Inqubo eyisisekelo yeIbhodi lesifunda le-PCBukuklama ekusetshenzisweni kwe-chip ye-SMT kudinga ukunakwa okukhethekile. Enye yezinjongo eziyinhloko zomklamo wohlelo lwesekethe ukuhlinzeka ngetafula lenethiwekhi lokuklanywa kwebhodi lesifunda le-PCB nokulungiselela isisekelo sokuklama ibhodi le-PCB. Inqubo yokuklama yebhodi lesekhethi ye-PCB enezingqimba eziningi iyafana nezinyathelo zokuklama zebhodi le-PCB elivamile. Umehluko wukuthi i-wiring yesendlalelo sesignali esiphakathi kanye nokuhlukaniswa kwesendlalelo sikagesi sangaphakathi kudingeka kwenziwe. Sekuhlanganiswe ndawonye, ukwakheka kwebhodi lesifunda le-PCB elinezingqimba eziningi kuyafana. Ihlukaniswe ngezinyathelo ezilandelayo:
1. Ukuhlelwa kwebhodi lesifunda ikakhulukazi kuhilela ukuhlela usayizi webhodi le-PCB, uhlobo lokupakisha lwezingxenye, indlela yokufaka ingxenye, kanye nesakhiwo sebhodi, okungukuthi, amabhodi anongqimba olulodwa, amabhodi anezingqimba ezimbili, kanye nezingqimba eziningi. amabhodi.
2. Ukusetha ipharamitha yokusebenza, ikakhulukazi ibhekisela ekusethweni kwepharamitha yendawo yokusebenza kanye nokusetha ipharamitha yongqimba lokusebenza. Ukulungiselelwa okulungile nokuzwakalayo kwemingcele yemvelo ye-PCB kungaletha ukunethezeka okuhle ekwakhiweni kwebhodi lesifunda futhi kuthuthukise ukusebenza kahle komsebenzi.
3. Isakhiwo nokulungiswa kwengxenye. Ngemva kokuba umsebenzi wokuqala usuqediwe, ithebula lenethiwekhi lingangeniswa ku-pcb, noma ithebula lenethiwekhi lingangeniswa ngokuqondile kumdwebo wohlelo ngokubuyekeza i-pcb. Ukuhlelwa kwengxenye nokulungiswa kuyimisebenzi ebaluleke kakhulu ekwakhiweni kwe-PCB, ethinta ngokuqondile ukusebenza okulandelayo okufana nezintambo kanye nokuhlukaniswa kwesendlalelo sikagesi sangaphakathi.
4. Izilungiselelo zokulawula izintambo ngokuyinhloko zisetha ukucaciswa okuhlukahlukene kwezintambo zesekethe, njengobubanzi bezintambo, ukuhlukaniswa kwemigqa ehambisanayo, ibanga lokuphepha phakathi kwezintambo namaphedi, nangosayizi. Kungakhathaliseki ukuthi iyiphi indlela ye-wiring eyamukelwayo, imithetho ye-wiring iyadingeka. Isinyathelo esibalulekile, imithetho emihle yezintambo ingaqinisekisa ukuphepha komzila webhodi lesifunda, ihambisane nezidingo zenqubo yokukhiqiza, futhi yonge izindleko.
5. Eminye imisebenzi eyisizayo, efana ne-copper coating kanye nokugcwaliswa kwezinyembezi, kanye nokucubungula amadokhumenti njengokuphuma kombiko nokugcina ukuphrinta. Lawa mafayela angasetshenziswa ukuhlola nokuguqula amabhodi esekethe e-PCB, futhi angasetshenziswa njengohlu lwezingxenye ezithengiwe.
Imithetho yengxenye yomzila
1. Akukho zintambo ezivunyelwe ngaphakathi kwendawo ≤1mm ukusuka emaphethelweni ebhodi le-PCB nangaphakathi kuka-1mm eduze kwembobo efakwayo;
2. Intambo kagesi kufanele ibe banzi ngangokunokwenzeka futhi akufanele ibe ngaphansi kuka-18mil; ububanzi bomugqa wesignali akufanele bube ngaphansi kuka-12mil; imigqa yokufaka neyokukhiphayo ye-CPU akufanele ibe ngaphansi kuka-10mil (noma u-8mil); isikhala somugqa akufanele sibe ngaphansi kuka-10mil;
3. Izimbobo ezijwayelekile azikho ngaphansi kuka-30mil;
4. Ipulaki yakulayini ekabili: iphedi engu-60mil, indawo yokungena engu-40mil; I-1/4W resistor: 51 * 55mil (i-0805 surface mount); uma ixhunyiwe, iphedi engu-62mil, indawo yokungena engu-42mil; i-electrodeless capacitor: 51 * 55mil (i-0805 surface mount); Uma ifakwe ngokuqondile, iphedi ingu-50mil futhi ububanzi bembobo bungama-28mil;
5. Qaphela ukuthi izintambo zikagesi nezintambo eziphansi kufanele zibe radial ngangokunokwenzeka, futhi imigqa yesignali akufanele ihanjiswe ngamalophu.