Izikhathi ezisebenzayo: Kulinganiselwa ukuthi cishe ama-25% -30% ama-PCB asebenzisa inqubo ye-OSP njengamanje, futhi ingxenye ibilokhu ikhuphuka (kungenzeka ukuthi inqubo ye-OSP manje seyedlule ithini lokufutha futhi ibeka kuqala). Inqubo ye-OSP ingasetshenziswa kuma-PCB anobuchwepheshe obuphansi noma ama-PCB obuchwepheshe obuphezulu, njengama-PCB e-TV anohlangothi olulodwa kanye namabhodi okupakisha ama-chip asondelene kakhulu. Ku-BGA, kukhona futhi eziningiOSPizicelo. Uma i-PCB ingenazo izidingo zokusebenza zokuxhuma phezulu noma imikhawulo yesikhathi sokulondoloza, inqubo ye-OSP izoba inqubo yokwelapha engaphezulu efaneleke kakhulu.

Inzuzo enkulu: Inezo zonke izinzuzo zokushisela ibhodi yethusi elingenalutho, futhi ibhodi eliphelelwe yisikhathi (izinyanga ezintathu) lingabuye livuselelwe, kodwa ngokuvamile kanye kuphela.

Ukungalungi: ukungenwa yi-asidi nomswakama. Uma isetshenziselwa ukuthengiswa kwe-reflow yesibili, idinga ukuqedwa phakathi nenkathi ethile yesikhathi. Ngokuvamile, umphumela we-solder ye-reflow yesibili uzoba mubi. Uma isikhathi sokugcina sidlula izinyanga ezintathu, kufanele sivuswe kabusha. Sebenzisa kungakapheli amahora angama-24 ngemuva kokuvula iphakheji. I-OSP iwungqimba oluvikelayo, ngakho-ke iphoyinti lokuhlola kufanele liphrintwe ngokunamathisela kwe-solder ukuze kukhishwe isendlalelo sokuqala se-OSP ukuze kuthinte indawo yokukhonjwa ukuze kuhlolwe ugesi.

Indlela: Endaweni yethusi ehlanzekile engenalutho, ungqimba lwefilimu ephilayo lukhuliswa ngendlela yamakhemikhali. Le filimu ine-anti-oxidation, ukushaqeka okushisayo, ukumelana nomswakama, futhi isetshenziselwa ukuvikela indawo yethusi ekugqwaleni (i-oxidation noma i-vulcanization, njll.) endaweni evamile; ngesikhathi esifanayo, kufanele kusizwe kalula ekushiseni okuphezulu okulandelayo kwe-welding. I-Flux isuswa ngokushesha ukuze ihlanganiswe;