Ukuthuthukiswa kwebhodi le-PCB kanye nesidingo ingxenye 2

Kusuka ku-PCB World

 

Izici eziyisisekelo zebhodi lesifunda eliphrintiwe zincike ekusebenzeni kwebhodi le-substrate.Ukuze uthuthukise ukusebenza kwezobuchwepheshe kwebhodi lesifunda eliphrintiwe, ukusebenza kwebhodi le-substrate yesifunda ephrintiwe kufanele kuthuthukiswe kuqala.Ukuze kuhlangatshezwane nezidingo zokuthuthukiswa kwebhodi lesifunda eliphrintiwe, izinto ezintsha ezihlukahlukene Ithuthukiswa kancane kancane futhi isetshenziswe.Eminyakeni yakamuva, imakethe ye-PCB ishintshile ukugxila kwayo kusukela kumakhompyutha kuya kwezokuxhumana, okuhlanganisa iziteshi eziyisisekelo, amaseva, namatheminali eselula.Imishini yokuxhumana yeselula emelwe ama-smartphones aqhubekisele ama-PCB ekuminyaneni okuphezulu, abe mncane, nokusebenza okuphezulu.Ubuchwepheshe besekethe obuphrintiwe abuhlukaniseki ezintweni ze-substrate, ezifaka nezidingo zobuchwepheshe zama-PCB substrates.Okuqukethwe okufanelekile kwe-substrate material manje sekuhlelwe kwaba isihloko esikhethekile sokubhekisela embonini.

3 Izidingo eziphakeme zokushisa nokushisa

Ngokwenziwa kwe-miniaturization, ukusebenza okuphezulu, kanye nokukhiqizwa kokushisa okuphezulu kwemishini kagesi, izidingo zokuphatha okushisayo kwemishini kagesi ziyaqhubeka nokwanda, futhi esinye sezixazululo esikhethiwe ukuthuthukisa amabhodi esekethe aphrintiwe ashisayo.Isimo esiyinhloko sama-PCB amelana nokushisa futhi akhipha ukushisa yizindawo ezikwazi ukumelana nokushisa nezisusa ukushisa ze-substrate.Njengamanje, ukuthuthukiswa kwezinto eziyisisekelo kanye nokwengezwa kwama-fillers kuye kwathuthukisa izakhiwo eziphikisana nokushisa nezisusa ukushisa ngezinga elithile, kodwa ukuthuthukiswa kokushisa okushisayo kulinganiselwe kakhulu.Ngokuvamile, i-metal substrate (IMS) noma ibhodi lesekethe eliphrintiwe lensimbi isetshenziselwa ukuqeda ukushisa kwengxenye yokushisisa, okunciphisa ivolumu nezindleko uma kuqhathaniswa nerediyetha evamile kanye nokupholisa abalandeli.

I-Aluminium iyimpahla ekhangayo kakhulu.Inezinsiza eziningi, izindleko eziphansi, ukuhamba kahle kwe-thermal namandla, futhi ihambisana nemvelo.Njengamanje, ama-metal substrates amaningi noma izinongo zensimbi ziyi-aluminium yensimbi.Izinzuzo zamabhodi esekethe asekelwe ku-aluminium alula futhi ayonga, ukuxhumana okuthembekile kwe-elekthronikhi, ukuqhutshwa kwe-thermal ephezulu namandla, ukuvikelwa kwemvelo okungadayiswa futhi okungenayo umthofu, njll., futhi kungaklanywa futhi kusetshenziswe kusukela kumikhiqizo yabathengi kuya ezimotweni, imikhiqizo yezempi. kanye ne-aerospace.Akungabazeki mayelana ne-conductivity yokushisa nokumelana nokushisa kwe-substrate yensimbi.Ukhiye ulele ekusebenzeni kwe-adhesive insulating phakathi kwepuleti lensimbi nongqimba lwesekethe.

Njengamanje, amandla okushayela okulawula okushisayo agxile kuma-LED.Cishe u-80% wamandla okokufaka wama-LED aguqulwa abe ukushisa.Ngakho-ke, indaba yokuphathwa kwe-thermal ye-LED ibaluleke kakhulu, futhi kugxilwe ekuqothulweni kokushisa kwe-substrate ye-LED.Ukwakheka kwezinto ezivikela ukushisa ezimelana nokushisa okuphezulu nezivumelana nemvelo kubeka isisekelo sokungena emakethe yezibani ze-LED ezinokukhanya okuphezulu.

4 Izinto zikagesi eziguquguqukayo neziphrintiwe nezinye izidingo

4.1 Izidingo zebhodi eziguquguqukayo

I-miniaturization kanye nokunciphisa okokusebenza kwe-elekthronikhi kuzosebenzisa nakanjani inani elikhulu lamabhodi esekethe aphrintiwe (FPCB) kanye namabhodi esekethe aphrintiwe aqinile (R-FPCB).Imakethe yomhlaba wonke ye-FPCB njengamanje ilinganiselwa ezigidini eziyizinkulungwane eziyi-13 zamadola aseMelika, kanti izinga lokukhula konyaka kulindeleke ukuthi libe phezulu kunalelo lama-PCB aqinile.

Ngokunwetshwa kwesicelo, ngaphezu kokwanda kwenombolo, kuzoba nezidingo eziningi zokusebenza ezintsha.Amafilimu e-Polyimide atholakala ngombala ongenambala futhi osobala, omhlophe, omnyama, nophuzi, futhi anokumelana nokushisa okuphezulu kanye nezakhiwo eziphansi ze-CTE, ezifanele izikhathi ezahlukene.Ama-substrates amafilimu e-polyester angabizi kakhulu ayatholakala futhi emakethe.Izinselelo ezintsha zokusebenza zifaka ukunwebeka okuphezulu, ukuzinza kwe-dimensional, ikhwalithi yendawo yefilimu, nokuhlanganisa ifilimu ngogesi wesithombe kanye nokumelana nemvelo ukuze kuhlangatshezwane nezidingo ezihlala zishintsha zabasebenzisi bokugcina.

I-FPCB namabhodi e-HDI aqinile kufanele ahlangabezane nezidingo zokudluliswa kwesignali yesivinini esikhulu kanye nemvamisa ephezulu.Ukulahlekelwa okungaguquki kwe-dielectric kanye ne-dielectric yama-substrates aguquguqukayo nakho kufanele kunakwe.I-Polytetrafluoroethylene kanye nama-substrates e-polyimide athuthukisiwe angasetshenziswa ukwakha ukuguquguquka.Isekhethi.Ukwengeza impushana ye-inorganic kanye nesigcwalisi se-carbon fibre ku-polyimide resin kungakhiqiza uhlaka olunezingqimba ezintathu ze-flexible thermally conductive substrate.Ama-inorganic fillers asetshenzisiwe yi-aluminium nitride (AlN), i-aluminium oxide (Al2O3) kanye ne-hexagonal boron nitride (HBN).I-substrate ine-thermal conductivity engu-1.51W/mK futhi ingakwazi ukumelana no-2.5kV ukumelana nogesi kanye nokuhlolwa kokugoba okungu-180.

Izimakethe zezicelo ze-FPCB, ezifana namafoni ahlakaniphile, izinto ezigqokwayo, okokwelashwa, amarobhothi, njll., zibeka izidingo ezintsha kusakhiwo sokusebenza se-FPCB, futhi zakha imikhiqizo emisha ye-FPCB.Njengebhodi lezendlalelo eziningi eziguquguqukayo kakhulu, i-FPCB enezingqimba ezine iyancishiswa isuka kwevamile engu-0.4mm iye cishe ku-0.2mm;ibhodi eguquguqukayo yokudlulisela ngesivinini esiphezulu, isebenzisa i-low-Dk ne-low-Df polyimide substrate, ifinyelela izidingo zejubane lokudlulisa i-5Gbps;enkulu Ibhodi eliguquguqukayo lamandla isebenzisa i-conductor engaphezu kuka-100μm ukuze ihlangabezane nezidingo zamasekethe anamandla aphezulu kanye namanje;ibhodi eliguquguqukayo elisekelwe ekushiseni okuphezulu okusekelwe ensimbi yi-R-FPCB esebenzisa i-metal plate substrate ngokwengxenye;ibhodi eliguquguqukayo elithintekayo lizwa ukucindezela I-membrane kanye ne-electrode kuhlanganiswe phakathi kwamafilimu amabili e-polyimide ukuze enze inzwa ethintekayo eguquguqukayo;ibhodi eliguquguqukayo elinwebekayo noma ibhodi eliqinile eliguquguqukayo, i-substrate eguquguqukayo iyi-elastomer, futhi ukuma kwephethini yocingo lwensimbi kuyathuthukiswa ukuze kunwebeke.Kunjalo, lawa ma-FPCB akhethekile adinga ama-substrates angajwayelekile.

4.2 Izidingo zikagesi eziphrintiwe

Imishini kagesi ephrintiwe ithole umfutho eminyakeni yakamuva, futhi kubikezelwa ukuthi maphakathi nawo-2020, izinto zikagesi eziphrintiwe zizoba nemakethe engaphezu kwezigidigidi ezingama-300 zamadola aseMelika.Ukusetshenziswa kobuchwepheshe be-elekthronikhi obuphrintiwe embonini yesekethe ephrintiwe kuyingxenye yobuchwepheshe besekethe obuphrintiwe, osekuyinto evumelanayo embonini.Ubuchwepheshe be-elekthronikhi obuphrintiwe buseduze kakhulu ne-FPCB.Manje abakhiqizi be-PCB batshale imali kumishini kagesi ephrintiwe.Baqala ngamabhodi aguquguqukayo futhi bashintsha amabhodi esekethe aphrintiwe (PCB) bafaka amasekethe kagesi aphrintiwe (PEC).Njengamanje, kukhona ama-substrates amaningi nezinto zikayinki, futhi uma sekukhona impumelelo ekusebenzeni nezindleko, zizosetshenziswa kabanzi.Abakhiqizi be-PCB akufanele baphuthelwe yithuba.

Ukusetshenziswa okubalulekile kwamanje kwezinto zikagesi eziphrintiwe ukwenziwa kwamathegi we-radio frequency identification (RFID) angabizi kakhulu, angaphrintwa ngamaroli.Amandla asezindaweni zezibonisi eziphrintiwe, izibani, nama-organic photovoltaics.Imakethe yobuchwepheshe obugqokekayo njengamanje iyimakethe evumayo evelayo.Imikhiqizo ehlukahlukene yobuchwepheshe obugqokekayo, njengezingubo ezihlakaniphile nezibuko zemidlalo ezihlakaniphile, iziqapha zomsebenzi, izinzwa zokulala, amawashi ahlakaniphile, amahedisethi angokoqobo athuthukisiwe, amakhampasi okuzulazula, njll. Amasekhethi e-elekthronikhi aguquguqukayo abalulekile kumadivayisi zobuchwepheshe agqokekayo, azoshayela ukuthuthukiswa kwezinto eziguquguqukayo. amasekhethi kagesi aphrintiwe.

Isici esibalulekile sobuchwepheshe be-elekthronikhi obuphrintiwe yizinto zokwakha, kufaka phakathi ama-substrates nama-inki asebenzayo.Ama-substrates aguquguqukayo awafanele nje kuphela ama-FPCB akhona, kodwa futhi nama-substrates asezingeni eliphezulu.Njengamanje, kunezinto ezisezingeni eliphakeme ze-dielectric substrate ezakhiwe ingxube ye-ceramics kanye ne-polymer resins, kanye nama-substrates ashisa kakhulu, ama-substrates aphansi okushisa kanye nama-substrates angenambala angenalutho., I-substrate ephuzi, njll.

 

4 Izinto zikagesi eziguquguqukayo neziphrintiwe nezinye izidingo

4.1 Izidingo zebhodi eziguquguqukayo

I-miniaturization kanye nokunciphisa okokusebenza kwe-elekthronikhi kuzosebenzisa nakanjani inani elikhulu lamabhodi esekethe aphrintiwe (FPCB) kanye namabhodi esekethe aphrintiwe aqinile (R-FPCB).Imakethe yomhlaba wonke ye-FPCB njengamanje ilinganiselwa ezigidini eziyizinkulungwane eziyi-13 zamadola aseMelika, kanti izinga lokukhula konyaka kulindeleke ukuthi libe phezulu kunalelo lama-PCB aqinile.

Ngokunwetshwa kwesicelo, ngaphezu kokwanda kwenombolo, kuzoba nezidingo eziningi zokusebenza ezintsha.Amafilimu e-Polyimide atholakala ngombala ongenambala futhi osobala, omhlophe, omnyama, nophuzi, futhi anokumelana nokushisa okuphezulu kanye nezakhiwo eziphansi ze-CTE, ezifanele izikhathi ezahlukene.Ama-substrates amafilimu e-polyester angabizi kakhulu ayatholakala futhi emakethe.Izinselelo ezintsha zokusebenza zifaka ukunwebeka okuphezulu, ukuzinza kwe-dimensional, ikhwalithi yendawo yefilimu, nokuhlanganisa ifilimu ngogesi wesithombe kanye nokumelana nemvelo ukuze kuhlangatshezwane nezidingo ezihlala zishintsha zabasebenzisi bokugcina.

I-FPCB namabhodi e-HDI aqinile kufanele ahlangabezane nezidingo zokudluliswa kwesignali yesivinini esikhulu kanye nemvamisa ephezulu.Ukulahlekelwa okungaguquki kwe-dielectric kanye ne-dielectric yama-substrates aguquguqukayo nakho kufanele kunakwe.I-Polytetrafluoroethylene kanye nama-substrates e-polyimide athuthukisiwe angasetshenziswa ukwakha ukuguquguquka.Isekhethi.Ukwengeza impushana ye-inorganic kanye nesigcwalisi se-carbon fibre ku-polyimide resin kungakhiqiza uhlaka olunezingqimba ezintathu ze-flexible thermally conductive substrate.Ama-inorganic fillers asetshenzisiwe yi-aluminium nitride (AlN), i-aluminium oxide (Al2O3) kanye ne-hexagonal boron nitride (HBN).I-substrate ine-thermal conductivity engu-1.51W/mK futhi ingakwazi ukumelana no-2.5kV ukumelana nogesi kanye nokuhlolwa kokugoba okungu-180.

Izimakethe zezicelo ze-FPCB, ezifana namafoni ahlakaniphile, izinto ezigqokwayo, okokwelashwa, amarobhothi, njll., zibeka izidingo ezintsha kusakhiwo sokusebenza se-FPCB, futhi zakha imikhiqizo emisha ye-FPCB.Njengebhodi lezendlalelo eziningi eziguquguqukayo kakhulu, i-FPCB enezingqimba ezine iyancishiswa isuka kwevamile engu-0.4mm iye cishe ku-0.2mm;ibhodi eguquguqukayo yokudlulisela ngesivinini esiphezulu, isebenzisa i-low-Dk ne-low-Df polyimide substrate, ifinyelela izidingo zejubane lokudlulisa i-5Gbps;enkulu Ibhodi eliguquguqukayo lamandla isebenzisa i-conductor engaphezu kuka-100μm ukuze ihlangabezane nezidingo zamasekethe anamandla aphezulu kanye namanje;ibhodi eliguquguqukayo elisekelwe ekushiseni okuphezulu okusekelwe ensimbi yi-R-FPCB esebenzisa i-metal plate substrate ngokwengxenye;ibhodi eliguquguqukayo elithintekayo lizwa ukucindezela I-membrane kanye ne-electrode kuhlanganiswe phakathi kwamafilimu amabili e-polyimide ukuze enze inzwa ethintekayo eguquguqukayo;ibhodi eliguquguqukayo elinwebekayo noma ibhodi eliqinile eliguquguqukayo, i-substrate eguquguqukayo i-elastomer, futhi ukuma kwephethini yocingo lwensimbi kuyathuthukiswa ukuze kunwebeke.Kunjalo, lawa ma-FPCB akhethekile adinga ama-substrates angajwayelekile.

4.2 Izidingo zikagesi eziphrintiwe

Imishini kagesi ephrintiwe ithole umfutho eminyakeni yakamuva, futhi kubikezelwa ukuthi maphakathi nawo-2020, izinto zikagesi eziphrintiwe zizoba nemakethe engaphezu kwezigidigidi ezingama-300 zamadola aseMelika.Ukusetshenziswa kobuchwepheshe be-elekthronikhi obuphrintiwe embonini yesekethe ephrintiwe kuyingxenye yobuchwepheshe besekethe obuphrintiwe, osekuyinto evumelanayo embonini.Ubuchwepheshe be-elekthronikhi obuphrintiwe buseduze kakhulu ne-FPCB.Manje abakhiqizi be-PCB batshale imali kumishini kagesi ephrintiwe.Baqala ngamabhodi aguquguqukayo futhi bashintsha amabhodi esekethe aphrintiwe (PCB) bafaka amasekethe kagesi aphrintiwe (PEC ).Njengamanje, kukhona ama-substrates amaningi nezinto zikayinki, futhi uma sekukhona impumelelo ekusebenzeni nezindleko, zizosetshenziswa kabanzi.Abakhiqizi be-PCB akufanele baphuthelwe yithuba.

Ukusetshenziswa okubalulekile kwamanje kwezinto zikagesi eziphrintiwe ukwenziwa kwamathegi we-radio frequency identification (RFID) angabizi kakhulu, angaphrintwa ngamaroli.Amandla asezindaweni zezibonisi eziphrintiwe, izibani, nama-organic photovoltaics.Imakethe yobuchwepheshe obugqokekayo njengamanje iyimakethe evunayo evelayo.Imikhiqizo ehlukahlukene yobuchwepheshe obugqokekayo, njengezingubo ezihlakaniphile nezibuko zemidlalo ezihlakaniphile, iziqapha zomsebenzi, izinzwa zokulala, amawashi ahlakaniphile, amahedisethi angokoqobo athuthukisiwe, amakhampasi okuzulazula, njll. Amasekhethi e-elekthronikhi aguquguqukayo abalulekile kumadivayisi zobuchwepheshe agqokekayo, azoshayela ukuthuthukiswa kwezinto eziguquguqukayo. amasekhethi kagesi aphrintiwe.

Isici esibalulekile sobuchwepheshe be-elekthronikhi obuphrintiwe yizinto zokwakha, kufaka phakathi ama-substrates nama-inki asebenzayo.Ama-substrates aguquguqukayo awafanele nje kuphela ama-FPCB akhona, kodwa futhi nama-substrates asezingeni eliphezulu.Njengamanje, kunezinto ezisezingeni eliphakeme ze-dielectric substrate ezakhiwe ingxube ye-ceramics kanye ne-polymer resins , kanye nama-substrates ashisa kakhulu, ama-substrates aphansi okushisa kanye nama-substrates angenambala abonakalayo., I-Yellow substrate, njll.