Izikhathi ezisebenzayo: Kulinganiselwa ukuthi cishe ama-25% -30% ama-PCB angamanje asebenzisa inqubo ye-OSP, futhi ingxenye ibilokhu ikhuphuka (kungenzeka ukuthi inqubo ye-OSP isidlulile i-tin yokufafaza ne-URANCE Okokuqala). Inqubo ye-OSP ingasetshenziswa kuma-PCB aphansi anobuchwepheshe noma ama-PCB asezingeni eliphakeme, afana nama-TV ahlale ama-TV kanye namabhodi wokupakisha we-high-density ephezulu. Nge-BGA, kukhona abaningiImphefumuloIzicelo. Uma i-PCB ingenazo izidingo zokuxhumeka komhlaba noma imikhawulo yesikhathi sokugcina, inqubo ye-OSP izoba yinqubo ekahle yokwelashwa komhlaba.

Inzuzo enkulu: Inazo zonke izinzuzo zeBhodi yePosi elingenalutho le-Welding, futhi ibhodi eliphelelwe yisikhathi (izinyanga ezintathu) lingabuye liphinde lisebenze, kepha ngokuvamile kanye kuphela.

Okubi: Ukuthinteka ku-acid nasemswakama. Lapho isetshenziselwa ukukhombisa okwesibili kokuthengisa, kudinga ukuqedwa esikhathini esithile sesikhathi. Imvamisa, umphumela wokubonisa kwesibili kokuthengisa uzoba mpofu. Uma isikhathi sokugcina sidlula izinyanga ezintathu, kufanele siphinde sisebenze. Sebenzisa kungakapheli amahora angama-24 ngemuva kokuvula iphakheji. I-OSP iyisendlalelo sokufaka okufakwayo, ngakho-ke iphuzu lokuhlola kumele liphrintwe ngokunamathisela okuthengiswayo ukuze ususe ungqimba lwangempela lwe-OSS uxhumano lokuhlola i-PIN ngokuhlolwa kukagesi.

Indlela: Ngaphezulu kwephasi lethusi elingenalutho, ungqimba lwefilimu ye-organic lukhule ngendlela yamakhemikhali. Le filimu inama-anti-oxidation, ukushaqeka okushisayo, ukumelana komswakama, futhi kusetshenziselwa ukuvikela indawo yethusi ekuguleni (oxidation noma i-vilcanization, njll.) Endaweni ejwayelekile; Ngasikhathi sinye, kufanele kusizwe kalula ekushiseni okuphezulu okulandelayo kwe-welding. I-Flux isuswa ngokushesha ukuze ilungiselelwe;