Inqubo eyisisekelo yeIBHODI LOKUQHAWULA KWEPCBIdizayini ekucutshungweni kwe-SMT Chip idinga ukunakwa okukhethekile. Enye yezinhloso eziphambili ze-Circuit Schematic Design ukuhlinzeka ngethebula lenethiwekhi ye-PCB Circuit Board Design kanye nokulungiselela isisekelo sedizayini yebhodi le-PCB. Inqubo yokuqamba yebhodi yesifunda ye-Multi-Laler PCB ngokuyisisekelo njengezinyathelo zokuklama zebhodi le-PCB elijwayelekile. Umehluko ukuthi i-wiring ye-intermediate yesiginali yesendlalelo kanye nokwahlukaniswa kwesendlalelo sangaphakathi sikagesi kudinga ukwenziwa. Kuhlanganiswe ndawonye, ukwakheka kweBhodi yePCPB ye-Multi-Laner PCB ngokufanayo kuyafana. Ihlukaniswe ngezinyathelo ezilandelayo:
1 Amabhodi.
2 Ukusetha okulungile nokunengqondo kwemingcele yemvelo ye-PCB kungaletha lula ukuklama i-Circuit Board Design futhi kuthuthukise ukusebenza kahle komsebenzi.
3. Isakhiwo sezakhi nokulungiswa. Ngemuva kokuthi umsebenzi wokuqala usuqediwe, ithebula lenethiwekhi lingangeniswa kwi-PCB, noma itafula lenethiwekhi lingangeniswa ngqo kumdwebo we-schematic ngokuvuselela i-PCB. Ukuhlelwa kwengxenye nokulungiswa kwemisebenzi ebaluleke kakhulu ekwakhiweni kwe-PCB, okuthinta ngqo imisebenzi elandelayo efana ne-wiring kanye ne-wangaphakathi ungqimba wesendlalelo sikagesi sangaphakathi.
I-4. Izilungiselelo zomthetho we-wiring zibeka imininingwane ehlukahlukene ye-circuit wiring, njengobubanzi be-wire, ukuhlukaniswa komugqa ofanayo, ibanga lokuphepha phakathi kwezintambo namaphilisi, nangosayizi. Akunandaba noma iyiphi indlela ye-wiring eyamukelwa, imithetho ye-wiring iyadingeka. Isinyathelo esisemqoka, imithetho emihle ye-wiring ingaqinisekisa ukuphepha kwendlela yokuhamba ebhodini, ihambisane nezidingo zenqubo yokukhiqiza, futhi igcine izindleko.
5 Lawa mafayela angasetshenziswa ukuhlola futhi aguqule amabhodi wesifunda ye-PCB, futhi angasetshenziswa njengohlu lwezinto ezithengiwe.
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Imithetho Yokuhambisa Ingxenye
1. Akukho mping evunyelwe ngaphakathi kwendawo ≤1mm kusukela emaphethelweni eBogb Board nangaphakathi kwe-1mm ezungeze umgodi okhuphukayo;
2. Umugqa wamandla kufanele ube kabanzi ngangokunokwenzeka futhi akufanele ube ngaphansi kwe-18mil; Ububanzi bomugqa wesiginali akufanele bube ngaphansi kwe-12mil; I-CPU ukufaka kanye nemigqa yokuphuma akufanele ibe ngaphansi kwe-10mil (noma i-8mil); Ukuhlukaniswa komugqa akufanele kube ngaphansi kwe-10mil;
I-3. Izimbobo ezijwayelekile zingezingaphansi kuka-30mil;
4. I-plug embaxambili: Pad 60mil, i-aperture 40mil; 1 / 4W ukumelana: 51 * 55mil (0805 Surface Mount); lapho ixhunyiwe, pad 62mil, i-aperture 42mil; I-Capacitor ye-electroderalless: 51 * 55mil (0805 super Mount); Lapho ifakwe ngqo, i-pad ingama-50mil kanye ne-mbombo yobubanzi kungama-28mil;
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