Isimiso: Ifilimu ephilayo yenziwa endaweni yethusi yebhodi lesifunda, elivikela ngokuqinile ubuso bethusi obusha, futhi lingavimbela i-oxidation nokungcola emazingeni okushisa aphezulu.Ukujiya kwefilimu ye-OSP ngokuvamile kulawulwa kuma-microns angu-0.2-0.5.
1. Ukugeleza kwenqubo: ukwehlisa amafutha → ukugeza amanzi → ukuguguleka okuncane → ukugeza amanzi → ukugeza nge-asidi → ukugeza amanzi ahlanzekile → OSP → ukugeza amanzi ahlanzekile → ukomiswa.
2. Izinhlobo zezinto ze-OSP: I-Rosin, i-Active Resin ne-Azole.Izinto ze-OSP ezisetshenziswa yi-Shenzhen United Circuits okwamanje zisetshenziswa kabanzi ama-OSP azole.
Iyini inqubo yokwelashwa kwendawo ye-OSP yebhodi le-PCB?
3. Izici: i-flatness enhle, ayikho i-IMC eyakhiwe phakathi kwefilimu ye-OSP kanye nethusi lebhodi lebhodi lesifunda, okuvumela ukuthungatha okuqondile kwe-solder kanye nebhodi lebhodi lebhodi ngesikhathi sokuthengisa (i-wettability enhle), ubuchwepheshe bokucubungula izinga lokushisa eliphansi, izindleko eziphansi (izindleko eziphansi. ) Nge-HASL), amandla amancane asetshenziswa ngesikhathi sokucutshungulwa, njll. Angasetshenziswa kuwo womabili amabhodi wesifunda asezingeni eliphansi kanye nama-substrates okupakisha ama-chip aphezulu.Ibhodi le-PCB Proofing Yoko likhuthaza ukushiyeka: ① ukuhlolwa kokubukeka kunzima, akufanelekile ukuthuthwa kabusha okuningi (ngokuvamile kudinga izikhathi ezintathu);② OSP ifilimu surface kulula ukunwaya;③ izidingo zemvelo yokulondoloza ziphezulu;④ isikhathi sokulondoloza sifushane.
4. Indlela yesitoreji nesikhathi: Izinyanga ezingu-6 ekufakweni kwe-vacuum (izinga lokushisa 15-35℃, umswakama RH≤60%).
5. Izidingo zesayithi le-SMT: ① Ibhodi lesifunda le-OSP kufanele ligcinwe kuzinga lokushisa eliphansi kanye nomswakama ophansi (izinga lokushisa elingu-15-35°C, umswakama RH ≤60%) futhi ligweme ukuchayeka endaweni egcwele igesi ene-asidi, futhi ukuhlanganisa kuqala phakathi kuka-48 amahora ngemva kokukhipha iphakethe le-OSP;② Kunconywa ukuthi uyisebenzise phakathi kwamahora angu-48 ngemva kokuqedwa kocezu olunohlangothi olulodwa, futhi kuyanconywa ukuthi uligcine ekhabetheni elinezinga lokushisa eliphansi esikhundleni sokupakisha i-vacuum;