane lwebhodi lesifunda eliphrintiwe eliphrintiwe eliphansi kanye nebhodi lesifunda eliphrintiwe eliqinile eliphansi elihlangene lamination.Inzuzo yayo ukuthi inganikeza indima yokusekela yepuleti eliqinile, kodwa futhi inezici zokugoba zepuleti eguquguqukayo, futhi ingahlangabezana nezidingo zomhlangano we-three-dimensional.

Izicelo: Imishini yezokwelapha esezingeni eliphezulu, amakhamera aphathwayo kanye nemishini yekhompyutha esongwayo.

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Ibhodi le-HDI

Izici zomkhiqizo: High Density Interconnect isifinyezo, okungukuthi, high density interconnect ubuchwepheshe, kuyinto ephrintiwe wesifunda ibhodi ubuchwepheshe.Ibhodi le-HDI ngokuvamile likhiqizwa ngendlela yokubeka izingqimba, futhi ubuchwepheshe bokumba nge-laser busetshenziselwa ukubhoboza izimbobo ekubekweni, ukuze lonke ibhodi lesifunda eliphrintiwe lenze ukuxhumana kwe-interlayer enezimbobo ezigqitshiwe nezingaboni njengemodi yokuqhuba eyinhloko.Uma kuqhathaniswa nebhodi eliphrintiwe le-multi-layer lendabuko, ibhodi le-HDI lingathuthukisa ukuminyana kwezintambo zebhodi, okuhambisana nokusetshenziswa kobuchwepheshe bokupakisha obuphambili.Izinga lokukhipha isignali lingathuthukiswa;Kungenza futhi imikhiqizo ye-elekthronikhi iminyene futhi ibe lula ngokubukeka.

Isicelo: Ikakhulukazi emkhakheni wama-elekthronikhi wabathengi anesidingo esikhulu sokuminyana, isetshenziswa kakhulu kumakhalekhukhwini, amakhompyutha we-notebook, i-automotive electronics neminye imikhiqizo yedijithali, phakathi kwayo omakhalekhukhwini isetshenziswa kakhulu.Njengamanje, imikhiqizo yezokuxhumana, imikhiqizo yenethiwekhi, imikhiqizo yeseva, imikhiqizo yezimoto kanye nemikhiqizo ye-aerospace isetshenziswa kubuchwepheshe be-HDI.

I-substrate yephakheji

Izici zomkhiqizo: okungukuthi, ipuleti lokulayisha uphawu lwe-IC, elisetshenziswa ngokuqondile ukuthwala i-chip, lingahlinzeka ngoxhumano lukagesi, ukuvikelwa, ukusekelwa, ukushabalalisa ukushisa, ukuhlanganisa neminye imisebenzi ye-chip, ukuze kuzuzwe amaphini amaningi, ukunciphisa usayizi womkhiqizo wephakeji, thuthukisa ukusebenza kukagesi nokunqanyulwa kokushisa, ukuminyana okuphezulu kakhulu noma inhloso ye-multi-chip modularization.

Inkambu yohlelo lokusebenza: Emkhakheni wemikhiqizo yezokuxhumana ephathwayo efana nama-smart phones nama-tablet, ama-substrates okupakisha asetshenziswe kabanzi.Njengama-memory chips okugcinwa kuwo, i-MEMS yokuzwa, amamojula e-RF okuhlonza i-RF, ama-processor chips namanye amadivaysi kufanele asebenzise ama-packaging substrates.I-substrate yephakheji yokuxhumana enesivinini esiphezulu isetshenziswe kakhulu ku-broadband yedatha nakweminye imikhakha.

Uhlobo lwesibili luhlukaniswa ngokwenani lezingqimba zomugqa.Ngokuya ngenani lokuhlukaniswa kwezingqimba zomugqa, i-PCB ingahlukaniswa ibe iphaneli eyodwa, iphaneli ephindwe kabili kanye nebhodi lezendlalelo eziningi.

Iphaneli eyodwa

Amabhodi Anohlangothi Olulodwa (Amabhodi anohlangothi olulodwa) Ku-PCB eyisisekelo kakhulu, izingxenye zigxilwe ngakolunye uhlangothi, ucingo lugxilwe ngakolunye uhlangothi (kunengxenye yesichibi futhi ucingo luhlangothini olufanayo, futhi ipulaki- kudivayisi kolunye uhlangothi).Ngoba ucingo luvela ohlangothini olulodwa kuphela, le PCB ibizwa nge-Single-sided.Ngenxa yokuthi iphaneli elilodwa linemikhawulo eminingi eqinile kumjikelezo wokuklama (ngoba kukhona uhlangothi olulodwa kuphela, i-wiring ayikwazi ukuwela futhi kufanele ihambe ngendlela ehlukile), ama-circuits okuqala kuphela asebenzisa amabhodi anjalo.

Iphaneli ekabili

Amabhodi anezinhlangothi ezimbili anezintambo ezinhlangothini zombili, kodwa ukusebenzisa izintambo nhlangothi zombili, kufanele kube nokuxhumana kwesifunda okufanele phakathi kwezinhlangothi ezimbili.Leli “bhuloho” eliphakathi kwamasekhethi libizwa ngokuthi i-pilot hole (via).Imbobo yokushayela imbobo encane egcwele noma embozwe ngensimbi ku-PCB, engaxhunywa ngezintambo nhlangothi zombili.Ngenxa yokuthi indawo yephaneli ephindwe kabili inkulu ngokuphindwe kabili kunaleyo yephaneli eyodwa, iphaneli ephindwe kabili ixazulula ubunzima bokuphuma kwezintambo kuphaneli eyodwa (ingadluliswa ngembobo ngakolunye uhlangothi), futhi ingaphezulu. ilungele ukusetshenziswa kumasekethe ayinkimbinkimbi kunephaneli eyodwa.

Amabhodi Ezendlalelo Eziningi Ukuze kwandiswe indawo engafakwa izintambo, amabhodi anezingqimba eziningi asebenzisa amabhodi ezintambo anezinhlangothi ezimbili ezengeziwe.

Ibhodi lesifunda eliphrintiwe elinesendlalelo sangaphakathi esinezinhlangothi ezimbili, ungqimba lwangaphandle olunohlangothi olulodwa noma ungqimba lwangaphakathi olunohlangothi olukabili, ungqimba lwangaphandle olunohlangothi olulodwa, ngohlelo lokuma kanye nezinto zokuhlanganisa ezivikelayo ngokushintshana ndawonye futhi ihluzo eziqhutshwayo zixhumene ngokuvumelana. ezidingweni zokuklama zebhodi lesifunda eliphrintiwe liba yibhodi lesifunda elinezingqimba ezine, elinezingqimba eziyisithupha, elaziwa nangokuthi ibhodi lesifunda eliphrintiwe elinezingqimba eziningi.

Inani lezingqimba zebhodi akusho ukuthi kunezingqimba eziningana ezizimele zezintambo, futhi ezimweni ezikhethekile, izingqimba ezingenalutho zizongezwa ukulawula ubukhulu bebhodi, ngokuvamile inani lezendlalelo lilingana, futhi liqukethe izingqimba ezimbili ezingaphandle. .Iningi lebhodi lokusingatha liwuhlaka lwezingqimba ezi-4 kuye kweziyisi-8, kodwa ngokobuchwepheshe kungenzeka ukuzuza izendlalelo ezicishe zibe yi-100 zebhodi le-PCB.Iningi lamakhompiyutha amakhulu amakhulu asebenzisa uhlaka oluyinhloko lwezendlalelo eziningi, kodwa njengoba lawo makhompyutha angathathelwa indawo ngamaqoqo amakhompyutha amaningi ajwayelekile, amabhodi anezingqimba eziningi awasasetshenziswa.Ngenxa yokuthi izingqimba eziku-PCB zihlanganiswe eduze, ngokuvamile akulula ukubona inombolo yangempela, kodwa uma ubhekisisa ibhodi lokusingatha, lisengabonakala.