Izici eziyisisekelo zebhodi lesekethe eliphrintiwe zincike ekusebenzeni kwebhodi elingaphansi. Ukuze uthuthukise ukusebenza kwezobuchwepheshe kwebhodi yesekethe ephrintiwe, ukusebenza kwebhodi ye-RegretTrate ephrintiwe kumele kuthuthukiswe kuqala. Ukuze uhlangabezane nezidingo zokuthuthukiswa kwebhodi yesekethe ephrintiwe, izinto ezintsha ezintsha zithuthukiswa kancane kancane futhi zisebenzisa.

Eminyakeni yamuva nje, imakethe ye-PCB isuse ukugxila kwayo kumakhompiyutha kuya kwezokuxhumana, kufaka phakathi iziteshi eziyisisekelo, amaseva nezindawo ezisetshenziswayo zeselula. Amadivayisi wokuxhumana weselula amelwe ama-Smartphones aqhubekele ama-PCB aqhutshwa ngobuningi obuphezulu, ukuncipha, kanye nokusebenza okuphezulu. Ubuchwepheshe be-Pranced Returcuit buhlukaniswe kusuka ezintweni ezisetshenziswayo ezingezansi, okubandakanya nezidingo zobuchwepheshe zePCB Substrates. Okuqukethwe okufanele kwezinto zokwakha ama-substrate manje kuhlelwe ku-athikili ekhethekile yesethenjwa semboni.

1 Isidingo sobukhulu obuphezulu kanye ne-Fine-line

1.1 Isidingo se-foil yethusi

Ama-PCB wonke akhula ngokuqina okuphezulu nokuthuthukiswa komugqa omncane, namabhodi we-HDI avelele ikakhulukazi. Eminyakeni eyishumi edlule, i-IPC ichaze iBhodi ye-HDI njengomugqa ububanzi / I-Line Spaceting (L / s) ye-0.1mm / 0.1mm nangaphansi. Manje imboni ngokuyisisekelo ifinyelela ku-L / S ejwayelekile ye-60μM, kanye ne-L / s ethuthukisiwe ye-L / S ye-40μM. Uhlobo lukaJapan ka-2013 lwedatha ye-Task Technology RoadMap yilokho ngonyaka ka-2014, i-L / s evamile ye-HDI Board yayingama-50μM, i-Advanced L / S yawungama-L / S angama-20μM.

I-PCB Circuit Pattern Fetring Production, inqubo yendabuko yamakhemikhali yendabuko (indlela eshisayo) ngemuva kokutholwa kwe-Foil substrate, umkhawulo omncane wendlela yokuzithoba ekwenzeni imigqa emihle cishe i-30μm (9 ~ 12μm) substrate iyadingeka. Ngenxa yentengo ephezulu ye-COPPER ye-Foilccl Cerp kanye nezinkinga eziningi ekubuyiselweni kwe-Foil Foil, amafektri amaningi akhiqiza i-foil ye-18μM bese usebenzisa i-etching ukuze unciphise ungqimba lwethusi ngesikhathi sokukhiqizwa. Le ndlela inezinqubo eziningi, ukulawulwa okunzima kokuqina, nezindleko eziphakeme. Kungcono ukusebenzisa i-foil ye-computer emincane. Ngaphezu kwalokho, lapho i-PCB Circuit L / S ingaphansi kwama-20μm, i-foil yamathunta emincane ngokuvamile kunzima ukuyiphatha. Kudinga i-foil ye-popper ye-ultra-mncane (3 ~ 5μM) kanye ne-foil yekhompiyutha ye-ultra-mncane enamathiselwe kumthwali.

Ngaphezu kwama-Foils weCopper we-Thinner, imigqa emihle yamanje idinga ubulukhuni obuphansi ebusweni be-foil ye-Copper. Ngokuvamile, ukuze kuthuthukiswe amandla okubopha phakathi kwe-foil ye-copper kanye ne-substrate kanye nokuqinisekisa amandla okukhohlisa, ungqimba lwe-foil lwe-Copper luhlanganisiwe. Ubulukhuni be-foil evamile yethusi inkulu kune-5μm. Ukushukunyiswa kweziqongo ezinolaka ze-Fopper Folip ku-substrate kuthuthukisa ukumelana nokuvuthayo, kodwa ukuze kulawule ukunemba kocingo ngesikhathi somugqa we-etching, kubangela ukushunyayelwa okuphezulu, okuncishisiwe, okubaluleke kakhulu emigqeni emihle. Umugqa ubaluleke kakhulu. Ngakho-ke, ama-foils ethusi anobulukhuni obuphansi (ngaphansi kwama-3 μm) ngisho nobulukhuni obuphansi (1.5 μm) kuyadingeka.

1.2 Isidingo samashidi we-dielectric ahlanzekile

Isici sezobuchwepheshe sebhodi le-HDI ukuthi inqubo yokwakha (ukwakhiwa kwe-boildrocess), i-foil ye-resin-resin-coide esetshenzisiwe ye-resin Njengamanje, indlela esezingeni eliphansi (i-SAP) noma i-Semi-Procued Way (MSAP) yenzelwe ukwamukelwa, okungukuthi, ifilimu ye-dielectric efaka ukufakwa, bese kusetshenziselwa iplani ye-electrors yethusi isetshenziselwa ukwakha ungqimba lwe-Conductor. Ngoba ungqimba lwethusi mncane kakhulu, kulula ukwakha imigqa emihle.

Elinye lamaphuzu asemqoka lendlela esezingeni elingezansi yizinto zokudla ezingcolile ze-dielectric. Ukuze uhlangabezane nezidingo zemigqa emihle ye-density ephezulu, izinto ezihlanjululwe zibeka phambili izidingo ze-dielectric kagesi, ukufaka, ukumelana nokushisa, amandla okubopha, kanye nokuguquguquka kwenqubo ye-HDI Board. Njengamanje, izinsiza zabezindaba ze-International HDI Lameniated ziyimikhiqizo ye-ABF / GX CELICE yenkampani yaseJapan Ajinomoto, esebenzisa i-epoxy resin enama-ejenti we-inorganic ukuthuthukisa ubumba lwezinto ezibonakalayo ukuze athuthukise ubumbano lwe-inorganic ukuze athuthukise ubumbano lwe-inOrganic ukuze athuthukise ubumbano lwezinto ezibonakalayo futhi anciphise ukuqina kwe-CTTE. . Kukhona nezinto zokwakha ama-lin-laminate ezifanayo zenkampani yamakhemikhali yaseSeyisui Chemical of Japan, kanye neTaiwan Industry Technology Research Institute nazo zithuthukise izinto ezinjalo. Izinto zokwenziwa ze-ABF nazo zithuthukiswa futhi zakhiwa. Isizukulwane esisha sezinto zokulala ezihlanjululwe ngokukhethekile zidinga ubulukhuni obuphansi be-surce, ukunwebeka okuphansi okushisayo, ukulahleka okuphansi kwe-dielectric, kanye nokuqiniswa okuqinile okuqinile.

Emapaketheni we-semiconductor womhlaba wonke, ama-IC Packaging Supprates athathe indawo yokuxhaswa kwe-ceramic nge-organic substrates. I-pitch of flip chip (FC) ukufakwa kwamaphakeji kuthola okuncane futhi kuncane. Manje isikhala somugqa esijwayelekile / Isikhala somugqa singama-15μM, futhi kuzoba mncane ngokuzayo. Ukusebenza kwenkampani ye-Multi-Laner ikakhulukazi kudinga izakhiwo eziphansi ze-dielectric, ukukhulisa okuphansi okushisayo kanye nokuphikiswa okuphezulu okuphezulu, kanye nokuphishekela ukuxhashazwa okubiza okuphansi ngesisekelo sokuhlangana kwemigomo yokusebenza komhlangano. Njengamanje, ukukhiqizwa kwesisindo semibuthano emihle ngokuyisisekelo kwamukela inqubo ye-MSPA yokufakwa kwe-laminated kanye ne-foil ye-computer emincane. Sebenzisa indlela ye-SAP ukukhiqiza amaphethini wesifunda nge-L / S ngaphansi kwe-10μm.

Lapho ama-PCB eba mncane futhi anciphile, ubuchwepheshe bebhodi le-HDI buye bavela emigodini equkethe ama-laminates angenawona ama-corconner anctonnection ama-laminates (noma ngubani umbhali). Noma yimaphi-ungqimba lokuxhumana ama-licconnection amabhodi we-HDI ngomsebenzi ofanayo angcono kunamabhodi aqukethe ama-laminate HDI. Indawo nobukhulu bangancishiswa cishe ngama-25%. Lokhu kumele kusetshenziswe mncane futhi kugcine izakhiwo zikagesi ezinhle ze-dielectric ungqimba.

2 imvamisa ephezulu kanye nesivinini esikhulu sejubane

Ubuchwepheshe Bokuxhumana Nge-elekthronikhi basuka ku-Wireless kuya ku-Wireless, kusuka kufrikhweni eliphansi kanye nejubane eliphansi kuya imvamisa ephezulu nesivinini esikhulu. Ukusebenza kwefoni okukhona njengamanje kufake i-4G futhi kuzodlulela ku-5G, okungukuthi, ijubane lokuhambisa ngokushesha kanye namandla okudlulisa amakhulu. Ukuqala kwe-Somhlaba ye-Computing Computing Era kuphindeka kabili nge-Traffic yedatha, kanye nokuvama okuphezulu kanye nemishini yokuxhumana ngesivinini esikhulu kuyinto emnandi engenakugwenywa. I-PCB ilungele imvamisa ephezulu nokudluliswa okusheshayo. Ngaphezu kokunciphisa ukuphazanyiswa kwesiginali nokulahleka ekwakhiweni kwesifunda, ukugcina ubuqotho besigcawu, kanye nokugcina ukuthembeka kwe-PCB ukuze kuhlangatshezwane nezidingo zokwakhiwa, kubalulekile ukuba ne-substrate esebenza kahle.

Ukuze uxazulule inkinga ye-PCB Khulisa isivinini kanye nobuqotho besiginali, onjiniyela bokuklama ikakhulukazi bagxila kakhulu ekulahlekelweni kwezimpawu zokulahlekelwa ngugesi. Izici ezibalulekile zokukhethwa kwe-substrate yi-dielectric njalo (DK) kanye nokulahleka kwe-dielectric (DF). Lapho i-DK iphansi kune-4 ne-DF0.010, iyi-liment dk / df lamiminate, futhi lapho i-DK iphansi kune-3.7 futhi i-DK ibanga langaphansi, manje kunezinhlobonhlobo zezimakethe zokungena emakethe ukuze zingene.

Njengamanje, ama-substrates asezingeni eliphakeme kakhulu asetshenziswa kakhulu ama-substrates ikakhulukazi ama-resins asuselwa ku-fluorine, ama-polyphenene ether (PPO noma i-PPE) ama-resins kanye nama-epoxy resins. I-Fluent-based Dielectric Substrates, enjenge-polytetrafluoroethylene (PTFE), inezindawo eziphansi kakhulu ze-dielectric futhi zivame ukusetshenziswa ngenhla kwe-5 GHz. Kukhona nezinto eziguquliwe ze-epoxy fr-4 noma i-PPO substrates.

Ngokungeziwe ku-resin echazwe ngenhla nezinye izinto zokufaka ezifakwayo, ubulukhuni bendawo (iphrofayili) yomqhubi weCopper buyinto ebalulekile ethinta ukulahleka kwesiginali, okuthintwa umphumela wesikhumba (i-skineffect). Umphumela wesikhumba ukungeniswa kwe-electromagnetic okukhiqizwe ocingweni ngesikhathi sokudluliselwa kwesiginali yemvamisa ephezulu, futhi ukungahambi kahle kukhulu enkabeni yesigaba se-wire, ukuze amanje akhona noma isiginali athambekele ebusweni bentambo. Ubulukhuni bendawo yokuzifunela luthinta ukulahleka kwesiginali yokudlulisela, kanye nokulahlekelwa yindawo ebushelelezi kuncane.

Ngemvamisa efanayo, kukhudlwana ubulukhuni bendawo yethusi, kukhulu kakhulu ukulahleka kwesiginali. Ngakho-ke, ekukhiqizweni kwangempela, sizama ukulawula ubulukhuni bogqinsi lwethusi olungaphezulu ngangokunokwenzeka. Ubulukhuni buncane ngangokunokwenzeka ngaphandle kokuthinta amandla obugqi. Ikakhulukazi amasiginali ebangeni elingaphezulu kwe-10 GHz. E-10GHZ, ububi be-foil we-Copper budinga ukungaphansi kwe-1 μm, futhi kungcono ukusebenzisa i-Super-Plan-Planper Copper Foil (ubuqili be-surceness 0.04μm). Ubulukhuni be-Fop Foil budinga ukuhlanganiswa nokwelashwa nge-oxidation efanelekile kanye nohlelo lwe-resin lokubopha. Esikhathini esizayo esiseduze, kuzoba khona i-foil ye-resin-ehlanganiswe ne-foil ye-resin