Enqubweni yokuthuthukiswa kwemikhiqizo yesimanje ye-elekthronikhi, ikhwalithi yamabhodi wesifunda ithinta ngokuqondile ukusebenza nokuthembeka kwemishini kagesi. Ukuze kuqinisekiswe ikhwalithi yemikhiqizo, izinkampani eziningi zikhetha ukwenza isiko lokuhlola amabhodi e-PCB. Lesi sixhumanisi sibaluleke kakhulu ekuthuthukisweni nasekukhiqizeni umkhiqizo. Ngakho-ke, iyiphi ngempela isevisi yokuqinisekisa ibhodi le-PCB ehlanganisayo?
ukusayina kanye nezinsizakalo zokubonisana
1. Ukuhlaziywa kwesidingo: Abakhiqizi be-PCB badinga ukuxhumana okujulile namakhasimende ukuze baqonde izidingo zabo ezithile, okuhlanganisa imisebenzi yesekethe, ubukhulu, izinto zokwakha, nezimo zohlelo lokusebenza. Kuphela ngokuqonda ngokugcwele izidingo zekhasimende lapho singanikeza khona izixazululo ezifanele ze-PCB.
2. Ukubuyekezwa kwe-Design for manufacturability (DFM): Ngemva kokuqedwa komklamo we-PCB, ukubuyekezwa kwe-DFM kuyadingeka ukuze kuqinisekiswe ukuthi isixazululo sokuklama siyenzeka enqubweni yangempela yokukhiqiza kanye nokugwema izinkinga zokukhiqiza ezibangelwa ukukhubazeka kokuklama.
Ukukhetha nokulungiselela impahla
1. Impahla ye-substrate: Izinto ezivamile ze-substrate zifaka i-FR4, i-CEM-1, i-CEM-3, izinto ezisebenza ngamaza aphezulu, njll. Ukukhethwa kwe-substrate impahla kufanele kusekelwe kubuningi bokusebenza besekethe, izidingo zemvelo, nokucatshangelwa kwezindleko.
2. Izinto zokuqhuba: Izinto ezisetshenziswayo ezivame ukusetshenziswa zihlanganisa i-copper foil, evame ukuhlukaniswa ibe yithusi le-electrolytic kanye nethusi eligoqiwe. Ubukhulu be-foil yethusi ngokuvamile buphakathi kwama-microns angu-18 kanye nama-microns angu-105, futhi kukhethwa ngokusekelwe kumthamo wamanje wokuthwala womugqa.
3. Amaphedi ne-plating: Amaphedi nezindlela zokuqhuba ze-PCB ngokuvamile zidinga ukuphathwa okukhethekile, okufana nokucwenga ithini, igolide lokucwiliswa, i-electroless nickel plating, njll., ukuze kuthuthukiswe ukusebenza kokushisela nokuqina kwe-PCB.
Ubuchwepheshe bokukhiqiza nokulawula inqubo
1. Ukuchayeka nokuthuthukiswa: Umdwebo wesekethe oklanyelwe udluliselwa ebhodini eline-copper-clad ngokusebenzisa ukuchayeka, futhi iphethini yesekethe ecacile iyakhiwa ngemva kokuthuthukiswa.
2. I-Etching: Ingxenye yefoil yethusi engamboziwe i-photoresist ikhishwa ngokufakwa kwamakhemikhali, futhi isekethe ye-foil yethusi eklanyelwe iyagcinwa.
3. Ukubhoboza: Bamba okuhlukahlukene ngezimbobo kanye nezimbobo ezifakwayo ku-PCB ngokwezidingo zokuklama. Indawo nobubanzi balezi zimbobo kudingeka kucace kakhulu.
4. I-Electroplating: I-Electroplating yenziwa emigodini ebhoboziwe nasemigqeni engaphezulu ukuze kwandiswe ukuguquguquka nokumelana nokugqwala.
5. Isendlalelo sokumelana ne-solder: Faka ungqimba lweyinki yokuphikiswa kwe-solder endaweni ye-PCB ukuze uvimbele ukunamathisela kwe-solder ekusakazeni ezindaweni ezingezona ukuthengiswa ngesikhathi senqubo ye-solder futhi uthuthukise ikhwalithi yokushisela.
6. Ukuphrinta kwesikrini sikasilika: Ulwazi lwezinhlamvu zesikrini sikasilika, okuhlanganisa nezingxenye zezingxenye namalebula, kuphrintwa ebusweni be-PCB ukuze kube lula ukuhlanganiswa nokunakekelwa okulandelayo.
udosi nokulawula izinga
1. Ukuhlolwa kokusebenza kukagesi: Sebenzisa okokusebenza kochwepheshe ukuhlola ukusebenza kukagesi kwe-PCB ukuze uqinisekise ukuthi ulayini ngamunye uxhumeke ngokujwayelekile nokuthi awekho amasekhethi amafushane, amasekhethi avuliwe, njll.
2. Ukuhlola okusebenzayo: Yenza ukuhlola okusebenzayo okusekelwe kuzimo zohlelo lokusebenza zangempela ukuze uqinisekise ukuthi i-PCB ingakwazi ukuhlangabezana nezidingo zedizayini.
3. Ukuhlolwa kwemvelo: Hlola i-PCB ezindaweni ezimbi kakhulu njengezinga lokushisa eliphezulu kanye nomswakama ophezulu ukuze uhlole ukwethembeka kwayo ezindaweni ezinokhahlo.
4. Ukuhlolwa kokubukeka: Ngokuhlola okwenziwa ngesandla noma okuzenzakalelayo (i-AOI), thola ukuthi akhona yini amaphutha endaweni ye-PCB, njengokunqamuka kolayini, ukuchezuka kokuma kwembobo, njll.
Ukukhiqizwa kwesilingo seqoqo elincane kanye nempendulo
1. Ukukhiqizwa kweqoqo elincane: Khiqiza inombolo ethile yama-PCB ngokwezidingo zamakhasimende ukuze kuqhutshekwe nokuhlolwa nokuqinisekiswa.
2. Ukuhlaziywa kwempendulo: Izinkinga zempendulo ezitholakala ngesikhathi sokukhiqizwa kwesilingo seqoqwana elincane kuklamo nethimba elikhiqizayo ukuze kwenziwe ukuthuthukiswa okudingekayo nokuthuthukiswa.
3. Ukuthuthukisa nokulungiswa: Ngokusekelwe kumpendulo yokukhiqiza isilingo, uhlelo lokuklama kanye nenqubo yokukhiqiza kuyalungiswa ukuze kuqinisekiswe ikhwalithi nokwethembeka komkhiqizo.
Isevisi yokuhlola ngokwezifiso yebhodi le-PCB iphrojekthi ehlelekile ehlanganisa i-DFM, ukukhethwa kwezinto ezibonakalayo, inqubo yokukhiqiza, ukuhlola, ukukhiqizwa kwesilingo kanye nesevisi yangemuva kokuthengisa. Akuyona nje inqubo elula yokukhiqiza, kodwa futhi isiqinisekiso esiyindilinga sekhwalithi yomkhiqizo.
Ngokusebenzisa lezi zinsizakalo ngokunengqondo, izinkampani zingathuthukisa ngempumelelo ukusebenza nokuthembeka komkhiqizo, zifinyeze umjikelezo wocwaningo nokuthuthukiswa, futhi zithuthukise ukuncintisana kwemakethe.