Izici eziyisisekelo zebhodi lesifunda eliphrintiwe zincike ekusebenzeni kwebhodi le-substrate.Ukuze uthuthukise ukusebenza kwezobuchwepheshe kwebhodi lesifunda eliphrintiwe, ukusebenza kwebhodi le-substrate yesifunda ephrintiwe kufanele kuthuthukiswe kuqala.Ukuze kuhlangatshezwane nezidingo zokuthuthukiswa kwebhodi lesifunda eliphrintiwe, izinto ezintsha ezihlukahlukene Ithuthukiswa kancane kancane futhi isetshenziswe.
Eminyakeni yakamuva, imakethe ye-PCB ishintshile ukugxila kwayo kusukela kumakhompyutha kuya kwezokuxhumana, okuhlanganisa iziteshi eziyisisekelo, amaseva, namatheminali eselula.Imishini yokuxhumana yeselula emelwe ama-smartphones aqhubekisele ama-PCB ekuminyaneni okuphezulu, abe mncane, nokusebenza okuphezulu.Ubuchwepheshe besekethe obuphrintiwe abuhlukaniseki ezintweni ze-substrate, ezifaka nezidingo zobuchwepheshe zama-PCB substrates.Okuqukethwe okufanelekile kwe-substrate material manje sekuhlelwe kwaba isihloko esikhethekile sokubhekisela embonini.
1 Isidingo sokuminyana okuphezulu nolayini ocolekile
1.1 Isidingo se-foil yethusi
Ama-PCB wonke athuthukela ekuthuthukisweni kokuminyana okuphezulu kanye nemigqa emincane, futhi amabhodi e-HDI agqama kakhulu.Eminyakeni eyishumi edlule, i-IPC yachaza ibhodi le-HDI njengobubanzi bomugqa/isikhala somugqa (L/S) esingu-0.1mm/0.1mm nangaphansi.Manje imboni ngokuyisisekelo izuza i-L/S evamile ka-60μm, kanye ne-L/S ethuthukisiwe engu-40μm.Inguqulo yase-Japan ka-2013 yedatha yemephu yomgwaqo yobuchwepheshe bokufaka ukuthi ngo-2014, i-L/S evamile yebhodi le-HDI yayingu-50μm, i-L/S ethuthukisiwe yayingu-35μm, kanti i-L/S ekhiqizwe ngovivinyo yayingu-20μm.
Ukwakheka kwephethini yesekethe ye-PCB, inqubo yokushumeka amakhemikhali yendabuko (indlela ekhiphayo) ngemva kokuthwebula isithombe ku-substrate ye-copper foil, umkhawulo omncane wendlela yokukhipha yokwenza imigqa ecolekileyo ungaba ngu-30μm, futhi i-substrate yethusi encane (9~12μm) iyadingeka .Ngenxa yenani eliphezulu le-CCL ye-copper foil ezacile kanye nokukhubazeka okuningi kwe-copper foil lamination emincane, izimboni eziningi zikhiqiza ucwecwe lwethusi oluyi-18μm bese zisebenzisa i-etching ukuze mncane ungqimba lwethusi ngesikhathi sokukhiqiza.Le ndlela inezinqubo eziningi, ukulawula ukujiya okunzima, kanye nezindleko eziphakeme.Kungcono ukusebenzisa i-foil yethusi encane.Ukwengeza, lapho isekethe ye-PCB L/S ingaphansi kuka-20μm, ucwecwe lwethusi oluncane ngokuvamile kunzima ukuluphatha.Idinga i-ultra-copper foil (3~5μm) substrate kanye necwecwe lethusi elincanyana kakhulu elinamathiselwe kusithwali.
Ngaphezu kwama-foil ethusi amancane, imigqa emihle yamanje idinga ukuqina okuphansi ebusweni be-foil yethusi.Ngokuvamile, ukuze kuthuthukiswe amandla okubopha phakathi kwe-foil yethusi ne-substrate kanye nokuqinisekisa amandla okuxebuka komqhubi, ungqimba lwe-foil yethusi luqiniswa.Ubulukhuni be-foil yethusi evamile bukhulu kuno-5μm.Ukushumeka kweziqongo zefoyili yethusi ku-substrate kuthuthukisa ukumelana nokuxebuka, kodwa ukuze ulawule ukunemba kocingo ngesikhathi sokushumeka komugqa, kulula ukuba kube neziqongo ze-substrate zokushumeka ezisele, okubangela amasekhethi amafushane phakathi kwemigqa noma ukuncipha kwe-insulation. , okubaluleke kakhulu emigqeni emihle.Umugqa ubucayi ikakhulukazi.Ngakho-ke, ama-foil ethusi ane-roughness ephansi (ngaphansi kuka-3 μm) ngisho nama-roughness aphansi (1.5 μm) ayadingeka.
1.2 Isidingo samashidi e-dielectric laminated
Isici sobuchwepheshe sebhodi le-HDI ukuthi inqubo yokwakha (BuildingUpProcess), i-foil yethusi ehlanganiswe ne-resin evame ukusetshenziswa (RCC), noma ungqimba olulayiniwe lwendwangu yengilazi ye-semi-cured epoxy kanye ne-copper foil kunzima ukufeza imigqa emihle.Njengamanje, indlela ye-semi-additive (SAP) noma indlela ethuthukisiwe ye-semi-processed (MSAP) ijwayele ukwamukelwa, okungukuthi, ifilimu ye-dielectric insulating isetshenziselwa ukupakisha, bese kusetshenziswa i-electroless copper plating ukwakha ithusi. ungqimba womqhubi.Ngenxa yokuthi ungqimba lwethusi luncane kakhulu, kulula ukwenza imigqa emihle.
Enye yamaphuzu abalulekile wendlela ye-semi-additive yi-dielectric material laminated.Ukuze kuhlangatshezwane nezidingo zemigqa emihle ye-high-density, i-laminated material ibeka phambili izidingo zezakhiwo zikagesi ze-dielectric, ukufakwa kwe-insulation, ukumelana nokushisa, amandla okubopha, njll., kanye nokuguquguquka kwenqubo yebhodi le-HDI.Njengamanje, izinto zemidiya zamazwe ngamazwe ze-HDI ezenziwe nge-laminated ze-HDI ikakhulukazi ziyimikhiqizo yochungechunge lwe-ABF/GX ye-Japan Ajinomoto Company, esebenzisa i-epoxy resin enama-ejenti ahlukene okwelapha ukwengeza impushana engaphili ukuze kuthuthukiswe ukuqina kwento futhi kunciphise i-CTE, nendwangu ye-fiber yengilazi. ibuye isetshenziselwe ukwandisa ukuqina..Kukhona nezinto ezifanayo zefilimu ezacile ze-laminate ye-Sekisui Chemical Company yase-Japan, futhi i-Taiwan Industrial Technology Research Institute nayo ithuthukise izinto ezinjalo.Izinto ze-ABF nazo zithuthukiswa ngokuqhubekayo futhi zithuthukiswa.Isizukulwane esisha sezinto ezenziwe nge-laminated ikakhulukazi sidinga ubulukhuni obusezingeni eliphansi, ukunwebeka okushisayo okuphansi, ukulahleka kwe-dielectric okuphansi, nokuqiniswa okuqinile okuncane.
Ephaketheni le-semiconductor yomhlaba wonke, ama-substrates okupakisha e-IC athathe indawo ye-ceramic substrates ngama-organic substrates.I-pitch of flip chip (FC) yokupakisha substrates iya ibancane ngokuba mancane.Manje ububanzi obujwayelekile bomugqa/isikhala somugqa singu-15μm, futhi sizoba mncane ngokuzayo.Ukusebenza kwenkampani yenethiwekhi enezingqimba eziningi ngokuyinhloko kudinga izindawo eziphansi ze-dielectric, i-coefficient ephansi yokwandisa okushisayo kanye nokumelana nokushisa okuphezulu, nokuphishekela ama-substrates angabizi kakhulu ngesisekelo sokuhlangabezana nemigomo yokusebenza.Njengamanje, ukukhiqizwa kwenqwaba yamasekhethi amahle ngokuyisisekelo kwamukela inqubo ye-MSPA yokufakwa kwe-laminated kanye ne-foil yethusi elincanyana.Sebenzisa indlela ye-SAP ukwenza amaphethini wesekethe nge-L/S ngaphansi kuka-10μm.
Lapho ama-PCB eba aminyene futhi aba mncane, ubuchwepheshe bebhodi le-HDI buye bashintsha kusukela kumalaminates aqukethe umnyombo kuya kuma-anylayer interconnection laminates (Anylayer).Amabhodi we-laminate HDI wokuxhumanisa noma iyiphi isendlalelo anomsebenzi ofanayo angcono kunamabhodi e-HDI aqukethe i-laminate HDI.Indawo nokuqina kungancishiswa cishe ngama-25%.Lezi kumele zisebenzise ezacile futhi zigcine izakhiwo zikagesi ezinhle zongqimba lwe-dielectric.
2 Imvamisa ephezulu kanye nesidingo sesivinini esikhulu
Ubuchwepheshe bokuxhumana nge-elekthronikhi busukela konezintambo kuye kongenantambo, ukusuka kumafrikhwensi aphansi kanye nesivinini esiphansi kuye kumafrikhwensi aphezulu kanye nesivinini esikhulu.Ukusebenza kwamanje kwefoni ephathekayo kungene ku-4G futhi kuzoqhubekela ku-5G, okungukuthi, isivinini sokudlulisa ngokushesha kanye nomthamo omkhulu wokudlulisela.Ukufika kwenkathi yomhlaba wonke ye-cloud computing kuye kwaphindeka kabili ukugcwala kwedatha, futhi imishini yokuxhumana ye-high-frequency kanye nesivinini esiphezulu kuwumkhuba ongenakugwemeka.I-PCB ifanele ukudluliswa kwe-high-frequency kanye nesivinini esikhulu.Ngaphezu kokunciphisa ukuphazamiseka kwesignali nokulahlekelwa ekwakhiweni kwesifunda, ukugcina ubuqotho besignali, nokugcina ukukhiqizwa kwe-PCB ukuze kuhlangatshezwane nezidingo zokuklama, kubalulekile ukuba ne-substrate esebenza kahle kakhulu.
Ukuze uxazulule inkinga ye-PCB yokwandisa isivinini kanye nobuqotho besignali, onjiniyela bokuklama bagxila kakhulu ezintweni zokulahlekelwa kwesignali kagesi.Izici ezibalulekile zokukhethwa kwe-substrate yi-dielectric constant (Dk) kanye nokulahlekelwa kwe-dielectric (Df).Uma u-Dk engaphansi kuka-4 no-Df0.010, i-Df/Df laminate ephakathi, futhi lapho u-Dk ingaphansi kuka-3.7 futhi i-Df0.005 iphansi, i-Df/Df grade laminates ephansi, manje kunezinhlobonhlobo zama-substrates. ukungena emakethe ongakhetha kuzo.
Njengamanje, ama-substrates ebhodi lesekethe evamise ukusetshenziswa kakhulu ikakhulukazi ama-resin asekelwe ku-fluorine, ama-polyphenylene ether (i-PPO noma i-PPE) nama-epoxy resins aguquliwe.Ama-substrates e-dielectric asuselwa ku-fluorine, njenge-polytetrafluoroethylene (PTFE), anezinto eziphansi kakhulu ze-dielectric futhi ngokuvamile asetshenziswa ngaphezu kuka-5 GHz.Kukhona futhi ama-epoxy FR-4 noma ama-PPO substrates alungisiwe.
Ngaphandle kwe-resin eshiwo ngenhla nezinye izinto zokuvikela, ukuqina kwendawo (iphrofayili) ye-conductor yethusi nakho kuyisici esibalulekile esithinta ukulahlekelwa kokudluliswa kwesignali, okuthintekayo umphumela wesikhumba (SkinEffect).Umthelela wesikhumba ukungeniswa kukazibuthe okukhiqizwa ocingweni ngesikhathi sokudlulisa isignali yemvamisa ephezulu, futhi i-inductance inkulu maphakathi nesigaba socingo, ukuze i-current noma isignali ijwayele ukugxila ebusweni bocingo.Ubunzima obungaphezulu bomqhubi buthinta ukulahlekelwa kwesignali yokudlulisela, futhi ukulahlekelwa kwendawo ebushelelezi kuncane.
Ngemvamisa efanayo, uma ubukhulu bendawo yethusi bukhulu, kukhulu ukulahleka kwesignali.Ngakho-ke, ekukhiqizeni kwangempela, sizama ukulawula ukushuba kobukhulu bethusi obungaphezulu ngangokunokwenzeka.I-roughness incane ngangokunokwenzeka ngaphandle kokuphazamisa amandla okubopha.Ikakhulukazi kumasiginali kububanzi obungaphezulu kuka-10 GHz.Ku-10GHz, ubulukhuni be-foil ye-copper budinga ukuba ngaphansi kuka-1μm, futhi kungcono ukusebenzisa ucwecwe lwethusi lwe-super-planar (ukumahwaga okungaphezulu okungu-0.04μm).Ubulukhuni obungaphezulu be-foil yethusi budinga futhi ukuhlanganiswa nokwelashwa oksijini okulungile kanye nesistimu ye-bonding resin.Esikhathini esizayo esiseduze, kuzoba ne-foil yethusi ehlanganiswe ne-resin cishe engenalo uhlaka, okungaba namandla aphezulu we-peel futhi ngeke kuthinte ukulahlekelwa kwe-dielectric.